Patent classifications
B05C11/06
Coating edges using a robot
Disclosed is an apparatus for at least partially, preferably entirely coating the peripheral edge of a workpiece, comprising a feeding device that has a coating head; a coating application means that applies the coating to the peripheral edge as well as an air flow are provided on/in the coating head, said air flow removing excess coating from the edge; the workpiece and the coating head are moved relative to one another. The invention further relates to a method for coating the peripheral edge of a workpiece with the aid of a coating head.
Coating edges using a robot
Disclosed is an apparatus for at least partially, preferably entirely coating the peripheral edge of a workpiece, comprising a feeding device that has a coating head; a coating application means that applies the coating to the peripheral edge as well as an air flow are provided on/in the coating head, said air flow removing excess coating from the edge; the workpiece and the coating head are moved relative to one another. The invention further relates to a method for coating the peripheral edge of a workpiece with the aid of a coating head.
Semiconductor processing station
A semiconductor processing station includes first and second chambers, and a cooling stage. The second chamber includes a cooling pipe disposed inside the second chamber, and an external pipe. The cooling pipe includes a first segment disposed along a sidewall of the second chamber, and a second segment disposed perpendicular to the first segment and located above a wafer carrier in the second chamber. An end of the second segment is connected to an end of the first segment. The external pipe is connected to the second segment distal from the end of the second segment to provide a fluid to flow through the cooling pipe from an exterior to an interior of the second chamber. The fluid discharges toward the wafer carrier through the first segment. The first chamber is surrounded by the second chamber and the cooling stage, and communicates between the cooling stage and the second chamber.
Semiconductor processing station
A semiconductor processing station includes first and second chambers, and a cooling stage. The second chamber includes a cooling pipe disposed inside the second chamber, and an external pipe. The cooling pipe includes a first segment disposed along a sidewall of the second chamber, and a second segment disposed perpendicular to the first segment and located above a wafer carrier in the second chamber. An end of the second segment is connected to an end of the first segment. The external pipe is connected to the second segment distal from the end of the second segment to provide a fluid to flow through the cooling pipe from an exterior to an interior of the second chamber. The fluid discharges toward the wafer carrier through the first segment. The first chamber is surrounded by the second chamber and the cooling stage, and communicates between the cooling stage and the second chamber.
Curtain applicator and method for applying an application medium
A curtain applicator for applying a liquid or pasty application medium to at least one surface of a running material web, in particular a fibrous web. The curtain applicator has an applicator nozzle, in particular a slotted nozzle, which under the effect of gravity, and optionally with further forces, is suitable for dispensing a single-tier or multi-tier curtain onto the surface of the material web. The curtain applicator further has a wiping device which is suitable for keeping entrained air carried by the material web away from the curtain. Moreover, there is provided at least one further blocking device which is suitable for keeping air movements of the ambient air away from the curtain.
Curtain applicator and method for applying an application medium
A curtain applicator for applying a liquid or pasty application medium to at least one surface of a running material web, in particular a fibrous web. The curtain applicator has an applicator nozzle, in particular a slotted nozzle, which under the effect of gravity, and optionally with further forces, is suitable for dispensing a single-tier or multi-tier curtain onto the surface of the material web. The curtain applicator further has a wiping device which is suitable for keeping entrained air carried by the material web away from the curtain. Moreover, there is provided at least one further blocking device which is suitable for keeping air movements of the ambient air away from the curtain.
Popcorn seasoning machine
A popcorn seasoning machine is disclosed. The popcorn seasoning machine includes a receptacle having a forced air system. A user then inputs a selected seasoning and popcorn into the device and depresses a control button for injecting air into the interior of the container for mixing popcorn and the seasoning. As a result, the seasoning is evenly distributed on the popcorn to facilitate an enjoyable popcorn eating experience. The device further includes an air pump therein which manually provides are to a vent platform to a top end of the receptable. The top end also includes a hingedly attached dome which seals the top end of the receptacle.
Popcorn seasoning machine
A popcorn seasoning machine is disclosed. The popcorn seasoning machine includes a receptacle having a forced air system. A user then inputs a selected seasoning and popcorn into the device and depresses a control button for injecting air into the interior of the container for mixing popcorn and the seasoning. As a result, the seasoning is evenly distributed on the popcorn to facilitate an enjoyable popcorn eating experience. The device further includes an air pump therein which manually provides are to a vent platform to a top end of the receptable. The top end also includes a hingedly attached dome which seals the top end of the receptacle.
WIRE-LESS VARIABLE GAP COATER DEVICE
Systems and methods for coating of a thin film with a viscous material, such as a liquid, a paste, or an adhesive, at a desired thickness. In such a system, two films move adjacent to one another, optionally in opposite directions, atop two rollers separated by a known gap that defines a coating thickness, with the material being transferred from one film to the other. The rollers may be maintained in their relative positions by springs and/or linear actuators and positioned using linear encoders. In alternate arrangements, the material to be coated could be low viscosity material such as a polymeric solution. Air knives may be provided near the gap to create an air flow that aids in preventing the free flow of low viscosity materials outside the bounds of the film during coating.
SYSTEMS AND METHODS FOR POLYMER DEPOSITION
Systems having one or more features that are advantageous for depositing fluorinated polymeric coatings on substrates, and methods of employing such systems to deposit such coatings, are generally provided.