The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

A glue dispensing device comprises a base, a pressure control unit, a quantitative glue supply unit and a glue dispensing needle. The base comprises a pressure control chamber and a glue tube body, the pressure control chamber is located inside the base, the glue tube body extends from one end of the base to the other end, and the glue tube body penetrates the pressure control chamber. The pressure control unit is coupled to the pressure control chamber. The quantitative glue supply unit is disposed at one end of the base body and is coupled to the glue tube body. The glue dispensing needle is disposed at the other end of the base and is coupled to the glue tube body. The glue dispensing device uses the pressure change of the pressure control chamber to deform the glue tube body, thereby achieving quantitative glue dispensing effect with accuracy and stability. In addition, a glue dispensing method is also disclosed.

A glue dispenser dispensing switch includes a switching device main body, a needle holding base, a wear-resistant plate, and a rotating device. The switching device main body is equipped with a double liquid inlet, the needle holding base is equipped with a mixed glue outlet, the wear-resistant plate is installed between the switching device main body and the needle holding base, and the wear-resistant plate is equipped with a wear-resistant plate opening. The rotating device is utilized to rotate the needle holding base or the wear-resistant plate. A mixed double-liquid glue passes through the double liquid inlet, the wear-resistant plate opening and the glue outlet to dispense a mixed glue while the double liquid inlet, the wear-resistant plate opening and the glue outlet are overlapped. In addition, a double liquid dispensing equipment is also disclosed herein.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a fluid supply unit for supplying supercritical fluid to the treatment space, and a controller configured to control the fluid supply unit, wherein the fluid supply unit is configured to selectively supply the supercritical fluid at a first density or a second density higher than the first density into the treatment space. Thus, drying efficiency of the substrate when drying the substrate using the supercritical fluid may be improved.

A multi-orifice nozzle suitable for drawing a plurality of line rules in parallel, line rules disposed in parallel drawn using the multi-orifice nozzle, and systems and methods for using such line rules for impressing a substrate with a plurality of line indentations disposed in parallel.

A coating device coats a coating region of a to-be-coated object having a convex curved surface. A coating device includes a head, an arm, and a controller. The head includes a nozzle surface. The arm holds the head. The controller controls movement of the head via the arm. A controller moves a head in a first direction along an end portion of a coating region in a posture in which a gap between a nozzle surface located on an end portion side of the coating region and a to-be-coated object is smaller than a gap between the nozzle surface located on a center side of the coating region and the to-be-coated object.

A method for fabricating a semiconductor device, including forming a lower structure on a substrate. The lower structure includes a first sacrificial layer and a first insulating layer alternately and repeatedly stacked. A first hole is formed in the lower substrate. The first hole exposes an upper surface of the substrate. A sacrificial pattern is formed in the first hole. A porosity of the sacrificial pattern increases toward the substrate. An upper structure is formed on the lower structure and the sacrificial pattern. The upper structure includes a second sacrificial layer and a second insulating layer alternatively and repeatedly stacked. A second hole is formed in the upper structure. The second hole exposes the sacrificial pattern. The sacrificial pattern is removed.

A remote metering station for pumping a flow of adhesive to a dispensing module is disclosed. The remote metering station includes a manifold having a front surface, a back surface opposite to the front surface, a first side surface, a second side surface opposite the first side surface, a top surface, and a bottom surface opposite to said top surface. The remote metering station also includes a modular pump assembly removably mounted to the manifold, where the modular pump assembly includes a bottom surface, an outlet on the bottom surface, the outlet being in fluid communication with the manifold, and an inlet for receiving the adhesive. The modular pump assembly further includes a gear assembly and a drive motor coupled to the gear assembly. The gear assembly is operable for pumping the adhesive from the inlet to the outlet.

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an ideal conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.