Patent classifications
B05B12/04
CENTER PIVOT IRRIGATION SYSTEM WITH PLACEMENT CONTROL PROVIDING ZONES WITH VARIABLE DEPTHS OF APPLICATION
A center pivot irrigation system is described that includes a controller that makes use of a particular flow rate of input water to deliver differing or variable depths of irrigation to two or more user-defined areas under a pivot irrigator. The controller operates to pulse control valves for the nozzles/sprinkler heads on and off as the sprinkler arm rotates. The valve pattern along the span of the sprinkler arm is chosen during each operating cycle such that the total water flow through all the open valves matches the flow rate of the input or supply water to the pivot irrigator. To ensure the variable application depth, the speed may be changed during valve duty cycles. A farmer may define an irrigation plan that defines the variable rate irrigation (VRI) zones and also defines exclusion or no spray zones in which no irrigation should occur.
CENTER PIVOT IRRIGATION SYSTEM WITH PLACEMENT CONTROL PROVIDING ZONES WITH VARIABLE DEPTHS OF APPLICATION
A center pivot irrigation system is described that includes a controller that makes use of a particular flow rate of input water to deliver differing or variable depths of irrigation to two or more user-defined areas under a pivot irrigator. The controller operates to pulse control valves for the nozzles/sprinkler heads on and off as the sprinkler arm rotates. The valve pattern along the span of the sprinkler arm is chosen during each operating cycle such that the total water flow through all the open valves matches the flow rate of the input or supply water to the pivot irrigator. To ensure the variable application depth, the speed may be changed during valve duty cycles. A farmer may define an irrigation plan that defines the variable rate irrigation (VRI) zones and also defines exclusion or no spray zones in which no irrigation should occur.
Machine Tool Chip Removal
A machine tool chip removal device including a coupling interface to couple with a rotatable spindle of a machine tool to facilitate rotation of the machine tool chip removal device about an axis at a rotational speed. The chip removal device can also include a main fluid channel with an opening to receive pressurized fluid from the machine tool. The chip removal device can further include a first fluid delivery channel and a second fluid delivery channel to direct fluid in different directions. Each fluid delivery channel can be in fluid communication with the main fluid channel. In addition, the chip removal device can include one or more valves associated with the first and second fluid delivery channels to selectively allow fluid passage from the main fluid channel to the fluid delivery channels. The one or more valves can be actuated by varying fluid pressure and/or rotational speed.
Machine Tool Chip Removal
A machine tool chip removal device including a coupling interface to couple with a rotatable spindle of a machine tool to facilitate rotation of the machine tool chip removal device about an axis at a rotational speed. The chip removal device can also include a main fluid channel with an opening to receive pressurized fluid from the machine tool. The chip removal device can further include a first fluid delivery channel and a second fluid delivery channel to direct fluid in different directions. Each fluid delivery channel can be in fluid communication with the main fluid channel. In addition, the chip removal device can include one or more valves associated with the first and second fluid delivery channels to selectively allow fluid passage from the main fluid channel to the fluid delivery channels. The one or more valves can be actuated by varying fluid pressure and/or rotational speed.
SECONDARY COOLING APPARATUS IN A MACHINE FOR CONTINUOUS CASTING OF METAL PRODUCTS
Secondary cooling apparatus in a machine for continuous casting of metal products, such that each metal product is cast, contained and guided along an axis of movement. The secondary cooling apparatus includes a plurality of cooling assemblies disposed in sequence one to the other along the continuous casting machine. Each assembly includes a plurality of cooling units each provided with one or more nozzles disposed along the axis of movement. The cooling units of each assembly are adjacent to each other to cover a width at least equal to the maximum width of the metal product which can be cast in the continuous casting machine.
METHOD TO CONTROL A SECONDARY COOLING APPARATUS IN A MACHINE FOR CONTINUOUS CASTING OF METAL PRODUCTS AND SECONDARY COOLING APPARATUS FOR A CONTINUOUS CASTING MACHINE
Method to control a secondary cooling apparatus in a machine for continuous casting of metal products. The secondary cooling apparatus includes a plurality of cooling units equipped with nozzles, each nozzle is provided with delivery orifices from which a refrigerant fluid is delivered, on each occasion according to the punctual cooling needs, toward a metal product.
METHOD AND APPARATUS FOR DELIVERING FLUID DROPLETS ONTO AN OPEN AND STATIONARY TRAY
The present invention relates to a method and apparatus for delivering droplets of fluids onto an open tray containing poultry, the tray being stationary. According to the invention, the method comprises the following steps: (a) a movable arm is moved over the tray in translation in a first direction, said arm supporting a first set of dispensing nozzles and a second set of dispensing nozzles, said nozzles of each set being arranged to cover the entire dimension of the tray in a second direction perpendicular to the first direction; (b) initially, droplets of at least one first fluid are dispensed by spraying using the first set of dispensing nozzles; (c) and then at least one second fluid, distinct from said at least one first fluid to be sprayed, is dispensed by ejecting individual drops by means of the second set of dispensing nozzles.
CHEMICAL SOLUTION SPRAYING METHOD
A chemical solution spraying method for spraying a chemical solution onto canvas K1 has a loop shape in a side view while reciprocating nozzle device S along rail L extending in a width direction of canvas K1 with respect to canvas K1, in which time period Tc during which canvas K1 is in contact with wet paper X is 0.03 seconds or more, time period Tn required for nozzle device S to one-way move is 0.2 to 20 minutes, traveling speed Vp of canvas K1 is 500 m/min or more, length K of canvas K1 is 20 to 80 m, a number of times of contact N of any point on a surface of canvas K1 with wet paper X during time period Tn, time period Tn, traveling speed Vp, and length K satisfy a relationship of N=(Tn.Math.Vp)/K, under predetermined conditions.
CHEMICAL SOLUTION SPRAYING METHOD
A chemical solution spraying method for spraying a chemical solution onto canvas K1 has a loop shape in a side view while reciprocating nozzle device S along rail L extending in a width direction of canvas K1 with respect to canvas K1, in which time period Tc during which canvas K1 is in contact with wet paper X is 0.03 seconds or more, time period Tn required for nozzle device S to one-way move is 0.2 to 20 minutes, traveling speed Vp of canvas K1 is 500 m/min or more, length K of canvas K1 is 20 to 80 m, a number of times of contact N of any point on a surface of canvas K1 with wet paper X during time period Tn, time period Tn, traveling speed Vp, and length K satisfy a relationship of N=(Tn.Math.Vp)/K, under predetermined conditions.
Methods and apparatus for conductive element deposition and formation
A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets, and methods of, and apparatus for, forming the same. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a complex (3D) conductive trace is formed using two or more different print technologies via creation of different domains within the conductive trace pattern.