B05D1/38

Metal-alloy graphene nanocomposites and methods for their preparation and use

Methods of forming a metal-alloy graphene nanocomposites are provided. The methods include providing a graphene substrate and forming a conducting polymer layer on a first major surface of the graphene substrate. The methods also include pyrolyzing the conducting polymer layer to form a nitrogen-doped graphene substrate and dispersing a plurality of metal-alloy nanoparticles on a first surface of the nitrogen-doped graphene substrate to form the nanocomposite.

Method of manufacturing multi-layer thin film, member including the same and electronic product including the same

Disclosed herein is a method of forming a multilayer thin film by depositing target particles, detached from a target by plasma discharge of inert gas, on a metal object using a multilayer thin film deposition apparatus and a multilayer thin film formed by the method. More specifically, a sputtering deposition apparatus is used as the multilayer thin film deposition apparatus. The method includes coating a metal object with a coating layer, depositing at least one hardness-enhancing layer on the coating layer, and depositing a color layer on the at least one hardness-enhancing layer.

PREVENTION OF HYDROPHOBIC DEWETTING THROUGH NANOPARTICLE SURFACE TREATMENT

Disclosed in this specification is a method for coating a substrate to prevent dewetting. A suspension of nanoparticles is deposited onto the substrate to produce a nanoparticle layer. The nanoparticle layer is then coated with a monomer. The monomer polymerizes on the nanoparticle layer to produce a polymeric layer.

PREVENTION OF HYDROPHOBIC DEWETTING THROUGH NANOPARTICLE SURFACE TREATMENT

Disclosed in this specification is a method for coating a substrate to prevent dewetting. A suspension of nanoparticles is deposited onto the substrate to produce a nanoparticle layer. The nanoparticle layer is then coated with a monomer. The monomer polymerizes on the nanoparticle layer to produce a polymeric layer.

Composition for forming underlayer film of self-assembled film including aliphatic polycyclic structure

A composition for forming an underlayer film necessary for facilitating alignment of self-assembled film into desired vertical pattern. Composition for forming an underlayer film of self-assembled film including a polymer having unit structure containing aliphatic polycyclic structure of aliphatic polycyclic compound in main chain. The polymer is a polymer having unit structure containing aliphatic polycyclic structure of aliphatic polycyclic compound with aromatic ring structure of aromatic ring-containing compound or polymer chain derived from vinyl group of vinyl group-containing compound in main chain. The polymer has unit structure of Formula (1):
private use character ParenopenstX—Yprivate use character Parenclosest  Formula (1)
wherein X is single bond, divalent group having vinyl structure as polymer chain, or divalent group having aromatic ring-containing structure as polymer chain, and Y is divalent group having aliphatic polycyclic structure as polymer chain. The aliphatic polycyclic compound is bi- to hexa-cyclic diene compound. The aliphatic polycyclic compound is dicyclopentadiene or norbornadiene.

Composition for forming underlayer film of self-assembled film including aliphatic polycyclic structure

A composition for forming an underlayer film necessary for facilitating alignment of self-assembled film into desired vertical pattern. Composition for forming an underlayer film of self-assembled film including a polymer having unit structure containing aliphatic polycyclic structure of aliphatic polycyclic compound in main chain. The polymer is a polymer having unit structure containing aliphatic polycyclic structure of aliphatic polycyclic compound with aromatic ring structure of aromatic ring-containing compound or polymer chain derived from vinyl group of vinyl group-containing compound in main chain. The polymer has unit structure of Formula (1):
private use character ParenopenstX—Yprivate use character Parenclosest  Formula (1)
wherein X is single bond, divalent group having vinyl structure as polymer chain, or divalent group having aromatic ring-containing structure as polymer chain, and Y is divalent group having aliphatic polycyclic structure as polymer chain. The aliphatic polycyclic compound is bi- to hexa-cyclic diene compound. The aliphatic polycyclic compound is dicyclopentadiene or norbornadiene.

METAL COATED RESIN PARTICLES, METHOD FOR PRODUCING SAME, CONDUCTIVE PASTE CONTAINING METAL COATED RESIN PARTICLES, AND CONDUCTIVE FILM

Metal coated resin particles include: spherical core resin particles; and a metal coated layer provided on a surface of each of the core resin particles, in which the metal coated layer consists of: a first silver layer formed on the surface of each of the core resin particles; a tin intermediate layer consisting of one or more of metallic tin and/or tin compounds selected from the group consisting of tin (Sn), tin oxide (Sn.sub.xO.sub.y), and tin hydroxide (Sn.sub.x(OH).sub.y) formed on a surface of the first silver layer (where, 0.1<x<4, 0.1<y<5); and a second silver layer formed on a surface of the tin intermediate layer.

METAL COATED RESIN PARTICLES, METHOD FOR PRODUCING SAME, CONDUCTIVE PASTE CONTAINING METAL COATED RESIN PARTICLES, AND CONDUCTIVE FILM

Metal coated resin particles include: spherical core resin particles; and a metal coated layer provided on a surface of each of the core resin particles, in which the metal coated layer consists of: a first silver layer formed on the surface of each of the core resin particles; a tin intermediate layer consisting of one or more of metallic tin and/or tin compounds selected from the group consisting of tin (Sn), tin oxide (Sn.sub.xO.sub.y), and tin hydroxide (Sn.sub.x(OH).sub.y) formed on a surface of the first silver layer (where, 0.1<x<4, 0.1<y<5); and a second silver layer formed on a surface of the tin intermediate layer.

Cyclic Spin-On Coating Process for Forming Dielectric Material
20220367180 · 2022-11-17 ·

The present disclosure is generally related to semiconductor devices, and more particularly to a dielectric material formed in semiconductor devices. The present disclosure provides methods for forming a dielectric material layer by a cyclic spin-on coating process. In an embodiment, a method of forming a dielectric material on a substrate includes spin-coating a first portion of a dielectric material on a substrate, curing the first portion of the dielectric material on the substrate, spin-coating a second portion of the dielectric material on the substrate, and thermal annealing the dielectric material to form an annealed dielectric material on the substrate.

One-component type polyurethane resin composition for preventing detachment of concrete pieces and tiles and method for preventing detachment of concrete pieces and tiles using same

A one-component type polyurethane resin composition for preventing detachment of concrete pieces and tiles containing an isocyanate group-containing urethane prepolymer (A) and a thixotropy-imparting agent (B), and a method for forming a reinforcing layer on a surface of a concrete structure or tiled wall containing a resin coated film composed thereof, in order to provide a one-component type polyurethane resin composition for preventing detachment of concrete pieces and tiles, which has improved workability by being able to be applied with a trowel or brush, forms a transparent resin coated film after reactive curing that has improved weather resistance without applying a top coat, facilitates diagnosis of deterioration of concrete by being carried out visually during maintenance of concrete structures, is able to maintain the existing appearance of the tiled exteriors of buildings and other structures and eliminates dispersion to surrounding areas during application.