B05D1/38

Method for treating the surface of a metallic substrate

An advantageous method for treating the surface of a metallic substrate made of aluminum or an aluminum alloy, comprising the following steps: providing a water-based mixture with a sol, comprising alkoxy silanes of general chemical formula Si(OR).sub.4 and organoalkoxy silanes of general chemical formula R″Si(OR′).sub.3, in which R and R′ are linear or branched, short-chained hydrocarbon groups with at least one hydroxyl group and R″ is an organic group with a glycidoxy-, merkapto-, amino-, methacryl-, allyl- and/or vinyl-group, applying the mixture to the surface of the metallic substrate and at least in sections, hardening the mixture with a formation of a sol-gel coating connected to the metallic substrate.

Method for treating the surface of a metallic substrate

An advantageous method for treating the surface of a metallic substrate made of aluminum or an aluminum alloy, comprising the following steps: providing a water-based mixture with a sol, comprising alkoxy silanes of general chemical formula Si(OR).sub.4 and organoalkoxy silanes of general chemical formula R″Si(OR′).sub.3, in which R and R′ are linear or branched, short-chained hydrocarbon groups with at least one hydroxyl group and R″ is an organic group with a glycidoxy-, merkapto-, amino-, methacryl-, allyl- and/or vinyl-group, applying the mixture to the surface of the metallic substrate and at least in sections, hardening the mixture with a formation of a sol-gel coating connected to the metallic substrate.

Surface coatings, treatments, and methods for removal of mineral scale by self-release

In some aspects, the present invention relates generally to self-release compositions and methods useful for the removal or prevention of mineral scaling and, more particularly, to surface coatings and surface treatments that resist, prevent, or aid in removal of mineral scaling. In some aspects, the self-release coating includes a polyhedral oligomeric silsesquioxane and a thermoplastic or an additive.

Metal packaging powder coating compositions, coated metal substrates, and methods

Powder coating compositions, particularly metal packaging powder coating compositions, coated metal substrates, and methods; wherein the powder coating compositions include powder polymer particles comprising a polymer having a number average molecular weight of at least 2000 Daltons, wherein the powder polymer particles have a particle size distribution having a D50 of less than 25 microns; and, in certain embodiments, one or more charge control agents in contact with the powder polymer particles.

Metal packaging powder coating compositions, coated metal substrates, and methods

Powder coating compositions, particularly metal packaging powder coating compositions, coated metal substrates, and methods; wherein the powder coating compositions include powder polymer particles comprising a polymer having a number average molecular weight of at least 2000 Daltons, wherein the powder polymer particles have a particle size distribution having a D50 of less than 25 microns; and, in certain embodiments, one or more charge control agents in contact with the powder polymer particles.

Device and method for producing highly porous, crystalline surface coatings

The present invention relates to a device, the use thereof and a method for producing highly porous, crystalline surface coatings comprising at least two spraying devices operating in sequential sequence for applying coating agents from the storage vessels (3, 4) to a material arranged on a sample holder (1) and at least one rinsing device (5, 13, 16) for removing unbound molecules from the coated surface.

Device and method for producing highly porous, crystalline surface coatings

The present invention relates to a device, the use thereof and a method for producing highly porous, crystalline surface coatings comprising at least two spraying devices operating in sequential sequence for applying coating agents from the storage vessels (3, 4) to a material arranged on a sample holder (1) and at least one rinsing device (5, 13, 16) for removing unbound molecules from the coated surface.

METHODS, SYSTEMS, AND COMPOSITIONS FOR THE LIQUID-PHASE DEPOSITION OF THIN FILMS ONTO THE SURFACE OF BATTERY ELECTRODES
20220045307 · 2022-02-10 ·

Methods, systems, and compositions for the liquid-phase deposition (LPD) of thin films. The thin films can be coated onto the surface of porous components of electrochemical devices, such as battery electrodes. Embodiments of the present disclosure achieve a faster, safer, and more cost-effective means for forming uniform, conformal layers on non-planar microstructures than known methods. In one aspect, the methods and systems involve exposing the component to be coated to different liquid reagents in sequential processing steps, with optional intervening rinsing and drying steps. Processing may occur in a single reaction chamber or multiple reaction chambers.

METAL PACKAGING POWDER COATING COMPOSITIONS, COATED METAL SUBSTRATES, AND METHODS
20220228006 · 2022-07-21 ·

Powder coating compositions, particularly metal packaging powder coating compositions, coated metal substrates, and methods; wherein the powder coating compositions include powder polymer particles comprising a polymer having a number average molecular weight of at least 2000 Daltons, wherein the powder polymer particles have a particle size distribution having a D50 of less than 25 microns; and, in certain embodiments, one or more charge control agents in contact with the powder polymer particles.

METAL PACKAGING POWDER COATING COMPOSITIONS, COATED METAL SUBSTRATES, AND METHODS
20220228006 · 2022-07-21 ·

Powder coating compositions, particularly metal packaging powder coating compositions, coated metal substrates, and methods; wherein the powder coating compositions include powder polymer particles comprising a polymer having a number average molecular weight of at least 2000 Daltons, wherein the powder polymer particles have a particle size distribution having a D50 of less than 25 microns; and, in certain embodiments, one or more charge control agents in contact with the powder polymer particles.