Systems and methods for controlling adhesive application are disclosed. The systems and methods may include a controller and one or more sensors configured to measure an amount of adhesive applied to a plurality of substrates by a pump, detect a number of the substrates, determine an amount of adhesive applied per substrate, compare the adhesive applied per substrate to a target value, and adjust a pressure of the pump based on the comparison. The sensor(s) may include one or more of a valve sensor coupled to an adhesive supply, a flow rate sensor coupled to a manifold, a flow rate sensor coupled to one or more hoses, and a flow rate sensors coupled to a gun.

A temperature control device for a chemical liquid used in a semiconductor manufacturing process. The device includes: a first heat sink having a cooling water flow path formed therein; a plurality of thermoelectric modules coming into contact with both side surfaces of the first heat sink, respectively; and a second heat sink coming into contact with the thermoelectric modules. The second heat sink includes first and second heat sink blocks, a chemical liquid inlet tube and a chemical liquid outlet tube connected to the first and second heat sink blocks, and a plurality of chemical liquid flow path tubes inserted into the insides of the first and second heat sink blocks in such a manner as to communicate with one another and with the chemical liquid inlet tube and the chemical liquid outlet tube, respectively, to flow the chemical liquid therealong.

A modular fluid application device (10) includes a module base (12) and first and second fluid passageways extending within the module base and intersecting to form a nozzle fluid supply passageway. The modular fluid application device also includes a fluid outlet (22) formed on a nozzle mounting surface (24) of the module base fluidically connected to the nozzle fluid supply passageway, a base air passageway extending in the module base and an air outlet formed on the nozzle mounting surface fluidically connected to the base air passageway. A first module bank (14) is removably mounted on the module base and includes at least one first module having a first valve configured to control a flow of fluid in the first fluid passageway. A second module bank (18) is removably mounted on the module base and includes at least one second module having a second valve configured to control a flow of fluid in the second fluid passageway. The first module and the second module are mounted at an angle relative to one another.

In the hot-glue application system with a melter and components connected thereto, such as one or more heatable feeder pipes and one or more heatable application valves, the components contain a machine-readable and preferably also machine writable data storage medium.

An application system for applying a coating agent onto a component, in particular for applying a sealant onto a motor vehicle body part, includes a material supply for providing the coating agent, a temperature control device for controlling the temperature of the coating agent, an applicator for applying the coating agent, and a coating agent line between the material supply and the applicator. The temperature control device controls the temperature of the coating agent in the coating agent line downstream of the material supply.

Disclosed is a method of treating a substrate, the method including: adjusting a temperature of a treatment liquid by heating the treatment liquid with a heater unit installed in the circulation line while circulating the treatment liquid in a housing of a tank through a circulation line coupled to the housing; treating a substrate by supplying a temperature-controlled treatment liquid to the substrate in a normal mode; and discharging a treatment liquid in the circulation line to the outside of the circulation line through a drain line connected to the circulation line in an emergency mode.

A dispenser for dispensing a liquid onto a substrate is disclosed. The dispenser includes a liquid supply and a dispenser module. The dispenser module includes a nozzle body having an inlet, an outlet, and a chamber for receiving the liquid. The dispenser module also includes a central valve body attached to the nozzle body that defines a piston chamber and a valve member having a piston portion disposed within the piston chamber of the central valve body and a needle portion extending form the piston portion into the chamber of the nozzle body. The dispenser further includes a heater block for heating the nozzle body. The heater block defines a liquid passage for transporting liquid from the liquid supply to the dispenser, a first surface of the heater block directly contacts the nozzle body, and the entirety of the central valve body is spaced from the heater block.

A hot melt adhesive supply system is disclosed. The hot melt adhesive supply system includes an outer container defining an upper cavity and a lower cavity. The upper cavity includes an inner container having a top opening to receive unmelted hot melt adhesive pieces and a bottom aperture. The system also includes a dispensing mechanism between the upper cavity and the lower cavity. The dispensing mechanism regulates the dispensing of the unmelted hot melt adhesive pieces from the upper cavity to the lower cavity. The dispensing mechanism includes a base plate and one or more rotating members that rotate to move the unmelted hot melt adhesive pieces through a gap defined between the base plate and the bottom aperture. The system also includes a transfer conduit that communicates the unmelted hot melt adhesive pieces from the lower cavity to a hot melt adhesive melter.

A jetting dispensing module includes a module body with a fluid bore. A nozzle element is coupled to the module body. The nozzle element includes a fluid reservoir communicating with the fluid bore of the module body and a dispensing passage. A guide element includes a main guide bore and an internal fluid space in fluid communication with the fluid bore. A plunger is mounted for reciprocating movement within the module body. The plunger extends through the main guide bore and into the internal fluid space, and includes a distal end moveable between a fully retracted position spaced from the fluid reservoir and a fully extended position within the fluid reservoir but out of contact with the nozzle element.

A device for melting adhesive having a melting grill that has a multiplicity of passage openings, and heating elements, wherein the melting grill is heatable by the heating elements and melted adhesive heated by the hot melting grill is dischargeable through the passage openings, the melting grill on that side thereof that faces the adhesive to be melted having ribs. The melting grill has rotatable rods that are disposed beside one another and ribs that are disposed on the rods, the rods and the ribs being heatable by the heating elements, wherein ribs of adjacent rods are aligned so as to be directed toward one another, and the passage cross sections of the passage openings between the rods are modifiable by rotating rods of the melting grill. The device enables varied forms of delivery of solid adhesive to be melted at a high specific melting rate without the adhesive thereby being subjected to damage due to excessive thermal stress.