A spin coating device includes a base plate, a spin chuck on which a substrate material is placed, and an actuator mechanism to engage the base plate with the spin chuck such that the base plate synchronously spins along with the spin chuck. The substrate material includes a top surface coated with a film-forming substance and a bottom surface. The cleaning mechanism is below the base plate and out of optimal exposure to the bottom surface of the substrate material and edges thereof in a state of the base plate engagement. In response to disengagement of a lid configured to synchronously co-rotate with the base plate, the actuator mechanism is further configured to disengage the base plate from the spin chuck and to enable the optimal exposure of the cleaning mechanism to the bottom surface of the substrate material and the edges thereof.

A developing method includes: forming a liquid pool of a diluted developing solution diluted with pure water in a central portion of a substrate; forming a liquid film of the diluted developing solution on a surface of the substrate by accelerating rotation of the substrate to diffuse the liquid pool of the diluted developing solution on the entire surface of the substrate; and then supplying a developing solution onto the substrate. Supplying a developing solution includes: supplying the developing solution from a developing solution supply nozzle having a liquid contact surface while securing a gap having a predetermined size between the developing solution supply nozzle and the substrate; and moving the developing solution supply nozzle in a radial direction passing through a center of the substrate while forming a liquid pool of the developing solution between the substrate and the liquid contact surface of the developing solution supply nozzle.

A developing method includes: forming a liquid pool of a diluted developing solution diluted with pure water in a central portion of a substrate; forming a liquid film of the diluted developing solution on a surface of the substrate by accelerating rotation of the substrate to diffuse the liquid pool of the diluted developing solution on the entire surface of the substrate; and then supplying a developing solution onto the substrate. Supplying a developing solution includes: supplying the developing solution from a developing solution supply nozzle having a liquid contact surface while securing a gap having a predetermined size between the developing solution supply nozzle and the substrate; and moving the developing solution supply nozzle in a radial direction passing through a center of the substrate while forming a liquid pool of the developing solution between the substrate and the liquid contact surface of the developing solution supply nozzle.

In an substrate processing apparatus according to the present invention, a chamber is configured so as to cover an internal space with a bottom wall, side walls extending from the periphery of the bottom wall, and a ceiling wall covering the upper end of the side walls. A plurality of base support members stand vertically upward from the bottom wall, and the base member is supported by upper end portions of these base support members. A so-called raised floor structure is formed. Then, the substrate processing part is installed on the upper surface of the base member. By adopting such a layout using the raised floor structure, even if leakage of the processing liquid occurs and the processing liquid is pooled on the bottom wall of the chamber, it is possible to reliably prevent the processing liquid from coming into contact with the substrate processing part.

In an substrate processing apparatus according to the present invention, a chamber is configured so as to cover an internal space with a bottom wall, side walls extending from the periphery of the bottom wall, and a ceiling wall covering the upper end of the side walls. A plurality of base support members stand vertically upward from the bottom wall, and the base member is supported by upper end portions of these base support members. A so-called raised floor structure is formed. Then, the substrate processing part is installed on the upper surface of the base member. By adopting such a layout using the raised floor structure, even if leakage of the processing liquid occurs and the processing liquid is pooled on the bottom wall of the chamber, it is possible to reliably prevent the processing liquid from coming into contact with the substrate processing part.

A substrate processing apparatus that includes a substrate holder, a cup member, an elevating mechanism, a first nozzle, and a camera. The substrate holder holds a substrate and rotates the substrate. The cup member surrounds the outer circumference of the substrate holder. The elevating mechanism moves up the cup member so that the upper end portion of the cup member is located at the upper end position higher than the substrate held by the substrate holder. The first nozzle has a discharge port at a position lower than the upper end position, and discharges first processing liquid from the discharge port to an end portion of the substrate. The camera images an imaging region that includes the first processing liquid discharged from the discharge port of the first nozzle and is viewed from an imaging position above the substrate.

A coating treatment apparatus for applying a coating solution to a peripheral portion of a substrate, includes: a holding and rotating part holding and rotating the substrate; a coating solution supply nozzle supplying the coating solution to the peripheral portion of the substrate; a moving mechanism moving the coating solution supply nozzle; and a controller controlling the holding and rotating part, coating solution supply nozzle, and moving mechanism, wherein the controller performs control of, while rotating the holding and rotating part: by controlling the moving mechanism while supplying the coating solution by the coating solution supply nozzle, both moving the coating solution supply nozzle from an outside of a perimeter of the substrate to a predetermined position at a periphery on the substrate at a first speed and then moving the coating solution supply nozzle from the predetermined position to the outside of the perimeter at a higher second speed.

A coating treatment apparatus for applying a coating solution to a peripheral portion of a substrate, includes: a holding and rotating part holding and rotating the substrate; a coating solution supply nozzle supplying the coating solution to the peripheral portion of the substrate; a moving mechanism moving the coating solution supply nozzle; and a controller controlling the holding and rotating part, coating solution supply nozzle, and moving mechanism, wherein the controller performs control of, while rotating the holding and rotating part: by controlling the moving mechanism while supplying the coating solution by the coating solution supply nozzle, both moving the coating solution supply nozzle from an outside of a perimeter of the substrate to a predetermined position at a periphery on the substrate at a first speed and then moving the coating solution supply nozzle from the predetermined position to the outside of the perimeter at a higher second speed.

A substrate processing apparatus includes a rotational holding member that rotates a substrate around a predetermined rotational axis while holding the substrate, a liquid supply member that supplies a liquid to the substrate held by the rotational holding member, and a resin-made tubular guard that surrounds the substrate held by the rotational holding member. The tubular guard has an inner peripheral surface and an uneven portion disposed at the inner peripheral surface. The uneven portion has a plurality of recessed portions and a plurality of protruding portions placed between the recessed portions adjacent to each other. The recessed portion has a width smaller than a diameter of a liquid droplet scattering from the substrate held by the rotational holding member and a depth in which the liquid droplet does not come into contact with a bottom portion of the recessed portion in a state in which the liquid droplet is in contact with the protruding portions. The protruding portion has a width that is smaller than the diameter of the liquid droplet and that is smaller than the width of the recessed portion.

A substrate processing apparatus includes a rotational holding member that rotates a substrate around a predetermined rotational axis while holding the substrate, a liquid supply member that supplies a liquid to the substrate held by the rotational holding member, and a resin-made tubular guard that surrounds the substrate held by the rotational holding member. The tubular guard has an inner peripheral surface and an uneven portion disposed at the inner peripheral surface. The uneven portion has a plurality of recessed portions and a plurality of protruding portions placed between the recessed portions adjacent to each other. The recessed portion has a width smaller than a diameter of a liquid droplet scattering from the substrate held by the rotational holding member and a depth in which the liquid droplet does not come into contact with a bottom portion of the recessed portion in a state in which the liquid droplet is in contact with the protruding portions. The protruding portion has a width that is smaller than the diameter of the liquid droplet and that is smaller than the width of the recessed portion.