Disclosed is an apparatus for treating a substrate. The apparatus includes a substrate support unit that supports the substrate, a nozzle unit that dispenses a treatment liquid onto the substrate supported on the substrate support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle unit. The liquid supply unit includes a main supply line that is connected to the nozzle unit and that supplies the treatment liquid to the nozzle unit, wherein the treatment liquid is prepared by mixing a chemical with DIW at a first temperature and DIW at a second temperature higher than the first temperature, and temperature of the treatment liquid is adjusted by regulating a flow rate of the DIW at the first temperature and a flow rate of the DIW at the second temperature without a separate heater.

The disclosed technology includes a hose nozzle assembly with apertures sized to facilitate heating groundwater based on the expected temperature of the groundwater. The hose nozzle assembly can have a handheld enclosure having a handle portion connected to a body portion, a heating chamber having a heating element configured to heat a fluid, and a spray nozzle. The spray nozzle can include a first aperture configured to provide a first spray pattern at a first flow rate corresponding to a first change in temperature of fluid flowing through the heating chamber and a second aperture configured to provide a second spray pattern at a second flow rate corresponding to a second change in temperature of fluid flowing through the heating chamber. The second flow rate can be less than the first flow rate and the second change in temperature can be greater than the first change in temperature.

The disclosed technology includes a hose nozzle assembly with apertures sized to facilitate heating groundwater based on the expected temperature of the groundwater. The hose nozzle assembly can have a handheld enclosure having a handle portion connected to a body portion, a heating chamber having a heating element configured to heat a fluid, and a spray nozzle. The spray nozzle can include a first aperture configured to provide a first spray pattern at a first flow rate corresponding to a first change in temperature of fluid flowing through the heating chamber and a second aperture configured to provide a second spray pattern at a second flow rate corresponding to a second change in temperature of fluid flowing through the heating chamber. The second flow rate can be less than the first flow rate and the second change in temperature can be greater than the first change in temperature.

A dispensing system for dispensing hot melt adhesive foam onto a substrate is described. The dispensing system comprises a pump having a first input to receive a hot melt adhesive and a second input to receive a gas, where the pump mixes the hot melt adhesive and the gas to produce a solution and pump the solution at a volumetric flow rate. The dispensing system also includes a valve to control an amount of the gas provided to the pump from the second input, a flow meter to measure the volumetric flow rate of the solution pumped by the pump, and a dispenser to receive the solution from the pump and dispense the solution to create the hot melt adhesive foam.

A dispensing system for dispensing hot melt adhesive foam onto a substrate is described. The dispensing system comprises a pump having a first input to receive a hot melt adhesive and a second input to receive a gas, where the pump mixes the hot melt adhesive and the gas to produce a solution and pump the solution at a volumetric flow rate. The dispensing system also includes a valve to control an amount of the gas provided to the pump from the second input, a flow meter to measure the volumetric flow rate of the solution pumped by the pump, and a dispenser to receive the solution from the pump and dispense the solution to create the hot melt adhesive foam.

A dispensing system for dispensing a hot melt adhesive foam onto a substrate is described. The dispensing system comprises a pump having a first input to receive a hot melt adhesive and a second input to receive a gas, where the pump mixes the hot melt adhesive and the gas to produce a solution. The dispensing system also includes a temperature sensor to detect a temperature of the solution, a dispenser to receive the solution from the pump and dispense the solution, and a controller. The controller instructs the pump to operate at a first speed, receives the temperature of the solution, and instructs the pump to operate at a second speed that is different than the first speed in response to the signal.

A dispensing system for dispensing a hot melt adhesive foam onto a substrate is described. The dispensing system comprises a pump having a first input to receive a hot melt adhesive and a second input to receive a gas, where the pump mixes the hot melt adhesive and the gas to produce a solution. The dispensing system also includes a temperature sensor to detect a temperature of the solution, a dispenser to receive the solution from the pump and dispense the solution, and a controller. The controller instructs the pump to operate at a first speed, receives the temperature of the solution, and instructs the pump to operate at a second speed that is different than the first speed in response to the signal.

The disclosure relates to an application device for applying an application medium onto a component, preferably for application of a coating onto a motor vehicle body component. The application device includes a print head for preferably serial and/or permanent application of the application medium, wherein the print head has: a nozzle plate, at least one nozzle in the nozzle plate in order to discharge the application medium, at least one valve element, which is movable relative to the nozzle plate, for control of the application medium discharge through the at least one nozzle, wherein the at least one movable valve element closes the at least one nozzle in a closing position and releases it in an opening position, and at least one drive for moving the at least one valve element. The application device is characterised in particular in that it includes at least one temperature control apparatus for reducing heating of the at least one drive during application of the application medium.

The disclosure relates to an application device for applying an application medium onto a component, preferably for application of a coating onto a motor vehicle body component. The application device includes a print head for preferably serial and/or permanent application of the application medium, wherein the print head has: a nozzle plate, at least one nozzle in the nozzle plate in order to discharge the application medium, at least one valve element, which is movable relative to the nozzle plate, for control of the application medium discharge through the at least one nozzle, wherein the at least one movable valve element closes the at least one nozzle in a closing position and releases it in an opening position, and at least one drive for moving the at least one valve element. The application device is characterised in particular in that it includes at least one temperature control apparatus for reducing heating of the at least one drive during application of the application medium.

A control system including a discharge control circuit configured to control an application device such that a coating is discharged from a discharge circuit; a robot control circuit configured to cause an articulated robot to change a position and an orientation of the discharge circuit such that the coating is applied to a workpiece; an application abnormality detection circuit configured to detect an abnormality in an application state of the coating on the basis of at least one of a state of the device or of the robot; an application position calculation circuit configured to calculate an application position of the coating; and an abnormality notification circuit configured to send a notification of a site of an abnormality in the application state on the workpiece on the basis of a detection result of the abnormality in the application state and a calculation result of the application position.