Provided are a display substrate, a preparation method thereof, and a display apparatus. The display substrate includes a substrate, an array structure layer disposed on the substrate, a plurality of emitting units and a plurality of ultrasonic transducers disposed at intervals on a side of the array structure layer away from the substrate, wherein the ultrasonic transducers are disposed between adjacent emitting units, and the array structure layer includes a transducer drive circuit connected to the ultrasonic transducer, and the transducer drive circuit is configured to control the ultrasonic transducer to transmit ultrasonic waves and receive voltage signals generated by the ultrasonic transducer receiving echoes.

An assembly is configured to be coupled to a propagating medium. The assembly includes a first conductive layer including a first set of parallel conductors, a second conductive layer including a second set of parallel conductors, and a piezoelectric material layer between the first conductive layer and the second conductive layer. Different piezoelectric transducer nodes are formed at intersections between the first set of parallel conductors and the second set of parallel conductors.

Embodiments described herein relate to methods and apparatuses for controlling an operation of a vibrational output system and/or an operation of an input sensor system, wherein the controller is for use in a device comprising the vibrational output system and the input sensor system. A controller comprises an input configured to receive an indication of activation or de-activation of an output of the vibrational output system; and an adjustment module configured to adjust the operation of the vibrational output system and/or the operation of the input sensor system based on the indication to reduce an interference expected to be caused by the output of the vibrational output system on the input sensory system.

According to various embodiments, a PMUT device may include a wafer, an active layer including a piezoelectric stack, an intermediate layer having a cavity therein where the intermediate layer is disposed between the wafer and the active layer such that the cavity is adjoining the piezoelectric stack. A via may be formed through the active layer and the intermediate layer to the wafer. A metallic layer may be disposed over the active layer and over surfaces of the via. The intermediate layer may include an interposing material surrounding the cavity, and may further include a sacrificial material surrounding the via. The sacrificial material may be different from the interposing material. The metallic layer may include a first member at least substantially overlapping the piezoelectric stack, a second member extending from the first member to the cavity, and a third member extending into the active layer to contact an electrode therein.

Disclosed are methods of obtaining zero vergence ultrasound waves for providing sonodynamic therapy with ultrasound waves. The method includes coupling a sonodynamic therapy device with an array of flat piezoelectric transducers to a skin surface. A controller is configured to generate an electrical drive signal at a frequency, modulate the drive signal, and drive the transducer with the modulated drive signal at the frequency to produce a zero vergence ultrasound wave to produce an average acoustic intensity sufficient to activate a sonosensitizer in a treatment region without damaging healthy cells in the treatment region.

The present disclosure provides an acoustic transducer, including: a base substrate and a plurality of acoustic transducer elements located on the base substrate. The acoustic transducer element includes: a switch and an acoustic transducer unit. A first terminal of the switch is electrically connected to a control signal line, and a second terminal of the switch is electrically connected to the acoustic transducer unit located in the same acoustic transducer element as the switch. The switch is configured to control connection and disconnection between the acoustic transducer unit located in the same acoustic transducer element as the switch and the control signal line. An embodiment of the present disclosure further provides a method for manufacturing the acoustic transducer.

An ultrasonic inspection device according to an embodiment includes: an ultrasonic transducer which includes at least one oscillator group having a plurality of oscillators in a plurality of regions, each region disposing at least one oscillator; a selector which selects at least one region having one or more of the oscillators to be driven from among the plurality of regions; and a driver which individually drives one or more of the oscillators of the at least one region being selected.

Provided is a vibration system using sound. More particularly, the present invention relates to a system which is capable of generating vibration using sound so that the beats of the sound may be felt, is convenient to carry or move due to a lightweight and compact size thereof, is capable of generating vibration matching a beat of sound to which a user is currently listening, is capable of generating vibrations matching various feelings according to beats of sound on the basis of user setting, thereby greatly enhancing effects that the user may feel, and is very inexpensive to manufacture.

Methods of treating tumors by administering compounds to a patient are provided. Compounds such as pro drugs, e.g., 5-aminolevulinic acid (5-ALA), may be administered to the patient orally, by injection, intravenously, or topically, which then accumulate preferentially as compounds such as protoporphyrin IX (PpIX) in tumor cells. After such accumulation, compounds such as PpIX are then activated in various aspects to treat tumors cells, thereby treating cancer. Cancers such as glioblastoma may be treated.

Ultrasonic sensing approaches are described with integrated MEMS-CMOS implementations. Embodiments include ultrasonic sensor arrays for which PMUT structures of individual detector elements are at least partially integrated into the CMOS ASIC wafer. MEMS heating elements are integrated with the PMUT structures by integrating under the PMUT structures in the CMOS wafer and/or over the PMUT structures (e.g., in the protective layer). For example, embodiments can avoid wafer bonding and can reduce other post processing involved with conventional manufacturing of PMUT ultrasonic sensors, while also improving thermal response.