A system for treating wood (30), comprising: —a treatment vessel (14) configured to receive at least one wood stack (4) for treatment, and —a stack holding system (2) for holding a wood stack (4), the stack holding system (2) comprising: —a frame (6), configured to support the wood stack (4); —a first element (8), connected to the frame (6) near an upper side of said frame (6), configured to exert a first, downward force on the wood stack (4); and —a second element (10), connected to the frame (6) near a lower side of said frame (6), configured to exert a second force on the wood stack (4) in a direction opposite said first force. The invention also comprises a method for treating wood, using a system for treating wood according to the invention.

A dipping apparatus is provided having a clamp pad and a support pad configured to clamp the external and internal surfaces of the base of a ceramic object to assist in dipping the ceramic object into a liquid glaze to achieve a blemish-free coating.

A dipping apparatus is provided having a clamp pad and a support pad configured to clamp the external and internal surfaces of the base of a ceramic object to assist in dipping the ceramic object into a liquid glaze to achieve a blemish-free coating.

A dip coating apparatus includes a liquid tank containing paint and a hanging tool for dipping into or removal from the liquid tank. The hanging tool includes a hollow frame, a first and second rack, and two first hanging frames. The hollow frame has a first and second strip. The first and the second racks are disposed in the hollow frame and connected to the first and the second strips. Each of the first hanging frames includes a first top strip connected to the first rack, a first bottom strip connected to the second rack, and a first lateral strip connected to the first top strip and the first bottom strip. Each first lateral strip forms an obtuse angle with the corresponding first top strip and an acute angle with the corresponding first bottom strip. Each first lateral strip includes a first top hook and a first bottom hook.

A dip coating apparatus includes a liquid tank containing paint and a hanging tool for dipping into or removal from the liquid tank. The hanging tool includes a hollow frame, a first and second rack, and two first hanging frames. The hollow frame has a first and second strip. The first and the second racks are disposed in the hollow frame and connected to the first and the second strips. Each of the first hanging frames includes a first top strip connected to the first rack, a first bottom strip connected to the second rack, and a first lateral strip connected to the first top strip and the first bottom strip. Each first lateral strip forms an obtuse angle with the corresponding first top strip and an acute angle with the corresponding first bottom strip. Each first lateral strip includes a first top hook and a first bottom hook.

An electronic component manufacturing apparatus has a holding member for holding an electronic component body, a surface plate, a moving unit that causes the holding member and the surface plate to relatively move, and a control unit that controls the moving unit. The control unit causes the moving unit to simultaneously perform a distance changing movement for changing, by shortening or extending, the distance between an end face of each electronic component body and a surface of the surface plate, and a position changing movement for changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction in which the two-dimensional position moves in parallel with the surface of the surface plate successively varies (for example, along a circular path).

An electronic component manufacturing apparatus has a holding member for holding an electronic component body, a surface plate, a moving unit that causes the holding member and the surface plate to relatively move, and a control unit that controls the moving unit. The control unit causes the moving unit to simultaneously perform a distance changing movement for changing, by shortening or extending, the distance between an end face of each electronic component body and a surface of the surface plate, and a position changing movement for changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction in which the two-dimensional position moves in parallel with the surface of the surface plate successively varies (for example, along a circular path).

The purpose of the present invention is to hold a fluid material repeatedly with a stable volume and stably coat the fluid material on an object being coated. A sealant coating device includes a chamber in which a sealant is stored; a shaft that is inserted in and withdrawn from the chamber; and a transfer part that moves toward and away from the shaft, which is protruding from the chamber, and is capable of holding sealant which is adhering to the shaft. The transfer part is moved to a fastener and may move toward and away from the fastener.

A coating frame, a coating system, and methods of coating a component using one or more coating frames are disclosed. The coating frame includes a frame member and at least one bracket coupled to the frame member. The bracket includes at least one hanger attachment point extending into a hollow interior of the at least one bracket. The at least one bracket isolates the at least one hanger attachment point from a coating material when the coating frame is used in a coating process. The method includes suspending a component from the coating frame, conveying the coating frame and the component to a coating applicator, and applying a coating material to the coating frame and the component while isolating the at least one hanger attachment point from the coating material via an air pocket formed within the at least one bracket.

The disclosure provides example methods and a system that includes: (a) a fluidization bed having a reservoir and comprising a base and a plurality of side walls, (b) an epoxy-based powder disposed within the reservoir, where the fluidization bed is configured to fluidize the epoxy-based powder, (c) a first heating element configured to heat the wire matrix reinforcement to at least a melting temperature, (d) a conveyor positioned over the fluidization bed and configured to engage the wire matrix reinforcement, where the conveyor is configured to submerge the wire matrix reinforcement into the fluidized epoxy-based powder such that a portion of the epoxy-based powder melts and coats the wire matrix reinforcement, and where the conveyor is configured to remove the wire matrix reinforcement from the epoxy-based powder; and (e) a second heating element configured to cure the epoxy-based powder coating the wire matrix reinforcement into a corrosion resistant barrier.