Described herein is a method for producing a sealant. The method includes mixing a first material with a second material at a manufacturing site to produce the sealant. The method also includes applying x-ray energy to the sealant at the manufacturing site. The method includes measuring an amount of fluorescence emitted from the sealant in response to applying the x-ray energy. The method also includes calculating a mix ratio of the first and second materials of the sealant based on the amount of fluorescence. The method includes determining whether the mix ratio is within a predetermined mix ratio range.

Described herein is a method for producing a sealant. The method includes mixing a first material with a second material at a manufacturing site to produce the sealant. The method also includes applying x-ray energy to the sealant at the manufacturing site. The method includes measuring an amount of fluorescence emitted from the sealant in response to applying the x-ray energy. The method also includes calculating a mix ratio of the first and second materials of the sealant based on the amount of fluorescence. The method includes determining whether the mix ratio is within a predetermined mix ratio range.

A coating apparatus for a color filter substrate, including a coating sprayer (1) configured to coat a first film layer on a color filter layer (03) formed on the color filter substrate (01); a grinding device (2) configured to grind the color filter layer (03) to eliminate a step formed by the color filter layer (03) covering a black matrix (02); and a detection control unit (3) configured to measure a height of the step, determine a grinding amount of the grinding device (2) according to the height of the step, and control an operation of the grinding device (2) such that the first film layer coated on the color filter layer (03) has a flat surface. Also disclosed is a coating method for a color filter substrate.

A coating apparatus for a color filter substrate, including a coating sprayer (1) configured to coat a first film layer on a color filter layer (03) formed on the color filter substrate (01); a grinding device (2) configured to grind the color filter layer (03) to eliminate a step formed by the color filter layer (03) covering a black matrix (02); and a detection control unit (3) configured to measure a height of the step, determine a grinding amount of the grinding device (2) according to the height of the step, and control an operation of the grinding device (2) such that the first film layer coated on the color filter layer (03) has a flat surface. Also disclosed is a coating method for a color filter substrate.

A topical high resolution image of edible ink and having a resolution of at least 100 dots per inch is applied to a top major surface of a length of food (14) in the form of a thin fruit based paste or confection slurry by a digital imaging printer (130). The length of food (14) is at a temperature of at least about 75° C. at the time of application. During application, the food (14) is supported upon a moveable platform (136) mounted by parallelogram links (138) and which is moved parallel to the digital imaging printer (130) according to a condition of the top major surface upon which the topical high resolution image is applied and detected by detecting provisions (144).

Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

A problem is to provide a method and a device for producing a conductive polymer conductor according to which a conductive polymer cm be easily adhered to a base material with high accuracy. A solution is a production device 10 equipped with a heating means 11 for heating a base material 22, a raw material application means 12 for applying, to the base material 22, a raw material solution containing a monomer of the conductive polymer, and a producing solution application means 13 for applying, to the base material 22, a producing solution containing an oxidizing agent for promoting polymerization of the monomer, a dopant for developing electrical conductivity in the conductive polymer, and a viscosity improver for improving viscosity. The raw material solution is applied thereto after heating the base material 22 or while heating the base material 22, and then the producing solution is applied thereto.

A problem is to provide a method and a device for producing a conductive polymer conductor according to which a conductive polymer cm be easily adhered to a base material with high accuracy. A solution is a production device 10 equipped with a heating means 11 for heating a base material 22, a raw material application means 12 for applying, to the base material 22, a raw material solution containing a monomer of the conductive polymer, and a producing solution application means 13 for applying, to the base material 22, a producing solution containing an oxidizing agent for promoting polymerization of the monomer, a dopant for developing electrical conductivity in the conductive polymer, and a viscosity improver for improving viscosity. The raw material solution is applied thereto after heating the base material 22 or while heating the base material 22, and then the producing solution is applied thereto.

Free stall systems having free stall units arranged in a substantially parallel relationship having coated rail members. The coated rail members comprising an elongated fiberglass material manufactured by grinding a starting fiberglass material prior to a coating being applied. The starting fiberglass material can be reclaimed and reused from other industries such that the fiberglass material may be cut to remove unwanted metal end portions and/or cut to a desired size prior to the grinding and coating steps. The coated fiberglass material can be coated with a UV-resistant material or other coating to maintain the longevity of the fiberglass member during its use. The coated fiberglass apparatus may be utilized in free stall systems, gates, fencing materials and other applications where a solid fiberglass rod or hollow fiberglass tube having a desired coating is desired.