An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

A coating method for coating parts in a dip-spin process is provided. The parts to be coated are dipped into a coating liquid and then centrifuged in at least one planetary basket arrangement in a planetary centrifuge. The planetary centrifuge includes a main rotor rotating about a main rotor axis of rotation and at least one planetary basket arrangement rotates about its planetary axis of rotation. Also, the planetary axis of rotation is arranged eccentrically on the main rotor. The at least one planetary basket arrangement can include a plurality of planetary baskets rotatably arranged about the planetary rotation axis of the at least one planetary basket arrangement and the planetary basket arrangement is rotated during a centrifuging operation.

A coating method for coating parts in a dip-spin process is provided. The parts to be coated are dipped into a coating liquid and then centrifuged in at least one planetary basket arrangement in a planetary centrifuge. The planetary centrifuge includes a main rotor rotating about a main rotor axis of rotation and at least one planetary basket arrangement rotates about its planetary axis of rotation. Also, the planetary axis of rotation is arranged eccentrically on the main rotor. The at least one planetary basket arrangement can include a plurality of planetary baskets rotatably arranged about the planetary rotation axis of the at least one planetary basket arrangement and the planetary basket arrangement is rotated during a centrifuging operation.

An apparatus for applying a liquid adhesive according to an embodiment of the present invention includes: a side part including a support surface configured to support one surface of an upright secondary battery; and a lower part including an adhesion space configured to accommodate the liquid adhesive therein and configured to accommodate insertion of a sealing part disposed at the one surface of the upright secondary battery, the lower part having a passage extending from an outer periphery of the lower part to the adhesion space, the passage configured to permit the liquid adhesive to flow from the outer periphery to the adhesion space, wherein the lower part is disposed below the side part.

An apparatus for applying a liquid adhesive according to an embodiment of the present invention includes: a side part including a support surface configured to support one surface of an upright secondary battery; and a lower part including an adhesion space configured to accommodate the liquid adhesive therein and configured to accommodate insertion of a sealing part disposed at the one surface of the upright secondary battery, the lower part having a passage extending from an outer periphery of the lower part to the adhesion space, the passage configured to permit the liquid adhesive to flow from the outer periphery to the adhesion space, wherein the lower part is disposed below the side part.

The present disclosure provides a device and method for manufacturing a coated welding rod. The device for manufacturing a coated welding rod includes a grabbing device, a heating device, and a flux storage device. The heating device is configured to heat a welding rod in the grabbing device. A flux in granular form is stored in the flux storage device, the grabbing device is configured to transport the heated welding rod into the flux storage device, and the heated welding rod is configured to heat the flux surrounding the welding rod into a viscous glassy state so that the flux in the viscous glassy state adheres to the surface of the welding rod. The heated welding rod enables the granular flux to be formed into a viscous glassy state so that the flux can be adhered directly to the surface of the welding rod.

The present disclosure provides a device and method for manufacturing a coated welding rod. The device for manufacturing a coated welding rod includes a grabbing device, a heating device, and a flux storage device. The heating device is configured to heat a welding rod in the grabbing device. A flux in granular form is stored in the flux storage device, the grabbing device is configured to transport the heated welding rod into the flux storage device, and the heated welding rod is configured to heat the flux surrounding the welding rod into a viscous glassy state so that the flux in the viscous glassy state adheres to the surface of the welding rod. The heated welding rod enables the granular flux to be formed into a viscous glassy state so that the flux can be adhered directly to the surface of the welding rod.

A vacuum impregnation system and processes that subject a part to a vacuum, immerse the part in a polymer impregnating liquid, and apply positive pressure to the part to introduce the polymer impregnating liquid into part porosities, releasing the pressure to atmospheric pressure and solidifying the polymer impregnating liquid, preferably without an active polymerization step.

A metal plating apparatus for plating metal with zinc is provided with a rotating device and a plurality of stirring devices. The rotating device has a driving assembly and a rotating assembly. The driving assembly has a driving gear. The rotating assembly is connected with and controlled by the driving assembly. The rotating assembly has a sustaining pillar. A rotating seat is mounted on the sustaining pillar and engaged with the driving gear. The stirring devices is mounted on the rotating seat radially and spaced from each other. The metal plating apparatus improves productivity through an automatic process which shifts locations of the stirring devices by the rotating device and plates metal with a cooperation of peripheral supporting apparatus, and improves working efficiency through decreasing occupied space and the number of operating personnel.