Apparatus and method useful for, among other things, providing a layer by layer coating of materials on a substrate.

Apparatus and method useful for, among other things, providing a layer by layer coating of materials on a substrate.

The present invention provides a hydrophobic surface coating and a preparation method therefor. The hydrophobic surface coating uses one or more fluorinated alcohol compounds as a reaction gas material, and is formed on a surface of a base body by a plasma-enhanced chemical vapor deposition method, to improve the hydrophobicity, the chemical resistance, and the weatherability of the surface of the base body.

This disclosure relates to a substrate treating method and a treatment liquid. The substrate treating method includes a treatment liquid supplying step, a solidified film forming step, and a sublimation step. In the treatment liquid supplying step, a treatment liquid is supplied to a substrate. The treatment liquid contains a sublimable substance, a solvent, and a surfactant. In the solidified film forming step, the solvent and the surfactant evaporate from the treatment liquid on the substrate. In the solidified film forming step, a solidified film containing the sublimable substance is formed on the substrate. In the sublimation step, the solidified film sublimates. The surfactant has an octanol-water partition coefficient LOGPow of ?1 or more and 1 or less. Vapor pressure Pc of the surfactant at room temperature is 0.9 times or more and 3 times or less vapor pressure Pb of the solvent at room temperature.

A method of manufacturing a film includes disposing a substrate under one side of a baffle plate in a film manufacturing space, the baffle plate having a plurality of through-holes, and spraying an inert gas toward the substrate through a plurality of nozzle tips branched from a gas distribution pipe that is disposed over an other side of the baffle plate such that the inert gas penetrates the baffle plate through the through-holes.

There is provided a coating method which can apply a coating solution uniformly onto a substrate surface while reducing the amount of the coating solution supplied. The coating method for applying a coating solution onto a wafer includes the steps of: supplying a solvent for the coating solution onto the wafer to form an annular liquid film of the solvent in a peripheral area of the wafer; supplying the coating solution to the center of the wafer while rotating the wafer at a first rotational speed (time t.sub.1-t.sub.2); and allowing the coating solution to spread on the wafer by rotating the wafer at a second rotational speed which is higher than the first rotational speed (time t.sub.4-t.sub.5). The supply of the solvent is continued until just before the coating solution comes into contact with the liquid film of the solvent (time t.sub.0-t.sub.3).

It is provided in a liquid application system for applying liquid to a material cake transported on a conveyor device having a liquid application device, that the conveyor device comprises a porous section on which the material cake lies or which the material cake contacts and which is permeable for a liquid to be applied, that the liquid application device comprises an application device via which the liquid to be applied can be applied to the side of the porous section of the conveyor device facing away from the material cake, and that the liquid application device comprises an overpressure chamber having a first overpressure relative to the environment by which the porous section of the conveyor device passes, wherein the applied liquid can be transported via the first overpressure through the porous section of the conveyor device or held via the first overpressure to the porous section.

An ultraviolet curing apparatus having: a roller for guiding a film coated with a resin; a first nitrogen gas introduction port and a second nitrogen gas introduction port for introducing nitrogen gas; a UV irradiation portion for irradiating the film with ultraviolet rays from between the first nitrogen gas introduction port and the second nitrogen gas introduction port; an oxygen concentration meter for measuring an oxygen concentration between the film and the UV irradiation portion; an air introduction port for introducing air between the film and the UV irradiation portion; and a controller for controlling at least any one of: an amount of air introduced from the air introduction port, an amount of nitrogen gas introduced from the first nitrogen gas introduction port, and an amount of nitrogen gas introduced from the second nitrogen gas introduction port, so that the oxygen concentration is within a preset oxygen concentration set range.

The present invention provides a method for forming an oxide film by which normal formation of an oxide film is always achieved without receiving an influence of a change in the atmosphere, a metal oxide film having a low resistance can be formed, and a high efficiency of film formation is obtained. In the present invention, a raw material solution containing an alkyl compound is formed into a mist and ejected to a substrate (100) in the atmosphere. Additionally, an oxidizing agent that exerts an oxidizing effect on the alkyl compound is supplied to the mist of the raw material solution. Through the above-described processes, an oxide film is formed on the substrate in the present invention.

The invention relates to a structured surface with omniphobic properties, a method for producing said surface and the use thereof. When liquids are contacted with the structured surface the surface tension of the liquid is significantly increased. The omniphobic surface has a contact angle of >90 with respect to low-energy liquids such as squalene, as well as with respect to higher energy liquids such as water.