A semiconductor waste abatement system for a semiconductor processing system includes a vacuum pump, an abatement apparatus having an abatement chamber in fluid communication with a source of semiconductor waste gas from the semiconductor processing chamber, and with the abatement chamber configured to ionize the waste gas and to exhaust ionized gas. The abatement system further includes a filter apparatus with a filter chamber, which forms a liquid reservoir. The inlet of the filter apparatus is in fluid communication with the outlet of the abatement chamber and the liquid reservoir, and the outlet of the filter apparatus is in communication with the inlet of the vacuum pump, wherein the filter chamber is under a vacuum, and wherein semiconductor waste gas is ionized in the abatement chamber and then filtered by the filter apparatus prior to input to the vacuum pump.

The present development is a method for capturing and purifying CO.sub.2 from a flue gas stream using a metal aluminate nanowire absorbent and then regenerating the absorbent. After the CO.sub.2 is adsorbed into the absorbent, the adsorbent is regenerated by subjecting the CO.sub.2 saturated adsorbent to a dielectric barrier discharge plasma or to a microwave plasma or to a radio frequency (RF) plasma while ensuring that the external temperature does not exceed 200° C.

A personal air-purifying (PAP) mask includes a fan assembly; a plasma driven catalyst (PDC) assembly including an anti-microbial catalyst, wherein the anti-microbial catalyst is incorporated within a nanofiber layer of the PDC assembly; and a pre-filter, wherein the pre-filter also includes the anti-microbial catalyst incorporated therewith; wherein the PDC assembly is positioned between the fan assembly and the pre-filter, and wherein the fan assembly, the PDC assembly, and the pre-filter are within a main body of the PAP mask.

Disclosed is a system for treating exhaust fluid from semiconductor manufacturing equipment in which cleaning gases decomposed by a plastic apparatus alternately flow towards a front rotor region (a main rotor unit) and a rear rotor region (a subsidiary rotor unit) of a booster pump and then flow towards a dry pump, and thus uniformly react with process byproducts present throughout the whole area in a vacuum pump including the booster pump and the dry pump so as to improve removal efficiency of the process byproducts. Further, the retention time of the cleaning gases decomposed by the plasma apparatus in the vacuum pump is increased by adjusting the pressure in the pump with the rotational speed of a motor, and thus the reaction time of the cleaning gases with the process byproducts is increased, so as to further improve removal efficiency of the process byproducts, such as SiO.sub.2 powder.

Described herein are various embodiments of an oxygen concentrator system. In some embodiments, oxygen concentrator system includes one or more components that improve the useful lifetime of gas separation adsorbents.

An exhaust pipe device according to an embodiment includes a dielectric pipe; a radio-frequency electrode; a ground electrode; and a plasma generation circuit. The radio-frequency electrode is disposed on an outer periphery side of the dielectric pipe and a radio-frequency voltage is applied to the radio-frequency electrode. The ground electrode is disposed on an end portion side of the dielectric pipe such that a distance from the radio-frequency electrode is smaller on an inner side than on an outer side of the dielectric pipe, and a ground potential is applied to the ground electrode. The plasma generation circuit generates plasma inside the dielectric pipe. The exhaust pipe device functions as a part of an exhaust pipe disposed between a film forming chamber and a vacuum pump that exhausts gas inside the film forming chamber.

A system and method for processing industrial waste gas based on a combination of photoelectrocatalysis and a biotrickling filter, including an industrial waste gas simulation generator, a photoelectrocatalytic reactor and at least one biotrickling filter. The industrial waste gas simulation device transports the industrial waste gas to the photoelectrocatalytic reactor through the buffer tank and the mixing tank by a fan. Then the industrial waste gas is degraded under the synergistic catalysis of the substances with high catalytic activity generated by the plasma reactor and the photocatalyst activated by the ultraviolet lamp.

A plasma generating apparatus may include a cathode assembly including a cathode, an anode assembly including an anode having therein a plasma generation space, and one or more magnetic force generators configured to generate a magnetic force. The anode assembly has one end portion in which a gas supply path is provided and the other end portion having an opening, the gas supply path configured to supply a plasma generating gas to the plasma generation space. The gas supply path is configured to generate a vortex of the plasma generating gas in the plasma generation space and said one or more magnetic force generators are arranged such that the magnetic force is generated in a direction opposite to a rotational direction of the vortex of the plasma generating gas.

A triphase organic matter pyrolysis system includes multiple devices cooperating with each other. The feeding device delivers organic matters into the preheating device. The preheated organic matters are delivered into the pyrolysis and carbonization reaction device. The steam generating device produces a saturated steam which is delivered into the water ion generating device which heats the saturated steam into a superheated steam which is dissociated into water ions which are delivered into the pyrolysis and carbonization reaction device. The water ions cut, dissociates and carbonizes the organic matters to form carbon residues and gas-liquid wastes. The heat energy is recycled by the heat recycle device and is delivered into the preheating device. The gas-liquid wastes are processed by the gas-liquid separation device and the gas purifying device to form gas and liquid that are harmless.

A process discharge gas polluted material removal device with a regenerating means of a polluted oxidation catalyst includes: an oxidation catalyst tower connected to a pipe circulating a process discharge gas including a combustible material, an organic material, an inorganic material, and nitrogen oxide and having a first temperature and having an oxidation catalyst embedded therein, the oxidation catalyst oxidizing and removing the combustible material; and a plasma reactor connected to the oxidation catalyst tower in front of the oxidation catalyst, generating a synthesis gas including hydrogen and having a high temperature of 300° C. or more by a plasma reaction, and supplying the synthesis gas including the hydrogen to the oxidation catalyst to regenerate the oxidation catalyst poisoned by the organic material and the inorganic material.