A semiconductor manufacturing device has an outer cup and inner cup with a wafer suction mount disposed within the outer cup. A photoresist material is applied to a first surface of a semiconductor wafer disposed on the wafer suction mount while rotating at a first speed. A gas port is disposed on the inner cup for dispensing a gas oriented toward a bottom side of the semiconductor wafer. The gas port purges a second surface of the semiconductor wafer with a gas to remove contamination. The second surface of the semiconductor wafer is rinsed while purging with the gas. The gas can be a stable or inert gas, such as nitrogen. The contamination is removed from the second surface of the semiconductor wafer through an outlet between the inner cup and outer cup. The semiconductor wafer rotates at a second greater speed after discontinuing purge with the gas.

Systems and methods for coating a thin film with a viscous material, such as a liquid, a paste, or an adhesive, at a desired thickness. In such a system, two films move adjacent to one another, optionally in opposite directions, atop two rollers separated by a known gap that defines a coating thickness, with the material being transferred from one film to the other. The rollers may be maintained in their relative positions by springs and/or linear actuators and positioned using linear encoders. In alternative arrangements, the material to be coated could be low viscosity material such as a polymeric solution. Air knives may be provided near the gap to create an air flow that aids in preventing the free flow of low viscosity materials outside the bounds of the film during coating.

A method of contact coating at least one elastic strand with an adhesive is disclosed. A first strand has a periphery with an upper surface. The first strand is moved in a machine direction relative to a contact nozzle, the adhesive is discharged from the contact nozzle into contact with the upper surface of the first strand, and pressurized air is discharged at the adhesive on the first strand to cause the adhesive to spread around the periphery of the first strand without blowing adhesive off the first strand.

A method of contact coating at least one elastic strand with an adhesive is disclosed. A first strand has a periphery with an upper surface. The first strand is moved in a machine direction relative to a contact nozzle, the adhesive is discharged from the contact nozzle into contact with the upper surface of the first strand, and pressurized air is discharged at the adhesive on the first strand to cause the adhesive to spread around the periphery of the first strand without blowing adhesive off the first strand.

A slurry application device includes: a slurry supply unit configured to supply slurry to a surface of a traveling base material; a slurry application unit including a first roll body disposed at the downstream side in relation to the slurry supply unit and configured to press the first roll body against the slurry to apply the slurry onto the surface and to adjust an adhesion amount of the slurry such that a film thickness of the slurry becomes one time or more and two times or less of a target film thickness; and a slurry adhesion amount adjustment unit including a second roll body disposed at the downstream side in relation to the slurry application unit and configured to press the second roll body against the slurry to adjust the slurry adhesion amount such that the film thickness of the slurry becomes the target film thickness.

A slurry application device includes: a slurry supply unit configured to supply slurry to a surface of a traveling base material; a slurry application unit including a first roll body disposed at the downstream side in relation to the slurry supply unit and configured to press the first roll body against the slurry to apply the slurry onto the surface and to adjust an adhesion amount of the slurry such that a film thickness of the slurry becomes one time or more and two times or less of a target film thickness; and a slurry adhesion amount adjustment unit including a second roll body disposed at the downstream side in relation to the slurry application unit and configured to press the second roll body against the slurry to adjust the slurry adhesion amount such that the film thickness of the slurry becomes the target film thickness.

A chamber includes a sidewall, a cooling pipe, and an external pipe. The cooling pipe includes a first segment extending along the sidewall of the chamber, and includes multiple purge nozzles. The external pipe extends to inside the chamber and is connected to the first segment of the cooling pipe. A semiconductor processing station includes a central transfer chamber, a load lock chamber, and a cooling stage. The load lock chamber and the cooling stage are disposed adjacent to the central transfer chamber. The load lock chamber is adapted to contain a wafer carrier having multiple wafers. The central transfer chamber communicates between the cooling stage and the load lock chamber to transfer a wafer between the cooling stage and the load lock chamber. A semiconductor process using the semiconductor processing station is also provided.

A chamber includes a sidewall, a cooling pipe, and an external pipe. The cooling pipe includes a first segment extending along the sidewall of the chamber, and includes multiple purge nozzles. The external pipe extends to inside the chamber and is connected to the first segment of the cooling pipe. A semiconductor processing station includes a central transfer chamber, a load lock chamber, and a cooling stage. The load lock chamber and the cooling stage are disposed adjacent to the central transfer chamber. The load lock chamber is adapted to contain a wafer carrier having multiple wafers. The central transfer chamber communicates between the cooling stage and the load lock chamber to transfer a wafer between the cooling stage and the load lock chamber. A semiconductor process using the semiconductor processing station is also provided.

Apparatus and method useful for, among other things, providing a layer by layer coating of materials on a substrate.

An additive layer manufacturing apparatus comprising a doctor blade (57) having a tip (51) which, in use, is arranged proximal to a material layer (59) to be recoated during an additive layer manufacturing method, the doctor blade (57) having a cavity (50) with an inlet and an outlet, the outlet located at the tip (51) and the inlet connectable to an air supply (53) whereby air can be directed through the cavity (50) to the outlet and onto a surface (59a) of the material layer (59).