Methods and apparatus for selectively depositing a layer atop a substrate having a metal surface and a dielectric surface is disclosed, including: (a) contacting the metal surface with one or more metal halides such as metal chlorides or metal fluorides to form an exposed metal surface; (b) growing an organosilane based self-assembled monolayer atop the dielectric surface; and (c) selectively depositing a layer atop the exposed metal surface of the substrate, wherein the organosilane based self-assembled monolayer inhibits deposition of the layer atop the dielectric surface.

A process capable of commercial scale manufacturing of inexpensive, shaped film products includes placing a mask over a substrate; delivering a film-forming composition through a nozzle to form a raw shape on the substrate; removing the mask; and solidifying the film-forming composition to provide the shaped film product disposed on the substrate. The mask has a delivery surface and an opposite substrate-facing surface and at least one aperture having a design corresponding to the desired shaped film product. The nozzle is disposed in sealing engagement with the delivery surface of the mask to the at least one aperture of the mask during delivery of the film-forming composition.

A substrate processing method according to an exemplary embodiment includes: supplying, to a peeling target portion which is at least a portion of a coating film including a first coating film and a second coating film, a chemical liquid for enhancing a peeling performance between the first coating film and the second coating film, the first coating film being formed on a surface of a substrate, the second coating film being formed on the first coating film and containing carbon with a different composition from that of the first coating film; amplifying a temperature fluctuation of the peeling target portion to which the chemical liquid has been supplied; and supplying a rinse liquid for removing the second coating film to the peeling target portion after the amplification of the temperature fluctuation.

A description is given of a method for producing plastic components for a vehicle, wherein the plastic components are at least partially painted in a painting step and then connected on the non-painted areas to further components, wherein at least one region, which is used for connecting to the further components, is masked by a preceding application process of applying a sealing, detachable polymer.

An underlayer film-forming composition for a self-assembled film having a polymer including 0.2% by mole or more of a unit structure of a polycyclic aromatic vinyl compound relative to all unit structures of the polymer. The polymer includes 20% by mole or more of a unit structure of an aromatic vinyl compound relative to all the unit structures of the polymer and includes 1% by mole or more of a unit structure of the polycyclic aromatic vinyl compound relative to all the unit structures of the aromatic vinyl compound. The aromatic vinyl compound includes an optionally substituted vinylnaphthalene, acenaphthylene, or vinylcarbazole, and the polycyclic aromatic vinyl compound is vinylnaphthalene, acenaphthylene, or vinylcarbazole. The aromatic vinyl compound includes an optionally substituted styrene and an optionally substituted vinylnaphthalene, acenaphthylene, or vinylcarbazole, and the polycyclic aromatic vinyl compound is vinylnaphthalene, acenaphthylene, or vinylcarbazole.

A display device according to one or more exemplary embodiments of the present invention includes: a display panel; a window on the display panel; an active surface layer on the window; and a hard coating layer on the active surface layer and having a curved surface.

The present invention, relates, to a process, for producing structured coatings, in which a coating composition comprising at least one inorganic binder, at least one oxide pigment which, after addition of a mixture consisting of 15 ml of 1 M oxalic acid and 15 ml of 20% aqueous hydrochloric acid based on 1 g of substance, under standard conditions, leads to a temperature rise of at least 4 C., and at least one solvent is applied to a substrate, the resulting coating composition film is partially coated with a photoresist and the substrate coated with the coating composition and the photoresist is treated with an acid, to the structured layers obtainable by the process and to the use thereof.

A method for preparing a die for molding of a Fresnel lens includes obtaining a first die block that defines at least one or more portions of a Fresnel lens. The one or more portions defined in the first die block correspond to a plurality of slope facets and a plurality of draft facets. The method also includes adding textures to one or more portions of the first die block that correspond to at least a portion of the plurality of draft facets. A method of making a Fresnel lens includes obtaining the first die block, obtaining a second die block, and coupling the first and the second die blocks. The method also includes providing a molding material into a space defined between the first and the second die blocks, curing the molding material, and removing the Fresnel lens from the first and/or the second die block.

A method to produce a multilayer ceramic electronic component includes forming supports by an ink jet printing method to produce a green multilayer ceramic capacitor. A green ceramic layer and outer electrodes of the multilayer ceramic electronic component are formed by the ink jet printing method while the supports define peripheries of the green ceramic layer and the outer electrodes. When fired, the green multilayer ceramic electronic component is converted to a sintered multilayer ceramic electronic component, and the supports disappear by heating.

A coating and developing method includes: a step that applies a resist containing a metal to a front surface of a substrate to form a resist film, and exposes the resist film; a developing step that supplies a developer to the front surface of the substrate to develop the resist film; and a step that forms, before the developing step, a first protective film on a peripheral part of the substrate on which the resist film is not formed, so as to prevent the developer from coming into contact with the peripheral part of the substrate, wherein the first protective film is formed at least on a peripheral end surface and a peripheral portion of a rear surface of the substrate in the peripheral part of the substrate.