A method for controlling a recirculation pump assembly is disclosed. The method includes receiving a process-dependent characteristic and determining a recirculation flow rate of adhesive that flows to the recirculation pump assembly based on the process-dependent characteristic. The method further includes determining a recirculation pump speed of the recirculation pump assembly for pumping the adhesive to a supply channel using the recirculation flow rate, and adjusting an operating speed of the recirculation pump assembly to match the recirculation pump speed. A system and storage device for performing the above method are also disclosed.

A method for controlling a recirculation pump assembly is disclosed. The method includes receiving a process-dependent characteristic and determining a recirculation flow rate of adhesive that flows to the recirculation pump assembly based on the process-dependent characteristic. The method further includes determining a recirculation pump speed of the recirculation pump assembly for pumping the adhesive to a supply channel using the recirculation flow rate, and adjusting an operating speed of the recirculation pump assembly to match the recirculation pump speed. A system and storage device for performing the above method are also disclosed.

The present disclosure describes a method and system for controlling dispensing of adhesive from an applicator. The method includes pumping adhesive from a plurality of pump assemblies to a plurality of dispensing modules and measuring current draw from each of the plurality of pump assemblies. The method also includes determining an adjustment to an operating speed of each of the plurality of pump assemblies individually based on their respective current draws and adjusting the operating speed of each of the plurality of pump assemblies individually.

An applicator for dispensing multiple adhesives on a substrate is disclosed. The applicator includes a manifold that includes a first dispensing module and a second dispensing module. The first dispensing module has a first inlet and a first nozzle. The first inlet receives a first adhesive and the first nozzle applies the first adhesive to the substrate. The second dispensing module is adjacent the first dispensing module and has a second inlet and a second nozzle. The second inlet receives a second adhesive that is different from the first adhesive. The second nozzle applies the second adhesive to the substrate.

According to the present invention, there is provided a foaming apparatus that discharges a foamable material obtained by mixing gas into a viscous material of a resin and dispersing bubbles in a liquid of the viscous material. The foaming apparatus includes: a pipe; a material supply unit; a gas supply unit; a first gear pump; a second gear pump; a third gear pump; a mixer; a discharge unit; and a control unit.

According to the present invention, there is provided a foaming apparatus that discharges a foamable material obtained by mixing gas into a viscous material of a resin and dispersing bubbles in a liquid of the viscous material. The foaming apparatus includes: a pipe; a material supply unit; a gas supply unit; a first gear pump; a second gear pump; a third gear pump; a mixer; a discharge unit; and a control unit.

A dispensing system for dispensing a hot melt adhesive foam onto a substrate is described. The dispensing system comprises a pump having a first input to receive a hot melt adhesive and a second input to receive a gas, where the pump mixes the hot melt adhesive and the gas to produce a solution. The dispensing system also includes a temperature sensor to detect a temperature of the solution, a dispenser to receive the solution from the pump and dispense the solution, and a controller. The controller instructs the pump to operate at a first speed, receives the temperature of the solution, and instructs the pump to operate at a second speed that is different than the first speed in response to the signal.

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

The present disclosure describes a method and system for controlling dispensing of adhesive from an applicator. The method includes pumping adhesive from a plurality of pump assemblies to a plurality of dispensing modules and measuring current draw from each of the plurality of pump assemblies. The method also includes determining an adjustment to an operating speed of each of the plurality of pump assemblies individually based on their respective current draws and adjusting the operating speed of each of the plurality of pump assemblies individually.

An applicator for dispensing adhesive is disclosed. The applicator includes a manifold, at least one dispensing module coupled to the manifold, a supply channel configured to contain at least a portion of the adhesive, a recirculation channel configured to contain at least a portion of the adhesive, and a recirculation pump assembly connected to the manifold. The recirculation pump assembly includes an inlet in fluid communication with the recirculation channel, an outlet in fluid communication with the supply channel, a gear assembly, and a drive motor coupled to the gear assembly and operable to pump the adhesive, where the drive motor is configured to operate at an adjustable number of revolutions per minute (RPM). The recirculation pump assembly can be configured to move at least a portion of the adhesive from the recirculation channel to the supply channel, such that a first pressure of the adhesive in the recirculation channel is substantially equal to a second pressure of the adhesive in the supply channel.