Patent classifications
B05B5/082
Method for Impregnating a Garment and Apparatus for Impregnating a Garment
The invention relates to a method and an apparatus for impregnating an item, preferably a garment such as a coat, a jacket, a shirt or a pair of trousers, optionally other fabric-like textile such as tents, tarpaulins, hoods for vehicles or vessels. The apparatus comprises an inner support for supporting the garment or other fabric-like textile. The inner support has an electrically conducting surface and an electrically conducting outer cover for covering the garment or other fabric-like textile when supported by the inner support. The apparatus also comprises means for applying an electro static field between the electrically conducting surface of the inner support and the electrically conducting outer cover, and nozzles for providing an impregnating agent between the electrically conducting surface of the inner support and the electrically conducting outer cover, from the outer cover towards the garment or other fabric-like textile.
COATING FRAME AND METHODS OF USING THE SAME
A coating frame, a coating system, and methods of coating a component using one or more coating frames are disclosed. The coating frame includes a frame member and at least one bracket coupled to the frame member. The bracket includes at least one hanger attachment point extending into a hollow interior of the at least one bracket. The at least one bracket isolates the at least one hanger attachment point from a coating material when the coating frame is used in a coating process. The method includes suspending a component from the coating frame, conveying the coating frame and the component to a coating applicator, and applying a coating material to the coating frame and the component while isolating the at least one hanger attachment point from the coating material via an air pocket formed within the at least one bracket.
STAGE STRUCTURE FOR SEMICONDUCTOR FABRICATION PROCESS, SYSTEM OF PICKING UP SEMICONDUCTOR CHIP, AND METHOD OF CONTROLLING TILTING ANGLE OF PICKUP HEAD
A stage structure for a semiconductor fabrication process is disclosed. The stage structure may include a stage and a pickup head tilting control device. The pickup head tilting control device may include a correction plate, a tilting driving device which is coupled to the correction plate and is configured to adjust an inclination angle of the correction plate, and a control circuitry configured to control the tilting driving device. The correction plate may include a correction surface which is selectively in contact with a suction surface of a pickup head.
PATTERN FORMING APPARATUS
Provided is a pattern forming apparatus which may form a pattern on a substrate with high precision by using a material including an organic material, the pattern forming apparatus including: a capillary facing a grounded substrate and capable of storing a solution including a sample; a power source applying a voltage to the capillary; a stencil mask disposed between the capillary and the substrate, and including an opening through which the sample passes; and a cross-direction actuator moving the stencil mask in a cross direction crossing a direction in which the sample passes.
System for nano-coating a substrate
The system for nano-coating a substrate (10) includes a housing (12) having an upper, dispensing chamber (18) in which electrospraying or electrospinning can occur, a lower storage chamber, and a wall (16) that separates the dispensing chamber (18) from the storage chamber. The dispensing chamber (18) includes first and second panels (24a), (24b) and a moveable collector (20) between the first and second panels (24a), (24b). Solution dispensing nozzles (26) are disposed in apertures (45) in the panels (24a), (24b), and extend from a front surface of each panel (24a), (24b). A plurality of solution supply tubes (54) extend from a rear surface of each panel (24a), (24b) to a pump (34) in the lower housing. Inner panel channels (52) are defined within each panel (24a), (24b) between the tubes (54) and the nozzles (26).
System for application of powder coatings to electrically non-conductive elements
A method and system for powder coating non electrically conductive elements, preferably brake pads. A pre-treatment station is upstream of an electrostatic powder coating deposition station and a baking station for melting and polymerizing the powder coating in order to form a coating layer on a surface to be coated. The pre-treatment station causes the elements to be coated to conduct electrically by uniformly wetting said elements by means of creating poorly mineralized water covalent bonds on at least one surface to be coated, in an amount aimed at producing a measurable weight increase in the non electrically conductive elements, which then causes them to conduct electrically. The water adsorbed and/or deposited is subsequently eliminated within the baking station.
GAS NOZZLE, MANUFACTURING METHOD OF GAS NOZZLE, AND PLASMA TREATMENT DEVICE
A gas nozzle according to the present disclosure includes a supply hole having a tubular shape and configured to guide a gas and an injection hole connecting to the supply hole. The gas nozzle configured to inject the gas from the injection hole is made from ceramics or single crystal including an oxide, a fluoride, or an oxyfluoride of a rare earth element or an yttrium aluminum composite oxide as a primary component. An arithmetic mean roughness Ra of an inner circumferential surface forming the supply hole is smaller on an outflow side than on an inflow side of the gas.
Method and apparatus for dispersing oil
An electrostatic oiling system for use with single blanks in batch systems having an open spray chamber without the need for a negative vacuum chamber. Further, the provided electrostatic oiling system may utilize induction beams and a charge wall that allows for utilization of a smaller vacuum system. Further, the provided electrostatic oiling system may provide variable blank coverage without the need for metered pumps.
SUBSTRATE PROCESSING SYSTEM FOR PROCESSING SUBSTRATES
The disclosure relates to a semiconductor processing system for processing semiconductor substrates and provided with a housing formed by a wall. The system may further comprise a processing module and a cassette module, the cassette module located adjacent the processing module. An electronics module may be provided with a support for mounting electronic components, whereby the electronics module is located behind a door in the wall of the system to create access for maintenance. The electronic components have a straight mounting basis for mounting of the electronics components whereby the mounting basis is mounted in the system under an angle between 10 and 80 degrees with respect to the door when the door is closed.
Coating Apparatus
A transfer and coating apparatus transfers a component from a conveyor to a coating station for application of a coating. The transfer apparatus includes a mast that can move about orthogonal axes in a horizontal plane and a mast having a carriage that can move vertically. The carriage includes a hook that swings about a horizontal axis relative to the mast for movement of the component in the horizontal direction. A sway bar extends between the hook and component to inhibit movement about a horizontal axis. The component is delivered to an upper compartment of a coating apparatus where it can be lowered in to a lower compartment containing coating material. Excess coating material is removed by an array of nozzles in the upper compartment as the component is raised from the coating material.