B06B1/0292

SILICIDE CAPACITIVE MICRO ELECTROMECHANICAL STRUCTURE AND FABRICATION METHOD THEREOF
20230116389 · 2023-04-13 ·

The invention provides a silicide capacitive micro electromechanical structure and fabrication method thereof, comprising a substrate, a passivation layer, a silicon layer, a first metal layer, and a dielectric layer. The passivation layer is formed on the substrate; the silicon layer and the first metal layer are formed on the passivation layer. The first metal layer includes a contact part and a conductive part. The contact parts contact at least a part of the silicon layer, and the conductive portion extends away from the silicon layer to electrically connect an external circuit. The dielectric layer is formed on the passivation layer, and at least the silicon layer and the first metal layer are covered by the dielectric layer. After an annealing process is performed, the conductive portion remains in contact with the silicon layer after the silicidation reaction to maintain an electrical connection with the external circuit.

FREQUENCY-TUNABLE ULTRASONIC DEVICE
20220314274 · 2022-10-06 ·

An ultrasonic device, comprising an ultrasonic transducer (400) comprising: a membrane (405) suspended above a cavity (403) arranged on the upper surface side of a substrate (401); a piezoelectric layer (407) attached to a surface of the membrane (405); a first electrode (E1) arranged on the lower surface side of the cavity (403); and a second electrode (E3) arranged on the upper surface side of the cavity (403), in contact with the piezoelectric layer (407), the device further comprising a control circuit (CTRL) connected to the first (E1) and second (E3) electrodes and capable of applying a first control voltage (VDC) on the first electrode (E1), and a second control voltage (VAC) different from the first voltage on the second electrode (E3).

DIELECTRIC ELASTOMER TRANSDUCER

A dielectric elastomer transducer according to the present invention includes a dielectric elastomer layer, and a pair of electrode layers sandwiching the dielectric elastomer layer. The electrode layers contain a binder and carbon black. The carbon black has a particle size distribution as measured by dynamic light scattering in which not less than 95% falls in a range of 0.15 to 8.0 μm. The carbon black has a particle size as measured by laser scattering ranging from 0.4 to 50 μm. The particle size distribution of the carbon black as measured by dynamic light scattering has a first peak that falls in a first range of 0.15 to 1.0 μm and a second peak that falls in a second range of 1.0 μm to 8.0 μm. This structure achieves both stretchability and electrical conductivity of the electrode layers.

MIXED ULTRASOUND TRANSDUCER ARRAYS
20230148869 · 2023-05-18 ·

An ultrasound device may include ultrasound transducer array that include one or more array elements of a first type and one or more array elements of a second type different from the first type. The first type may include a transducer configured to transmit acoustic waves. The second type may include an optical sensor. The array elements of the first and second types are configured to detect acoustic echoes corresponding to the transmitted acoustic waves.

INTERACTIVE DISPLAY DEVICE AND METHOD OF MANUFACTURING SUCH A DEVICE

An optoelectronic device including at least one electromechanical transducer located vertically in line with at least one light-emitting diode, said at least one electromechanical transducer and said at least one light-emitting diode being connected to conductive tracks of a same transfer substrate.

IMAGING DEVICES HAVING PIEZOELECTRIC TRANSCEIVERS WITH HARMONIC CHARACTERISTICS
20220314275 · 2022-10-06 ·

Described are micromachined ultrasonic transducers (MUTs) with convex or concave electrodes, which have enhanced pressure amplitude and frequency response behavior when driven at fundamental and harmonic frequencies, as well as methods of making the same.

Ultrasonic probe and ultrasonic measurement apparatus using the same

An ultrasonic probe includes a semiconductor chip in which an ultrasonic transducer is formed and an electrode pad electrically connected to an upper electrode or a lower electrode of the ultrasonic transducer is provided and a flexible substrate in which a bump electrically connected to the electrode pad is provided and the bump is disposed in a portion overlapping with a stepped portion of the semiconductor chip. Further, a height of a connection surface of the electrode pad of the semiconductor chip connected to the bump is lower than a height of a lower surface of the lower electrode.

Interconnectable ultrasound transducer probes and related methods and apparatus

Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

Getter technology for micromachined ultrasonic transducer cavities

A method of forming an ultrasonic transducer device includes bonding a membrane to seal a transducer cavity with at least a portion of a getter material layer being exposed, the getter material layer comprising a portion of a bilayer stack compatible for use in damascene processing.

Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities

A method of forming an ultrasound transducer device includes bonding a membrane to a substrate so as to form a sealed cavity between the membrane and the substrate. An exposed surface located within the sealed cavity includes a getter material that is electrically isolated from a bottom electrode of the cavity.