The present disclosure provides a spray coater including a spray nozzle unit having at least one spray nozzle and configured to spray a coating material, a spray nozzle transfer unit configured to control a position of the spray nozzle unit by operating a transfer block, on which the spray nozzle unit is mounted, at least in a planar direction, a substrate seating unit positioned below the spray nozzle unit and configured such that a substrate, which is subjected to coating, is seated thereon, a substrate carrier configured to accommodate the substrate before the substrate is coated and accommodate the substrate after the substrate is coated, and a robot arm configured to unload the substrate from the substrate carrier and provide the substrate to the substrate seating unit before the substrate is coated or unload the substrate from the substrate seating unit and load the substrate on the substrate carrier after the substrate is coated.

A paste coating apparatus includes a first feeder that feeds a first belt, a mounter that joins one end portion of each of a plurality of electronic components to the first belt, a first coater that coats paste on the other end portion of each of the plurality of electronic components mounted on the first belt, a first dryer that dries the paste, a second feeder that feeds a second belt, a transfer device that transfers the plurality of electronic components from the first belt to the second belt, a second coater that coats the paste on the one end portion of each of the plurality of electronic components mounted on the second belt, a second dryer that dries the paste, and a collection device that winds and collects the second belt.

In a laser-assisted deposition system, a uniform layer of material is coated onto a donor substrate at a coating system, and portions of the material are jetted from the donor substrate to a receiving substrate at a printing unit, leaving residual portions of the material on the donor substrate. In order to not waste the residual portions of the material, the donor substrate with the residual portions of the material is returned to the coating system where the residual portions of the material are aggregated into a blob and subsequently recoated onto the donor substrate. The blob may be formed by translating the residual portions of the material towards an interface formed by two coating rollers, a squeegee and the donor substrate, or a film and the donor substrate.

In a laser-assisted deposition system, a uniform layer of material is coated onto a donor substrate at a coating system, and portions of the material are jetted from the donor substrate to a receiving substrate at a printing unit, leaving residual portions of the material on the donor substrate. In order to not waste the residual portions of the material, the donor substrate with the residual portions of the material is returned to the coating system where the residual portions of the material are aggregated into a blob and subsequently recoated onto the donor substrate. The blob may be formed by translating the residual portions of the material towards an interface formed by two coating rollers, a squeegee and the donor substrate, or a film and the donor substrate.

The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.

The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.

A thermoplastic prepreg includes a mat, web, or fabric of fibers and hollow glass microspheres that are positioned atop the mat, web, or fabric of fibers or dispersed therein. The thermoplastic prepreg also includes a thermoplastic polymer that is fully impregnated through the mat, web, or fabric of fibers and the hollow glass microspheres so that the thermoplastic prepreg has a void content of less than 3% by volume of the thermoplastic prepreg. The thermoplastic material is polymerized monomers and oligomers in which greater than 90% by weight of the monomers or oligomers react to form the thermoplastic material.

A thermoplastic prepreg includes a mat, web, or fabric of fibers and hollow glass microspheres that are positioned atop the mat, web, or fabric of fibers or dispersed therein. The thermoplastic prepreg also includes a thermoplastic polymer that is fully impregnated through the mat, web, or fabric of fibers and the hollow glass microspheres so that the thermoplastic prepreg has a void content of less than 3% by volume of the thermoplastic prepreg. The thermoplastic material is polymerized monomers and oligomers in which greater than 90% by weight of the monomers or oligomers react to form the thermoplastic material.

A coating device includes a first coating mechanism configured to coat a first surface of a substrate, a first oven drying mechanism arranged downstream of the first coating mechanism and configured to oven dry a coating on the first surface, a second coating mechanism arranged downstream of the first oven drying mechanism and configured to coat a second surface of the substrate opposite to the first surface, a second oven drying mechanism arranged downstream of the second coating mechanism and configured to oven dry a coating on the second surface, and a third oven drying mechanism arranged downstream of the second oven drying mechanism and configured to oven dry the coating on the second surface.

A coating device includes a first coating mechanism configured to coat a first surface of a substrate, a first oven drying mechanism arranged downstream of the first coating mechanism and configured to oven dry a coating on the first surface, a second coating mechanism arranged downstream of the first oven drying mechanism and configured to coat a second surface of the substrate opposite to the first surface, a second oven drying mechanism arranged downstream of the second coating mechanism and configured to oven dry a coating on the second surface, and a third oven drying mechanism arranged downstream of the second oven drying mechanism and configured to oven dry the coating on the second surface.