Patent classifications
B05D7/04
ULTRA-THIN COMPOSITE TRANSPARENT CONDUCTIVE FILM AND PREPARATION METHOD THEREFOR
Disclosed is an ultra-thin composite transparent conductive film, comprising: a transparent substrate; a first UV glue layer disposed on one side of the transparent substrate, pattern-imprinted and cured to form a first grid-shaped groove and a first lead groove, the first grid-shaped groove and the first lead groove being filled with conductive materials to form a first conductive layer and a first lead region respectively, depth of the first grid-shaped groove and the first lead groove being smaller than a thickness of the first UV glue layer; a second UV glue layer disposed on one side of the first UV glue layer away from the transparent substrate and used as a reinforced insulating support layer; and a third UV glue layer disposed on one side of the second UV glue layer away from the transparent substrate, pattern-imprinted and cured to form a second grid-shaped groove and a second lead groove, the second grid-shaped groove and the second lead groove being filled with conductive materials to form a second conductive layer and a second lead region respectively, and depth of the second grid-shaped groove and the second lead groove being not greater than a thickness of the third UV glue layer. The ultra-thin composite transparent conductive film has a simple structure and a simplified and stable preparation process, a reduced preparation cost, and can be used widely.
DEGRADABLE RESIN MOLDING AND PRODUCTION METHOD FOR DEGRADABLE RESIN MOLDING
Disclosed is a degradable film (1) in which a barrier layer (3) is disposed on a surface of a water-soluble polymer layer (2). The water-soluble polymer layer (2) is made of a water-soluble polymer such as polyvinyl alcohol or polyvinyl pyrrolidone. The barrier layer (3) is made of silicon oxide or silicon oxynitride. The barrier layer (3) is formed on the water-soluble polymer layer (2) by a CVD process with the supply of a raw material gas containing a precursor of a substance that forms the barrier layer (3), an ozone gas with an oxygen concentration of 20 vol % or higher and an unsaturated hydrocarbon gas to the water-soluble polymer layer (2).
MULTI-LAYERED SHEET AND TRANSFER MATERIAL
A multi-layered sheet includes a substrate sheet and a thermally curable layer that is disposed on a surface of the substrate sheet and can be disposed on at least a part of a surface of a mold resin, wherein the thermally curable layer is an uppermost layer of the multi-layered sheet, the thermally curable layer includes a product of active energy ray-curable resin cured or half-cured by active energy ray, and the thermally curable layer has: a thermally reactive group that can react and thermally cure with a material component of the mold resin; and a polysiloxane chain.
MULTI-LAYERED SHEET AND TRANSFER MATERIAL
A multi-layered sheet includes a substrate sheet and a thermally curable layer that is disposed on a surface of the substrate sheet and can be disposed on at least a part of a surface of a mold resin, wherein the thermally curable layer is an uppermost layer of the multi-layered sheet, the thermally curable layer includes a product of active energy ray-curable resin cured or half-cured by active energy ray, and the thermally curable layer has: a thermally reactive group that can react and thermally cure with a material component of the mold resin; and a polysiloxane chain.
Films including a water-soluble layer and a vapor-deposited organic coating
Films including a water-soluble layer and a vapor-deposited organic coating are disclosed. The films can optionally further include a vapor-deposited inorganic layer. The films exhibit enhanced barrier properties.
Films including a water-soluble layer and a vapor-deposited organic coating
Films including a water-soluble layer and a vapor-deposited organic coating are disclosed. The films can optionally further include a vapor-deposited inorganic layer. The films exhibit enhanced barrier properties.
Method for Producing a Layered Structure in a Multi-Component Process
A method for producing a layered structure in a multi-component process includes the steps of: generating a basic substrate composed of a transparent plastic, in particular of polycarbonate, in a first manufacturing step, and coating the basic substrate with a transparent resin layer, in particular composed of polyurethane, in a second manufacturing step.
UV CURABLE WATER BASED POLYELECTROLYTE COMPOSITION AND METHOD FOR PRODUCING POLYELECTROLYTE FILM USING THE COMPOSITION
The present invention relates to a UV curable water-based polyelectrolyte composition and a method for producing a polyelectrolyte film using the same, which provides a polyelectrolyte composition comprising: at least one polyelectrolyte selected from Formulas 1 to 3; an acrylate-based material; a cross-linker; a photoinitiator; and a solvent.
LIQUID-REPELLENT HEAT SEALABLE FILM AND COATING AGENT
The present invention is a liquid-repellent heat sealable film that is excellent in liquid repellency and heat-sealing property, and has durability. The film comprises: a resin layer applied and formed on at least one surface of a substrate; and a large number of oxide microparticles adhered to the surface of the resin layer, wherein, in the resin layer, a plurality of heat-sealable particulate resins is bonded to each other, while maintaining their particulate forms, and is also bonded to the substrate surface to form a projecting and recessed structure, and the oxide microparticles are adhered to the surface of the particulate resin in an exposed state, without being buried.
LIQUID-REPELLENT HEAT SEALABLE FILM AND COATING AGENT
The present invention is a liquid-repellent heat sealable film that is excellent in liquid repellency and heat-sealing property, and has durability. The film comprises: a resin layer applied and formed on at least one surface of a substrate; and a large number of oxide microparticles adhered to the surface of the resin layer, wherein, in the resin layer, a plurality of heat-sealable particulate resins is bonded to each other, while maintaining their particulate forms, and is also bonded to the substrate surface to form a projecting and recessed structure, and the oxide microparticles are adhered to the surface of the particulate resin in an exposed state, without being buried.