B05C11/08

Spin dispenser module substrate surface protection system

A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

Spin dispenser module substrate surface protection system

A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

Substrate treatment device, substrate treatment method, and semiconductor device manufacturing method

According to an embodiment, the substrate treatment device includes a dilutor configured to dilute a first liquid containing a metal ion and exhibiting acidity. The device further includes a pH changer configured to change a pH of the first liquid before or after being diluted by the dilutor. The device further includes a substrate conditioner configured to treat the substrate using the first liquid, which is diluted by the dilutor and with the pH changed by the pH changer.

Substrate treatment device, substrate treatment method, and semiconductor device manufacturing method

According to an embodiment, the substrate treatment device includes a dilutor configured to dilute a first liquid containing a metal ion and exhibiting acidity. The device further includes a pH changer configured to change a pH of the first liquid before or after being diluted by the dilutor. The device further includes a substrate conditioner configured to treat the substrate using the first liquid, which is diluted by the dilutor and with the pH changed by the pH changer.

SPIN-COATING DEVICE
20230266669 · 2023-08-24 · ·

Provided is a spin-coating device including a film thickness measurement unit (1) and an operation adjustment unit (2). The film thickness measurement unit (1) measures a real-time thickness of a film formed of coating liquid by means of interferometry. The operation adjustment unit (2) adjusts operation of the spin-coating device in accordance with the real-time thickness of the film formed of the coating liquid.

SPIN-COATING DEVICE
20230266669 · 2023-08-24 · ·

Provided is a spin-coating device including a film thickness measurement unit (1) and an operation adjustment unit (2). The film thickness measurement unit (1) measures a real-time thickness of a film formed of coating liquid by means of interferometry. The operation adjustment unit (2) adjusts operation of the spin-coating device in accordance with the real-time thickness of the film formed of the coating liquid.

NANOFABRICATION SYSTEM WITH DISPENSING SYSTEM FOR ROTATIONAL DISPENSING
20220155677 · 2022-05-19 ·

A dispensing system comprises a first dispenser and a second dispenser each including a first end, a second end, a longitudinal axis extending through the first end and the second end, and a set of nozzles arranged about the longitudinal axis. The first dispenser is positioned relative to the second dispenser such that the longitudinal axis of the first dispenser is non-coaxial with the longitudinal axis of the second dispenser. The dispensing system also comprises a substrate chuck configured to hold a substrate and a rotation mechanism configured to rotate the substrate chuck around a rotation axis or configured to rotate the first dispenser and the second dispenser around the rotation axis.

Method for forming insulating film, apparatus for processing substrate, and system for processing substrate

There is provided a technique of forming an insulating film containing silicon oxide. A coating solution containing polysilazane is applied onto a wafer W, the solvent of the coating solution is volatilized, and the coating film is irradiated with ultraviolet rays in nitrogen atmosphere before performing a curing process. Dangling bonds are generated in silicon which is a pre-hydrolyzed site in polysilazane. Therefore, the energy for hydrolysis is reduced, and unhydrolyzed sites are reduced even when the temperature of the curing process is 350° C. Since efficient dehydration condensation occurs, the crosslinking rate is improved, and a dense (good-quality) insulation film is formed. By forming a protective film on the surface of the coating film to which ultraviolet rays irradiated, the reaction of dangling bonds prior to the curing process is suppressed.

Method for manufacturing coated object and coating substance spreading apparatus

A method for manufacturing a coated object and a coating substance spreading apparatus, which coat, as uniformly as possible, a coating substance on a curved coating target surface are provided. A method for manufacturing a coated object, the coated object being an object coated with a coating substance on a coating target surface Tf of the object T, the coating target surface Tf having a curved surface, includes dispensing the coating substance onto the coating target surface Tf; and revolving the object T, having the coating substance dispensed onto the coating target surface Tf, about a revolution axis 13a located remotely from the object T. A coating substance spreading apparatus 1 includes a revolution section 10 configured to revolve an object T about a revolution axis 13a located remotely from the object T. With these, a coating-substance-moving force that acts on each portion of the coating target surface Tf can be made close to an intensity proportional to a distance from the revolution axis 13a, and it is possible to suppress thickness differences or variation of the coating substance coated on the coating target surface Tf.

Method for manufacturing coated object and coating substance spreading apparatus

A method for manufacturing a coated object and a coating substance spreading apparatus, which coat, as uniformly as possible, a coating substance on a curved coating target surface are provided. A method for manufacturing a coated object, the coated object being an object coated with a coating substance on a coating target surface Tf of the object T, the coating target surface Tf having a curved surface, includes dispensing the coating substance onto the coating target surface Tf; and revolving the object T, having the coating substance dispensed onto the coating target surface Tf, about a revolution axis 13a located remotely from the object T. A coating substance spreading apparatus 1 includes a revolution section 10 configured to revolve an object T about a revolution axis 13a located remotely from the object T. With these, a coating-substance-moving force that acts on each portion of the coating target surface Tf can be made close to an intensity proportional to a distance from the revolution axis 13a, and it is possible to suppress thickness differences or variation of the coating substance coated on the coating target surface Tf.