B05B12/084

METHOD AND APPARATUS FOR AUTOMATED DE-ICING OF AIRCRAFT
20210380280 · 2021-12-09 ·

A system for automated de-icing or contamination removal of an aircraft. The system includes a mobile platform, the mobile platform including a set of wheels and a swerve drive for controlling movement of the set of wheels along with a contamination removal apparatus mounted to the mobile platform for delivering contamination removal treatment to the aircraft. The system also includes a processor for receiving instructions associated with the contamination removal treatment from an external party and for controlling the mobile platform and contamination apparatus to deliver the contamination removal treatment.

IN SITU LINER PRODUCTION SYSTEM AND METHOD
20220203399 · 2022-06-30 ·

A system for the in situ production of a liner suitable to shield active surfaces of apparatus for the processing of liquids and/or solids from coming into contact with, and being fouled by, the processed materials, comprises: 1) a spray head, adapted to spray a layer of curable polymeric material onto a surface; 2) circuitry adapted to direct the movement of said spray head according to data pertaining to the surface to be sprayed; and 3) curing apparatus, suitable to cure the layer of material sprayed onto said surface, thereby to produce a shielding liner in situ.

SYSTEM AND METHOD FOR QUALITY INSPECTION ON OVERALL INKJET PRINTING MANUFACTURING PROCESS FOR DISPLAY DEVICE

The disclosure discloses a system for quality inspection in the entire process of inkjet printing manufacturing of display devices, which includes a substrate inspection module, a nozzle inspection module, an ink droplet inspection module, a coating thickness inspection module and a control module. Through design and matching of these modules, it is possible to realize a series of operations such as substrate inspection, nozzle inspection, flying ink droplet inspection, liquid coating inspection and cured coating inspection. The invention also discloses a corresponding quality inspection method for the entire inkjet printing manufacturing process for display devices. The invention effectively compensates for the shortcomings of current technology which only inspect a single stage without taking the whole process into consideration, thereby realizing high-precision quality inspection of each stage in the inkjet printing manufacturing process of display devices, and significantly improving the quality and yield of the display device product.

Dispensers with sensors to detect surfaces and surface characteristics

A sprayer that senses the presence or character of a surface to be sprayed includes one or more sensors configured to detect a presence or character of a surface to be sprayed; and a dispenser assembly including one or more components configured to modify at least one spray characteristic of a formulation based on an input from at least one of the one or more sensors indicative of the presence or character of the surface to be sprayed.

APPLICATION SYSTEM, CONTROL DEVICE, CONTROL METHOD, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM STORING A PROGRAM
20220193710 · 2022-06-23 ·

An application system is provided, which includes an application device configured to discharge a coating material from a discharge circuit; an articulated robot configured to change a position and an orientation of the discharge circuit such that the coating material from the discharge circuit is applied to a workpiece; and a control device configured to control the application device and the articulated robot, in which the control device includes a target value calculation circuit and an operation control circuit.

CONFORMAL COATING PROCESS WITH THICKNESS CONTROL
20220168776 · 2022-06-02 ·

A method for controlling a dispensing system is provided, including the steps of dispensing, by a dispensing device, a coating material onto a substrate according to a first dispensing operation, inspecting, by an inspection device integrated with the dispensing device, the coating material applied to the first substrate, and altering the first dispensing operation based on the inspecting so that the coating material is dispensed onto a subsequent substrate according to a second dispensing operation. An associated coating machine is also provided.

Methods, Apparatuses, and Systems for Smart Delivery of Coating Material
20230271210 · 2023-08-31 ·

Methods, systems, and apparatuses are disclosed for controlling the release of a coating material to a substrate surface, with the system and apparatuses emulating an experienced human artisan by sensing condition parameters and substrate parameters and comparing parameters to stored parameter values and value ranges.

Automatic application of finish to sports ball
11738241 · 2023-08-29 ·

The present disclosure involves systems for applying finishing treatment to balls. The system includes an arm that transports at least one ball through a plurality of stations. A first station includes a first actuator, which permits introduction of a ball into the arm. A second station includes a buffer, which buffs the surface of the ball and rotates the ball in place relative to the arm, a spray nozzle configured to apply treatment to the ball, and a camera configured to capture images of the ball. A third station includes an inspection camera that captures inspection images of the ball and a rotating plate configured to rotate the ball in place relative to the arm. A fourth station includes a second actuator, which ejects the ball from the arm.

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD OF CONTROLLING DISCHARGE ANGLE AND DISCHARGE POSITION OF PROCESSING LIQUID SUPPLIED TO PERIPHERAL PORTION OF SUBSTRATE
20220122853 · 2022-04-21 ·

A substrate processing apparatus 1 is configured to supply a processing liquid to a peripheral portion of a wafer W being rotated. The substrate processing apparatus 1 includes a rotating/holding unit 21 configured to rotate and hold the wafer W; a processing liquid discharging unit 73 configured to discharge the processing liquid toward the peripheral portion of the wafer W held by the rotating/holding unit 21; a variation acquiring unit configured to acquire information upon a variation amount of a deformation of the peripheral portion of the wafer W; and a discharge controller 7 configured to control a discharge angle and a discharge position of the processing liquid from the processing liquid discharging unit 73 onto the peripheral portion based on the information upon the variation amount of the deformation of the peripheral portion acquired by the variation acquiring unit.

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

A substrate processing method includes: a holding step of carrying a substrate into an inside of a chamber and holding said substrate; a supply step of supplying a fluid to the substrate on the inside of the chamber; an imaging step of sequentially imaging the inside of the chamber by a camera to acquire image data; a condition setting step of specifying a monitoring target and changing an image condition based on the monitoring target; and a monitoring step of performing a monitoring process on the monitoring target based on the image data having the image condition corresponding to the monitoring target.