A method for manufacturing an environmental-friendly heat shielding film using a non-radioactive stable isotope includes: a substrate layer providing step of providing a substrate layer; and a heat shielding layer forming step of, after the substrate layer providing step, forming, on one surface of the substrate layer, a heat shielding layer containing a non-radioactive stable isotope tungsten bronze compound that does not emit radiation.

The provided technologies provide an implant closure device having a mesh layer formed on a flexible substrate, collectively forming a sealable member, that improves a seal formed over an aperture in a body lumen. The mesh facilitates a faster and more secure adherence of the sealable member to the surrounding edges at the puncture site. Furthermore, the provided technology may promote platelet-capture and encourage localized platelet aggregation at the exposed collagen in the wound edges on the mesh layer. The platelet impregnated mesh layer can facilitate cellular adhesion, enabling the sealable member that is local to the wound opening to act, in essence, as a “biological glue.”

The provided technologies provide an implant closure device having a mesh layer formed on a flexible substrate, collectively forming a sealable member, that improves a seal formed over an aperture in a body lumen. The mesh facilitates a faster and more secure adherence of the sealable member to the surrounding edges at the puncture site. Furthermore, the provided technology may promote platelet-capture and encourage localized platelet aggregation at the exposed collagen in the wound edges on the mesh layer. The platelet impregnated mesh layer can facilitate cellular adhesion, enabling the sealable member that is local to the wound opening to act, in essence, as a “biological glue.”

A transparent wear-resistant film layer, a plastic substrate modification method, and a product are provided, the plastic substrate modification method includes the following steps: bombarding with at least one plastic substrate positioned in a chamber of a PECVD coating device with plasma to clean and activate the at least one plastic substrate, and forming a transparent wear-resistant film layer on the at least one surface of the activated plastic substrate by a plasma enhanced chemical vapor deposition using a siloxane monomer as a reaction raw material.

A process management system virtually segments an extruded resin sheet into individual areas associated with several resin sheets. The individual areas are further virtually segmented into segmented areas. Curvature related information related to a curvature after completion of a heat press processing is acquired for each segmented area for each individual area. In a coating condition per area setting process, coating conditions are set for each segmented area for each individual area in accordance with a curvature based on curvature related information of each segmented area for each individual area. In a coating implementing process, a coating is applied to each segmented area for each individual area based on the coating condition.

A heat-sealable packaging film, comprising a base film mainly comprising polyethylene terephthalate, the base film forming a layer of the packaging film; and a heat seal layer mainly comprising an IPA-modified copolyester; wherein the heat seal layer has been extrusion coated on the base film so that the heat seal layer material forms an exterior, amorphous, and heat- sealable heat seal layer.

Provided herein is a device for forming a conductive film. The device includes a deposition device and an air supply. The deposition device is configured to form a wet film having conductive nanostructures and a fluid carrier on a web. The web is moved in a first direction while forming the wet film. The air supply is disposed at a side of the web and configured to apply an air flow onto the wet film. The air flow is directed onto the wet film in a second direction perpendicular to the first direction to reorient a direction of some conductive nanostructures in the wet film to define reoriented conductive nanostructures.

Provided herein is a device for forming a conductive film. The device includes a deposition device and an air supply. The deposition device is configured to form a wet film having conductive nanostructures and a fluid carrier on a web. The web is moved in a first direction while forming the wet film. The air supply is disposed at a side of the web and configured to apply an air flow onto the wet film. The air flow is directed onto the wet film in a second direction perpendicular to the first direction to reorient a direction of some conductive nanostructures in the wet film to define reoriented conductive nanostructures.

A modified polyamic acid, a preparation method thereof, and a preparation method of a composite film are provided. The modified polyamic acid includes polyamic acid and polyvinylidene fluoride. The modified polyamic acid is formed by introducing polyvinylidene fluoride having good thermal stability, high dielectric constant, excellent piezoelectric, and ferroelectric properties, so the dielectric constant and structural adjustability of the modified polyamic acid are improved.

A method for producing aluminum oxide is provided. The method uses an aluminum-oxide-forming agent containing a partially hydrolyzed aluminum alkyl compound containing an aluminum trialkyl or a mixture thereof, and a solvent. It is thus possible to produce an aluminum oxide thin film or aluminum oxide particles on or in a substrate that is not resistant to polar solvents. A method of producing a polyolefin-based polymer nanocomposite containing zinc oxide particles or aluminum oxide particles using a solution containing a partially hydrolyzed zinc alkyl or a solution containing a partially hydrolyzed aluminum alkyl is also provided. The polyolefin-based polymer nanocomposite contains a polyolefin substrate and zinc oxide particles or aluminum oxide particles, and does not contain a dispersant. The zinc oxide particles or aluminum oxide particles have an average particle size of less than 100 nm.