A coating composition for pattern inversion that fills a gap in an organic underlayer film pattern formed on a substrate to be processed by transferring a resist pattern to an underlayer and forms a flat polysiloxane film, the coating composition including a polysiloxane obtained by a reaction of an alcohol with a silanol group in a hydrolysis-condensate of a hydrolysable silane having a hydrolysable silane containing in the molecule four hydrolysable groups, in a ratio of 50% by mole to 100% by mole relative to the total amount of silanes. The hydrolysable silane is represented by Formula (1):
R.sup.1.sub.aSi(R.sup.2).sub.4-aFormula (1)
and contains 50% by mole to 100% by mole of a hydrolysable silane in which a is 0 and 0% by mole to 50% by mole of a hydrolysable silane in which a is 1 or 2. The alcohol is propylene glycol monomethyl ether, propylene glycol monoethyl ether, or 3-methoxybutanol.

The present invention relates to a process for producing a surface-functionalized molding (oF) having a functionalized surface (fO). In this process a surface (O) of a molding (F) is brought into contact with a dienophile-containing solution (dL). The surface (O) comprises a polyamide (P) which comprises furan units. These furan units are able to react with the at least one dienophile present in the dienophile-containing solution (dL) to give the surface-functionalized molding (oF) having the functionalized surface (fO).

Floor panels that includes a substrate and a multi-layered top layer directed attached to the substrate. The multi-layered top layer includes a dcor layer that includes a fused PVC plastisol, a print pattern deposited as single or stacked dots of a digitally printed material on top of the dcor layer, a wear-resistant layer including a fused PVC plastisol provided above the print pattern. Optionally, a lacquer layer is provided directly on top of the wear-resistant layer.

A method of forming a film layer and a substrate comprising the film layer to reduce occurrence of defects and improve the quality of the film layer are described. The method of forming a film layer comprises forming a plurality of sub-film layers of a same material overlapped with each other on a substrate by multiple steps to constitute the film layer, wherein each time a sub-film layer is formed, the newly-formed sub-film layer is cleaned immediately. The substrate comprises a film layer formed by the above method.

There is provided a method of wetting a low surface energy substrate with a high surface tension liquid comprising at least the steps of providing a low surface energy substrate having a surface energy in the range of from 15 to 45 mN/m, a high surface tension liquid having a surface tension in the range of from greater than 25 to 70 mN/m and a low surface tension fluid having a surface tension in the range of from 10 to 25 mN/m; contacting the low surface energy substrate with the high surface tension liquid; contacting at least one of the low surface energy substrate and the high surface tension liquid with the low surface tension fluid vapour, either before, at the same time as or after the contacting of the low surface energy substrate with the high surface tension liquid; and removing the low surface tension fluid vapour from the low surface energy substrate. The high surface tension liquid can be used as a carrier liquid for a coating material, such as an ion exchange material, to be deposited on the substrate, such as ePTFE, in a method of coating. Also disclosed is a system for such coating methods.