An interbody spinal cage comprising: a body portion comprising a superior side, an inferior side and at least one lateral side connecting the superior side and the inferior side; and at least one endplate portion coupled to the superior side or the inferior side of the body portion, the at least one endplate portion comprising a unibody structure and operable to be fixedly coupled to an anatomical structure of a patient and decoupled from the superior side or the inferior side of the body portion.

A removable coating for protecting process chamber components from excess material resulting from operation of a process chamber. The removable coating including a sheet. A bonding surface of the sheet to be releasably bonded to a process chamber component to be protected. A deposition surface of the coating selected to receive and retain the excess material. In an aspect, the coating may further include a deposition layer bonded to a sheet surface in opposition to the bonding surface. The deposition layer providing the deposition surface. In some aspects the deposition surface may be provided of a different material from the process chamber component. In some aspects, and method and system are provided for protecting process chamber components.

Methods and apparatus for selectively depositing a layer atop a substrate having a metal surface and a dielectric surface is disclosed, including: (a) contacting the metal surface with one or more metal halides such as metal chlorides or metal fluorides to form an exposed metal surface; (b) growing an organosilane based self-assembled monolayer atop the dielectric surface; and (c) selectively depositing a layer atop the exposed metal surface of the substrate, wherein the organosilane based self-assembled monolayer inhibits deposition of the layer atop the dielectric surface.

A method of masking a feature of a substrate using a fixture includes removably coupling a fixture to a first side of the feature of the substrate, the fixture including walls configured to abut sides of the feature and extend beyond a top surface of the feature when the fixture is removably coupled to the first side. The method further includes applying a masking material to the top surface of the feature. The method further includes removably coupling the fixture to a second side of the feature, the second side opposing the first side, the walls of the fixture configured to abut the sides of the feature and extend beyond a bottom surface of the feature when the fixture is removably coupled to the second side. The method further includes applying the masking material to the bottom surface of the feature while the fixture is removably coupled.

According to various embodiments, a method for processing a carrier may include: forming a layer structure over the carrier, the layer structure including a support layer and a two-dimensional layer over the support layer; wherein the layer structure has at least one opening that exposes a portion of the carrier; forming an auxiliary layer structure, wherein the auxiliary layer structure at least partially covers the layer structure and at least partially fills the at least one opening; and removing the support layer of the layer structure.

A partial plating method for a resin part of a vehicle may include a masking step of applying masking paint on an injection molded product made of a plastic resin to divide the injection molded product into a plating area on which a metal component is to be plated and a non-plating area on which the metal component is not to be plated, an etching step of etching the masked injection molded product in an etching solution to elute some components of the resin from the plating area, and an electroplating step of electroplating the etched injection molded product in a plating bath.

A method of forming an article includes forming a plurality of channels and ridges in a silicon-containing layer on a surface of a substrate of the article using a mask placed on the surface of the substrate or the silicon-containing layer.

A method of coating a three-dimensional curved substrate with electrical conductive ink may include: preparing a curved substrate having a radius of curvature, a patterned curved mask having the same radius of curvature, and a curved slit-type sprayer having the same radius of curvature; covering the curved substrate with the curved mask; spraying a conductive ink toward the curved substrate and the curved mask from the curved slit-type sprayer spaced apart from the curved mask by a predetermined distance; drying the curved substrate and the curved mask; and removing the curved mask from the curved substrate.

A method of forming a photo-cured layer on a substrate can comprise using a first photocurable composition and a second photocurable composition, wherein both photocurable compositions may contain the same types of polymerizable monomers but in different concentration ratios. The concentration ratios of the monomers in each of the two photocurable compositions can be adapted that the uneven loss of one type of monomer from the first photocurable composition due to unwanted evaporation in certain regions of the substrate may be compensated by the second photocurable composition, which contains a higher amount of said monomer. The two photocurable compositions can further be adapted to easily merge to a combined layer with a very even distribution of the polymerizable monomers. This may allow forming photo-cured layers having an excellent homogeneous material structure throughout the layer.

A coating and developing method includes: a step that applies a resist containing a metal to a front surface of a substrate to form a resist film, and exposes the resist film; a developing step that supplies a developer to the front surface of the substrate to develop the resist film; and a step that forms, before the developing step, a first protective film on a peripheral part of the substrate on which the resist film is not formed, so as to prevent the developer from coming into contact with the peripheral part of the substrate, wherein the first protective film is formed at least on a peripheral end surface and a peripheral portion of a rear surface of the substrate in the peripheral part of the substrate.