B05C9/14

Manufacturing apparatus of electrode for secondary battery comprising heating part and manufacturing method of electrode for secondary battery comprising heating process, for heating electrode current collector before coating with electrode active material slurry

The present disclosure relates to a manufacturing apparatus of an electrode fora secondary battery including a heating part and a manufacturing method of an electrode for a secondary battery including a heating process, which performs heating of an electrode current collector before coating with an electrode active material slurry.

Manufacturing apparatus of electrode for secondary battery comprising heating part and manufacturing method of electrode for secondary battery comprising heating process, for heating electrode current collector before coating with electrode active material slurry

The present disclosure relates to a manufacturing apparatus of an electrode fora secondary battery including a heating part and a manufacturing method of an electrode for a secondary battery including a heating process, which performs heating of an electrode current collector before coating with an electrode active material slurry.

Device and Method for Manufacturing Coated Welding Rod

The present disclosure provides a device and method for manufacturing a coated welding rod. The device for manufacturing a coated welding rod includes a grabbing device, a heating device, and a flux storage device. The heating device is configured to heat a welding rod in the grabbing device. A flux in granular form is stored in the flux storage device, the grabbing device is configured to transport the heated welding rod into the flux storage device, and the heated welding rod is configured to heat the flux surrounding the welding rod into a viscous glassy state so that the flux in the viscous glassy state adheres to the surface of the welding rod. The heated welding rod enables the granular flux to be formed into a viscous glassy state so that the flux can be adhered directly to the surface of the welding rod.

Device for lacquer transfer

A device for lacquer transfer is disclosed having a frame, a transfer roller with a circumferential lateral wall, and a nozzle for dispensing lacquer. The nozzle is arranged contactless to or in direct contact with the outside contact surface of the lateral wall for dispensing lacquer into respective depressions in the lateral wall while the transfer roller is rotated about the axis of rotation. The transfer roller is configured to roll with the outside contact surface on a work surface of a work piece for transferring the lacquer from the depressions to the work surface of the work piece. The transfer roller includes a rim and a tire, wherein the rim is mounted to the frame rotatably about the axis of rotation by the first end and extends between a first end and a second end along the axis of rotation, wherein the tire is mounted on the rim and includes the lateral wall.

SYSTEM FOR PRODUCING A FULLY IMPREGNATED THERMOPLASTIC PREPREG

According to one embodiment, a system for manufacturing a fully impregnated thermoplastic prepreg includes a mechanism for moving a fabric or mat and a drying mechanism that removes residual moisture from at least one surface of the fabric or mat. The system also includes a resin application mechanism that applies a reactive resin to the fabric or mat and a press mechanism that presses the coated fabric or mat to ensure that the resin fully saturates the fabric or mat. The system further includes a curing oven through which the coated fabric or mat is moved to polymerize the resin and thereby form a thermoplastic polymer so that upon exiting the oven, the fabric or mat is fully impregnated with the thermoplastic polymer. During at least a portion of the process, humidity in the vicinity of the coated fabric or mat is maintained at substantially zero.

SYSTEM FOR PRODUCING A FULLY IMPREGNATED THERMOPLASTIC PREPREG

According to one embodiment, a system for manufacturing a fully impregnated thermoplastic prepreg includes a mechanism for moving a fabric or mat and a drying mechanism that removes residual moisture from at least one surface of the fabric or mat. The system also includes a resin application mechanism that applies a reactive resin to the fabric or mat and a press mechanism that presses the coated fabric or mat to ensure that the resin fully saturates the fabric or mat. The system further includes a curing oven through which the coated fabric or mat is moved to polymerize the resin and thereby form a thermoplastic polymer so that upon exiting the oven, the fabric or mat is fully impregnated with the thermoplastic polymer. During at least a portion of the process, humidity in the vicinity of the coated fabric or mat is maintained at substantially zero.

ULTRAVIOLET IRRADIATION DEVICE INCLUDING CIRCULAR IRRADIATION UNITS THAT FOCUS LIGHT ON A SINGLE POINT

A bare optical fiber manufacturing method includes applying an ultraviolet curable resin applied around an optical fiber; and irradiating the ultraviolet curable resin with ultraviolet light emitted from semiconductor ultraviolet light emitting elements, by use of an ultraviolet irradiation device having plural ultraviolet irradiation units each having plural positions where the ultraviolet light is emitted toward the ultraviolet curable resin, the plural positions being arranged on the same circle, the plural ultraviolet irradiation units being arranged in a traveling direction of the optical fiber such that the optical fiber passes centers of the circles, at least two of the plural ultraviolet irradiation units being differently arranged with respect to circumferential direction angles thereof around an axis that is the traveling direction of the optical fiber.

ULTRAVIOLET IRRADIATION DEVICE INCLUDING CIRCULAR IRRADIATION UNITS THAT FOCUS LIGHT ON A SINGLE POINT

A bare optical fiber manufacturing method includes applying an ultraviolet curable resin applied around an optical fiber; and irradiating the ultraviolet curable resin with ultraviolet light emitted from semiconductor ultraviolet light emitting elements, by use of an ultraviolet irradiation device having plural ultraviolet irradiation units each having plural positions where the ultraviolet light is emitted toward the ultraviolet curable resin, the plural positions being arranged on the same circle, the plural ultraviolet irradiation units being arranged in a traveling direction of the optical fiber such that the optical fiber passes centers of the circles, at least two of the plural ultraviolet irradiation units being differently arranged with respect to circumferential direction angles thereof around an axis that is the traveling direction of the optical fiber.

SEMICONDUCTOR CONTINUOUS ARRAY LAYER
20210273146 · 2021-09-02 ·

A color emissive LED array comprising a backplane and a plurality of color emissive LED units disposed in an array on the backplane, whereas the thickness of a first color emissive LED unit is less than the thickness of a second color emissive LED unit and less than the thickness of the third color emissive LED unit; wherein the color emissive LED units is formed by at least one of vertical configuration structure or flip chip configuration LED structure.

MANUFACTURING METHOD FOR FUNCTIONAL FILM, DRYING DEVICE, AND MANUFACTURING DEVICE FOR FUNCTIONAL FILM

A manufacturing method for a functional film provided on an upper surface of a long substrate, includes coating an ink containing a material of the functional film on the upper surface of the substrate to form a coating film, and drying the coating film while conveying the substrate. The drying process includes a first process in which the substrate is conveyed for a first distance and a temperature of the substrate is raised from a first temperature to a second temperature during conveyance. In the first process, assuming that the first distance is d.sub.1 (m), the first temperature is T.sub.1 (° C.), and the second temperature is T.sub.2 (° C.), the following expression is satisfied: (T.sub.2−T.sub.1)/d.sub.1≥10 (1a). A maximum value of an instantaneous temperature change rate of the substrate is 5° C./sec or less.