Automated systems and methods of using a smart end-effector tool (20) including an applicator (30) to apply a coating onto an object surface (2) (e.g., a wind blade) are provided. The smart tool (20) can process on-board sensor signals and update its working state with a remote robot controller (28) in real time and send instructions to the robot controller (28) to adjust the tool's travelling around the object surface (2) and optimize the applicator's (30) operation.

Automated systems and methods of using a smart end-effector tool (20) including an applicator (30) to apply a coating onto an object surface (2) (e.g., a wind blade) are provided. The smart tool (20) can process on-board sensor signals and update its working state with a remote robot controller (28) in real time and send instructions to the robot controller (28) to adjust the tool's travelling around the object surface (2) and optimize the applicator's (30) operation.

A coating apparatus includes: a supply frame for supplying slurry into channels from one end of a honeycomb substrate; and a blower for evacuating a wind box. An annular resistive member is attached to the circumference of the opening of the wind box, and the honeycomb substrate is arranged, with a spacer placed on the resistive member. When the blower is operated and the slurry is supplied, the coat width of the slurry coated on the inner surfaces of the channels in an outer circumferential area is less than the coat width of the slurry coated on the inner surfaces of the channels in a center area.

A coating apparatus includes: a supply frame for supplying slurry into channels from one end of a honeycomb substrate; and a blower for evacuating a wind box. An annular resistive member is attached to the circumference of the opening of the wind box, and the honeycomb substrate is arranged, with a spacer placed on the resistive member. When the blower is operated and the slurry is supplied, the coat width of the slurry coated on the inner surfaces of the channels in an outer circumferential area is less than the coat width of the slurry coated on the inner surfaces of the channels in a center area.

A chamber includes a sidewall, a cooling pipe, and an external pipe. The cooling pipe includes a first segment extending along the sidewall of the chamber, and includes multiple purge nozzles. The external pipe extends to inside the chamber and is connected to the first segment of the cooling pipe. A semiconductor processing station includes a central transfer chamber, a load lock chamber, and a cooling stage. The load lock chamber and the cooling stage are disposed adjacent to the central transfer chamber. The load lock chamber is adapted to contain a wafer carrier having multiple wafers. The central transfer chamber communicates between the cooling stage and the load lock chamber to transfer a wafer between the cooling stage and the load lock chamber. A semiconductor process using the semiconductor processing station is also provided.

A method and a device for coating a metal strip with a coating material that is still liquid at first. During the coating, the coated metal strip runs through a roller pair. One of the rollers of the roller pair can be adjusted toward the other as a correction roller in order to eliminate a possible curvature of the metal strip. Then the metal strip runs through a blow-off apparatus for blowing off surplus coating. In order to prevent an uneven thickness distribution of the coating on the metal strip even when the correction roller of the roller pair has been adjusted, the actual position of the metal strip is controlled to a specified setpoint center position in the slot of the blow-off apparatus by an appropriate movement of the blow-off apparatus.

When a portion for measuring the plating adhesion amount reaches an upstream side position, plating adhesion amount estimation values are calculated by using a plating adhesion amount estimation expression at positions away from a position that faces the distance sensors, that is, the upstream side position, by strip-width direction distances, of the surfaces of the steel strip. When the portion for measuring the plating adhesion amount reaches a downstream side position, the strip-width direction distances of the plating adhesion amount meters are matched to the strip-width direction distances, and the plating adhesion amount actual measurement values are obtained. The plating adhesion amount estimation expression is corrected on the basis of the differences between the plating adhesion amount estimation values and the plating adhesion amount actual measurement values. Accordingly, the control accuracy of the plating adhesion amount is improved.

When a portion for measuring the plating adhesion amount reaches an upstream side position, plating adhesion amount estimation values are calculated by using a plating adhesion amount estimation expression at positions away from a position that faces the distance sensors, that is, the upstream side position, by strip-width direction distances, of the surfaces of the steel strip. When the portion for measuring the plating adhesion amount reaches a downstream side position, the strip-width direction distances of the plating adhesion amount meters are matched to the strip-width direction distances, and the plating adhesion amount actual measurement values are obtained. The plating adhesion amount estimation expression is corrected on the basis of the differences between the plating adhesion amount estimation values and the plating adhesion amount actual measurement values. Accordingly, the control accuracy of the plating adhesion amount is improved.

The device has a gas flow levelling pipe (3), which defines a continuous curved development surface (Z), at comprising a collector (4) to which a nozzle (10) is fixed, a delivery manifold (1), in order to introduce pressurized gas into the pre-chamber (2) through the holes (12), a first holed partition (5) and a second holed partition (6) within the levelling pipe (3), arranged perpendicular to the curved development surface (Z) of the pipe (3).

The device has a gas flow levelling pipe (3), which defines a continuous curved development surface (Z), at comprising a collector (4) to which a nozzle (10) is fixed, a delivery manifold (1), in order to introduce pressurized gas into the pre-chamber (2) through the holes (12), a first holed partition (5) and a second holed partition (6) within the levelling pipe (3), arranged perpendicular to the curved development surface (Z) of the pipe (3).