A flow-coating apparatus is configured to flow-coat a member to be flow-coated with an insulation layer, where the member to be flow-coated includes a first surface and an outer peripheral surface surrounding a periphery of the first surface, the first surface being perpendicular to a vertical direction. The flow-coating apparatus includes a first flow-coating mechanism and a second flow-coating mechanism, where a flow-coating opening of the first flow-coating mechanism faces the first surface and is configured to flow-coat the first surface with the insulation layer; and a flow-coating opening of the second flow-coating mechanism faces the outer peripheral surface and is configured to flow-coat the outer peripheral surface with the insulation layer.

Discontinuous coatings and methods of forming such coatings including transiting a substrate through a vaporization area, providing a reactant vapor comprising at least one vaporized monomer or oligomer to the vaporization area, and chemically reacting the at least one vaporized monomer or oligomer to form a discontinuous layer on the substrate, optionally wherein chemically reacting further includes polymerization. The discontinuous layer may be a patterned, semi-patterned, or random discontinuous layer.

A razor blade comprising a blade substrate with a blade edge substrate portion ending in blade tip. The razor blade is covered by a strengthening coating deposited on the blade edge substrate portion via a deposition process. The deposition process causes a hardness value of the strengthening coating layer to be increased, which, among other factors, allows for a decreased thickness of the blade substrate with coating. The blade substrate with coating has (i) a thickness of between about 1.57 and 2.37 micrometers measured at a distance of about five micrometers from the coating tip, (ii) a thickness of between about 4.62 and 6.74 micrometers measured at a distance of about twenty micrometers from the coating tip, and (iii) a thickness of between about 19.82 and 27.52 micrometers measured at a distance of about one hundred micrometers from the coating tip.

Embodiments relate to improving the adhesion between a base substrate and a resilient material layer. Plasma-enhanced chemical vapor deposition (PECVD) is performed to deposit a silicon compound layer on a base substrate. A resilient material layer is formed on the surface of the silicon compound layer. An object formed by the method may include the base substrate, a silicon compound layer on the base substrate, and the resilient material layer on a surface of the silicon compound layer. By having a silicon compound layer with a surface roughness and thickness, adhesion between the base substrate and the resilient material layer can be significantly improved.

Embodiments relate to improving the adhesion between a base substrate and a resilient material layer. Plasma-enhanced chemical vapor deposition (PECVD) is performed to deposit a silicon compound layer on a base substrate. A resilient material layer is formed on the surface of the silicon compound layer. An object formed by the method may include the base substrate, a silicon compound layer on the base substrate, and the resilient material layer on a surface of the silicon compound layer. By having a silicon compound layer with a surface roughness and thickness, adhesion between the base substrate and the resilient material layer can be significantly improved.