A sealant filling device comprises a sealant board and a plurality of injectors installed on it, the sealant board comprises a base and a sealing cover which opening a plurality of sealing holes, the injector comprises a feeding hole which is opposite to the sealing holes, the sealant can be poured into the injector from the sealing holes to the feeding hole, a spring between the top of the injector and the sealing cover is provided for moving in control, while the volume of the sealant reaches the preset value, the spring will be control to move and seal off the sealing hole to stop sealing. If the volume of the sealant reaches the preset volume, then the controller IC will drive the spring moving and sealing off the sealing hole by controlling of the motor. The sealant volume in each injector can be separated distributed.

An apparatus and a process for removing a support structure from a 3D printed part, where the 3D printed part along with the support structure is placed in an acid solution and the part is surrounded by an induction heater. The acid solution is recirculated through the acid tank to prevent the acid solution from heating up too much. Small surfaces of the part are heated up by the induction heater before larger pieces are heated so that the acid will remove the smaller pieces first. After enough time, all of the support structure is removed by the acid and the heater to leave the finished 3D printed part with the support structure removed.

A device for inspecting a die coater including a first die, a second die, and a shim formed between the first die and the second die, includes a rail formed to be fixed long on one surface of the first die in a longitudinal direction of the die coater, and at least one sensor assembly configured to move along the rail and inspect a lip or the shim of the die coater, wherein the sensor assembly includes a movable part moving along the rail in the longitudinal direction of the die coater, and a sensor module connected to the movable part, and configured to move in a thickness direction of the die coater and inspect the lip or the shim.

A center-fed single cavity slot die (100) for coating particulate suspensions without creating the coating defect known as center banding. The die has a flow obstruction device (109) located in the die cavity (105) in a position such that the flow obstruction device blocks undisturbed straight-line flow of coating composition from the feed inlet to the die coating slot. Also, a coating process that employs the disclosed coating die. Types, shapes, sizes, and compositions of particles that may be used, and viscoities and particle concentrations of the coating composition which may be used.

A method of controlling a dispensing unit is used to dispense material on a substrate. The method includes connecting a solenoid coil of a pneumatically-driven pump to an amplifier output of a dispensing system, and driving the solenoid coil with the amplifier to a cause the pneumatically-driven pump to dispense material on a substrate. The method further may include commanding an idle current to flow in the solenoid coil during periods of inactivity. The idle current may be sufficient to cause warming of the solenoid coil, yet not sufficient to activate the solenoid to an engaged position. The method further may include commanding a first current level to flow in the solenoid coil to rapidly activate the solenoid, and commanding a second current level to flow in the solenoid coil after the solenoid is activated.

A solder supply device is provided with a solder cup housing liquid solder that is cylindrical and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; solder supplied from the tip of the nozzle section by the solder cup being moved; a magnet provided in the outer circumferential surface of the solder cup; and magnetic sensors able to detect the approaching of the magnet are provided at a position facing the outer circumferential surface of the solder container. Based on the positions of the magnet and the sensor, the post-movement position of the solder container is detected. Thus, it can be detected that solder has run out from inside the solder cup.

Provided is a system for supplying a photoresist. In an embodiment, a system for supplying a photoresist includes a pressure adjustment container provided to a supply line connected from a chemical liquid bottle to a first tank, and the pressure adjustment container includes a housing having a space formed therein, a separator separating the space of the housing into a first space and a second space, an inflow port making a photoresist flow in the first space, a discharge port discharging the photoresist from the first space, and a pressurized fluid inflow port supplying a pressurized fluid to the second space, and a volume of the first space varies depending on the supply of the pressurized fluid.

A substrate processing method includes applying a solution of a compound containing a metal oxide to a surface of a wafer to form a liquid film of the solution on the surface of the wafer, heating the liquid film at a first temperature lower than a crosslinking temperature of the compound, and irradiating the liquid film with energy rays to form a coating film containing the metal oxide on the surface, after heating the liquid film at the first temperature.

A system for dispensing a dental material comprises a cartridge from which the dental material is extrudable. The cartridge comprises a operating means and an interface for transmitting a cartridge output based on a user input. The system further has a dental dispensing device having a receptacle for receiving the cartridge and an interface for receiving the cartridge output. The system helps maximizing reliability and maximizing safety in operation for dispensing dental material.

A jetting device and/or fluid module include a module body defining a passageway extending through the module body and also partially defining a fluid chamber, a nozzle supported by the module body, a valve element at least partially within the fluid chamber, a biasing element contacting the valve element and also contacting the module body, and a sealing member contacting the periphery of the valve element and configured to partially define the fluid chamber. The nozzle defines a fluid outlet that is in fluid communication with the fluid chamber. The valve element has an upper portion outside of the fluid chamber that is adapted for contact with the drive pin, and the biasing element is configured to apply a spring force to the valve element. The valve element is configured to cause a droplet of the fluid to be jetted from the fluid outlet when the valve element is moved in the direction toward the nozzle.