The present disclosure provides a glue supply device for a labeling unit with a glue printer, comprising: a storage tank for glue, a supply line for supplying glue from the storage tank to the glue printer, a continuously delivering glue pump which is embodied to deliver glue from the storage tank into the supply line, and a hydropneumatic reservoir for the glue, wherein the hydro-pneumatic reservoir is arranged at the supply line upstream of the glue printer.

A device for coating material with resin and subsequently laying the material saturated with the resin onto a surface, the device comprising a vessel for retaining the resin, the vessel having a slot sized and configured so that the material is passable through the slot after being coated with resin retained in the vessel, and a first and a second roller being arranged on either side of the slot or behind the slot.

An adhesive dispensing system and method are configured to melt adhesive on demand and maintain the adhesive in a liquid state between dispensing cycles. The dispensing system includes a dispensing applicator with a manifold passage, a receiving device including a receiving chamber for holding a small amount of solid adhesive at the dispensing applicator and a first heating device for melting the adhesive on demand, and a second heating device at the manifold to maintain the temperature of the melted adhesive before dispensing. The receiving device is positioned adjacent to or partially nested within a manifold of the dispensing applicator such that the melted adhesive is delivered directly into the dispensing applicator. The second heating device applies heat energy to maintain the adhesive in the manifold passage as a liquid.

A system for circulating a sealer is provided. The system includes a circulation line, in which a sealer is circulated and a first circulation valve which is disposed in the circulation line and configured to control the circulated sealer. A supply line is branched from a front end of the first circulation valve and an applying gun which is disposed in the supply line, receives a sealer, and controls the sealer discharged to the outside through a nozzle.

A system for testing an integrated-circuit wafer includes a probe card and a dispenser assembly. The probe card includes a circuit board and a probe needle coupled to the circuit board. The dispenser assembly is coupled to the probe card and is configured to deliver a metered amount of dielectric fluid to the tip of the probe needle. Methods are also disclosed.

A material supply device is provided, to eliminate bubbles in materials supplied by the material storage tank to the glue supply syringe. The material supply device includes: a material storage tank; a material supply tank provided with a material supply outlet; and a bubble elimination component, configured to be in communication with the material storage tank and the material supply tank and eliminate bubbles in materials supplied by the material storage tank to the material supply tank.

The purpose is to provide a discharge system that can reduce an adhered amount of fluid to a coupler on a discharging device side to be smaller than an adhered amount of the fluid to a coupler on a refilling device side during a refilling operation of the fluid to the discharging device. A discharge system includes a discharging device capable of discharging the fluid and a refilling device capable of refilling the discharging device with the fluid. A refill-side coupler provided to the refilling device side and a discharge-side coupler provided to the discharging device side is fitted and connected to refill the discharging device side with the fluid from the refilling device side.

The present invention relates to a pulsation damping system for a paint spray device for spraying paint including a pulsation damper for damping the pulsation of a paint stream, wherein the pulsation damper includes a housing, a chamber, a chamber inlet, a chamber outlet and a damping means. In this connection, an opening of the chamber outlet comprises a cross sectional area which is smaller than a cross sectional area of an opening of the chamber inlet, and as a result forms a throttle.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a head unit configured to discharge an ink to a substrate; a supply unit configured to supply the ink to the head unit and including a reservoir having an inner space; and a pressure adjusting unit configured to adjust a pressure of the inner space, and wherein the pressure adjusting unit comprises: a first pressure adjusting unit; and a second pressure adjusting unit in which a size for changing a pressure of the inner space per unit time is greater than the first pressure adjusting unit.

A resin dispensing apparatus includes a supply unit including a syringe having an internal space configured to hold a phosphor-containing resin. An agitator is disposed in the internal space. The supply unit is configured to rotate at least one of the syringe and the agitator to prevent settling of phosphor contained in the phosphor-containing resin. A discharge unit includes a cylinder having a discharge nozzle through which the phosphor-containing resin, received through a connecting pipe connected to the syringe, is discharged. A piston provides pressure to discharge the phosphor-containing resin through the discharge nozzle inside the cylinder.