A method of generating a building assembly that includes spraying a coating material onto a plurality of pieces of substrate disposed on a first assembly face. The spraying includes spraying the coating material onto the plurality of pieces of substrate via a sprayer configured to apply the coating material to a target surface via a nozzle coupled with a mobile storage container storing the coating material, the coating material impregnating voids of the substrate. The method also includes allowing the coating material impregnating the voids to dry and harden and become rigid to generate the building assembly.Attac

In a general aspect, a coating blade for application of coating color to a fibrous web can include an elongate substrate having a longitudinal edge. Within an operating zone of the coating blade intended for contact with a coating color, the elongate substrate can include a longitudinal wear-resistant deposit adjacent to the longitudinal edge. The coating blade, within the operating zone, can also include a longitudinal masking deposit adjoining the longitudinal wear-resistant deposit.

A coating system for applying a coating to a substrate that can be part of a wall assembly. The system includes a positioning stage and an end effector coupled at a distal end of the positioning stage, the end effector configured to apply coating to a target surface. The system can further include a computing device executing a computational planner that: generates instructions for driving the end effector and positioning stage to perform at least one coating task that includes applying coating, via the coating the end effector, to one or more substrate pieces, the generating based at least in part on obtained target surface data; and drives the end effector and positioning stage to perform the at least one coating task.

A coating apparatus, which coats only the outer circumferential edge face of a workpiece with film-forming liquid, even if the workpiece is a non-circular thin lens or the like, a rotating mechanism is configured so that a workpiece and an imitating form having the same shape as the outer shape of the workpiece can rotate synchronously around the same rotation axis center, a coating mechanism includes a pressing roller that can rotate with the imitating form while being pressed against an outer circumferential edge face of the imitating form, and a coating part including a coating roller which, while being pressed against the outer circumferential edge face of the workpiece, rotates with the workpiece and applies the film forming liquid to the outer circumferential edge face of the workpiece, a rotary transmission unit that synchronously rotates the pressing roller and the coating roller having the same outer shape.

A raw material solution (6), in which an organic semiconductor material is dissolved in a solvent, is supplied to a substrate (1). The solvent is evaporated so that crystals of the organic semiconductor material are precipitated. Thus, an organic semiconductor thin film (7) is formed on the substrate (1). An edge forming member (2) having a contact face (2a) on one side is used and located opposite the substrate (1) so that the plane of the contact face (2a) intersects the surface of the substrate (1) at a predetermined angle. The raw material solution (6) is supplied to the substrate (1) and formed into a droplet (6a) that comes into contact with the contact face (2a). The substrate (1) and the edge forming member (2) are moved relative to each other in a direction parallel to the surface of the substrate (1) so as to separate the edge forming member (2) from the droplet (6a), and while the raw material solution (6) is supplied so that a change in size of the droplet (6a) with the relative movement is maintained within a predetermined range, the solvent contained in the droplet (6a) is evaporated to form the organic semiconductor thin film (7) on the substrate (1) after the contact face (2a) has been moved. In this manner, a large-area organic semiconductor single crystal thin film having high charge mobility can be manufactured by a simple process using a solvent evaporation method based on droplet formation.

A raw material solution (6), in which an organic semiconductor material is dissolved in a solvent, is supplied to a substrate (1). The solvent is evaporated so that crystals of the organic semiconductor material are precipitated. Thus, an organic semiconductor thin film (7) is formed on the substrate (1). An edge forming member (2) having a contact face (2a) on one side is used and located opposite the substrate (1) so that the plane of the contact face (2a) intersects the surface of the substrate (1) at a predetermined angle. The raw material solution (6) is supplied to the substrate (1) and formed into a droplet (6a) that comes into contact with the contact face (2a). The substrate (1) and the edge forming member (2) are moved relative to each other in a direction parallel to the surface of the substrate (1) so as to separate the edge forming member (2) from the droplet (6a), and while the raw material solution (6) is supplied so that a change in size of the droplet (6a) with the relative movement is maintained within a predetermined range, the solvent contained in the droplet (6a) is evaporated to form the organic semiconductor thin film (7) on the substrate (1) after the contact face (2a) has been moved. In this manner, a large-area organic semiconductor single crystal thin film having high charge mobility can be manufactured by a simple process using a solvent evaporation method based on droplet formation.

Provided are an apparatus and method for coating a separator. The method includes supplying a coating solution to a receiving chamber; applying the coating solution received in the receiving chamber to a surface of the separator through a coating bar; collecting coating solution overflowing the receiving chamber by a collection chamber surrounding the receiving chamber; and returning coating solution from the collection chamber to the receiving chamber through a return line.

Provided are an apparatus and method for coating a separator. The method includes supplying a coating solution to a receiving chamber; applying the coating solution received in the receiving chamber to a surface of the separator through a coating bar; collecting coating solution overflowing the receiving chamber by a collection chamber surrounding the receiving chamber; and returning coating solution from the collection chamber to the receiving chamber through a return line.

A facility for dip-coating a metal strip in continuous motion includes: a liquid coating metal bath from which the strip exits in a vertical strand; a bottom roller, a decambering roller, and, optionally, a stabilizing roller, all immersed in the liquid-metal bath; drying blades at an exit of the bath, for injecting compressed gas in order to remove excess coating that has not yet solidified so as to create a drying wave having a downward return stream of liquid metal; and a dissipating hydrodynamic-stabilization device placed between the drying blades and a last immersed roller, the dissipating hydrodynamic-stabilization device including a plurality of hydrodynamic pads for applying a load to at least one side of the metal strip and mounted so as to pivot around hinges so as to self-align the pads, the plurality of hydrodynamic pads extending transversely across a width of the strip.

A flux unit includes a flux supply device configured to eject flux to a storage tray, an ejection port configured to eject the flux, and an ejection port moving device configured to move the ejection port in the radial direction of the storage tray. By this, the flux is ejected in a wide range in the radial direction of the storage tray. Also, the storage tray is rotated by a tray rotation device. Thus, the film thickness of the flux ejected in the wide range of the storage tray is adjusted by a squeegee all at once. Thus, the time required for adjusting the film thickness of the flux can be reduced.