B05C9/14

Machining system and machining method
11254106 · 2022-02-22 · ·

A machining system includes an application device that applies a photocurable resin to surfaces of a plurality of linear objects provided in a workpiece; a curing device that brings the linear objects, to which the photocurable resin has been applied by the application device, into close contact with each other in radial directions and that radiates light onto the photocurable resin, which has been applied to the linear objects brought into close contact, thus curing the photocurable resin; and a machining device that machines the workpiece, in which the plurality of linear objects have been bound together through the curing of the photocurable resin performed by the curing device.

Machining system and machining method
11254106 · 2022-02-22 · ·

A machining system includes an application device that applies a photocurable resin to surfaces of a plurality of linear objects provided in a workpiece; a curing device that brings the linear objects, to which the photocurable resin has been applied by the application device, into close contact with each other in radial directions and that radiates light onto the photocurable resin, which has been applied to the linear objects brought into close contact, thus curing the photocurable resin; and a machining device that machines the workpiece, in which the plurality of linear objects have been bound together through the curing of the photocurable resin performed by the curing device.

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM
20170294303 · 2017-10-12 ·

A substrate processing method includes applying a solution of a compound containing a metal oxide to a surface of a wafer to form a liquid film of the solution on the surface of the wafer, heating the liquid film at a first temperature lower than a crosslinking temperature of the compound, and irradiating the liquid film with energy rays to form a coating film containing the metal oxide on the surface, after heating the liquid film at the first temperature.

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM
20170294303 · 2017-10-12 ·

A substrate processing method includes applying a solution of a compound containing a metal oxide to a surface of a wafer to form a liquid film of the solution on the surface of the wafer, heating the liquid film at a first temperature lower than a crosslinking temperature of the compound, and irradiating the liquid film with energy rays to form a coating film containing the metal oxide on the surface, after heating the liquid film at the first temperature.

Methods, wires, and apparatus for slicing hard materials

Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

Methods, wires, and apparatus for slicing hard materials

Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

DUAL LAYER FUSION BOND EPOXY COATING FOR CONTINUOUS SUCKER ROD

Embodiments of the present disclosure generally relate to apparatus and methods for manufacturing continuous sucker rods with protective coatings. One embodiment provides a coating system including a first drive station disposed on a first end of a coating line, a second drive station disposed on a second end of the coating line to move a continuous sucker rod along the coating line from the first drive station to the second drive station, a heater disposed along the coating line, and a first coating station disposed along the coating line.

FILM FORMING APPARATUS

The present invention provides a film forming apparatus having a mist spray nozzle which enables a prevention of a generation of a clogging. The film forming apparatus according to the present invention is provided with a mist spray head (100) for spraying a raw material. The mist spray head (100) includes a raw material spray nozzle (N1) and a raw material ejection part (7) for ejecting an atomized raw material, and the raw material spray nozzle (N1) includes a cavity (2, 3) and a raw material discharge part (5) which is drilled in a side surface of the cavity (2, 3), being away from a bottom surface of the cavity (2, 3), and is connected to the raw material ejection part (7).

SYSTEM AND METHOD FOR MANUFACTURING POSITIVE ELECTRODE FOR SECONDARY BATTERY
20220045309 · 2022-02-10 ·

A system for manufacturing a positive electrode for a secondary battery includes an unwinder wound with a positive electrode base material, a first coating unit for coating an insulating material at predetermined positions about widthwise edges of the base material with respect to a transfer direction of the base material supplied from the unwinder, a first drying furnace for drying the insulating material by heating the base material coated with the insulating material, a second coating unit for coating a positive electrode slurry on the base material supplied from the first drying furnace in a region between the insulating material formed at both sides of the base material, and a second drying furnace for heating and drying the base material coated with the insulating material and the positive electrode slurry.

Flame treatment device, apparatus for producing coated metal plate, and method for producing coated metal plate

The present invention addresses the problem of providing a flame treatment device which is capable of performing a flame treatment on a metal-based base material without requiring a preheat treatment. For the purpose of solving the above-described problem, a flame treatment device according to the present invention comprises: a first temperature measurement unit which measures the temperature of a metal-based base material before a flame treatment; a control unit which determines the combustion energy of flame on the basis of the temperature before a flame treatment, said temperature having been measured by the first temperature measurement unit, so that the surface temperature of the metal-based base material during the flame treatment is 56° C. or higher; and a flame treatment unit which performs a flame treatment on the metal-based base material on the basis of the combustion energy, which has been determined by the control unit.