A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

A mask assembly includes: a frame; an open mask disposed on the frame, and defining a first deposition opening, a second deposition opening spaced apart from the first deposition opening in a first direction, and a first dummy opening located between the first deposition opening and the second deposition opening; and a shield member including a first shield part overlapping the first dummy opening in a plan view.

A shadow mask having two or more levels of openings enables selective step coverage of micro-fabricated structures within a micro-optical bench device. The shadow mask includes a first opening within a top surface of the shadow mask and a second opening within the bottom surface of the shadow mask. The second opening is aligned with the first opening and has a second width less than a first width of the first opening. An overlap between the first opening and the second opening forms a hole within the shadow mask through which selective coating of micro-fabricated structures within the micro-optical bench device may occur.

A shadow mask having two or more levels of openings enables selective step coverage of micro-fabricated structures within a micro-optical bench device. The shadow mask includes a first opening within a top surface of the shadow mask and a second opening within the bottom surface of the shadow mask. The second opening is aligned with the first opening and has a second width less than a first width of the first opening. An overlap between the first opening and the second opening forms a hole within the shadow mask through which selective coating of micro-fabricated structures within the micro-optical bench device may occur.

Even in a case where a spray nozzle of a solid phase particle deposition device is in motion, flying solid phase particles are efficiently collected. An attachment (1) includes: an engagement part (2) to be engaged with a spray nozzle (130) of a cold spray device (1); and an opening part (3) connected to the engagement part (2) and having at least one opening (3a, 3b) to be connected to a collection section (20) that is configured to collect solid phase particles (30b) which are sprayed through the spray nozzle (130) onto a base material (170) and are not involved in formation of a film on the base material (170).

A masking device for placement over an end of a work piece includes a head portion, a collar portion, and at least one pull tab. The head portion includes a closed end and an interior cavity defined in the head portion. The collar portion is coupled to the head portion opposite the closed end of the head portion. The collar portion includes a radially inner surface defining an opening. The opening is in fluid communication with the interior cavity of the head portion. The opening is narrower than the interior cavity of the head portion. The collar portion further includes a radially outer surface. The at least one pull tab is coupled to the radially outer surface of the collar portion.

A system is provided for selectively applying a coating to portions of an article having at least one area that is not be coated. The system comprises a jig, with a platform for supporting article. The jig also has a bar that is moveable with respect to the platform and at least one masking element that is coupled to the bar and is configured to cover the at least one surface of the article that is not to be coated. The jig also has a first connection mechanism that defines a first mating element. The system also comprises at least one carrier that comprises a base and at least one second connection mechanism that defines a second mating element. The second mating element is mateable with the first mating element such that the jig is releasably coupled to the carrier upon mating the first and second mating elements.

A system is provided for selectively applying a coating to portions of an article having at least one area that is not be coated. The system comprises a jig, with a platform for supporting article. The jig also has a bar that is moveable with respect to the platform and at least one masking element that is coupled to the bar and is configured to cover the at least one surface of the article that is not to be coated. The jig also has a first connection mechanism that defines a first mating element. The system also comprises at least one carrier that comprises a base and at least one second connection mechanism that defines a second mating element. The second mating element is mateable with the first mating element such that the jig is releasably coupled to the carrier upon mating the first and second mating elements.

An opto-electronic device having a plurality of layers, comprising a nucleation-inhibiting coating (NIC) disposed on a first layer surface in a first portion of a lateral aspect thereof. In the first portion, the device comprises a first electrode, a second electrode and a semiconducting layer between them. The second electrode lies between the NIC and the semiconducting layer in the first portion. In the second portion, a conductive coating is disposed on a second layer surface. The first portion is substantially devoid of the conductive coating. The conductive coating is electrically coupled to the second electrode and to a third electrode in a sheltered region of a partition in the device.