B06B1/0292

AN ULTRASOUND TRANSDUCER AND A TILED ARRAY OF ULTRASOUND TRANSDUCERS

An ultrasound transducer has a control circuit with an array of circuit portions, the used ones of which defining a circuit area. cMUT elements are provided over the top of the control circuit. Vias provide a coupling between each cMUT element and a Respective one of the circuit portions beneath. At least some vias are located beneath the bottom electrode of the cMUT element and each via connects to the respective circuit portion at a same position relative to the circuit portion. The array of cMUT elements overlaps at least one side of the circuit area. The fixed via position makes the circuit design simpler, and the overlap enables tiling or else enables a modular design in which different cMUT designs may be used with the same circuit.

THERMAL CONDUCTIVE LAYER FOR TRANSDUCER FACE TEMPERATURE REDUCTION
20230181167 · 2023-06-15 ·

A method and apparatus are disclosed herein for a thermally conductive layer for transducer face temperature reduction in an ultrasound transducer assembly. In one embodiment, the ultrasound transducer assembly comprises: a transducer layer configured to emit ultrasound energy; one or more matching layers overlaying the transducer layer; a thermally conductive layer overlaying the one or more matching layers; and a lens overlaying the thermally conductive layer.

Capacitive transducer and method of manufacturing the same
09834434 · 2017-12-05 · ·

Provided are a capacitive transducer that can make a sealing film thickness necessary to seal a gap smaller and can enhance performance such as a wider bandwidth, and a method of manufacturing the capacitive transducer. The capacitive transducer including cells each including a vibration film including a second electrode that is provided with a gap from a first electrode can be manufactured in the following manufacturing method. A convex part is formed on the first electrode, a sacrifice layer having a thickness larger than the thickness of the convex part is formed on the first electrode and the convex part, and a membrane is formed on the sacrifice layer. Further, an etching hole is formed in the membrane at a position above the convex part, the sacrifice layer is etched through the etching hole, and the etching hole is sealed by a sealing layer.

Method for acoustic power scalable charge-redistribution ultrasonic system with on-chip aberration compensation for portable ultrasonic applications

The present disclosure is generally directed to a method for driving an ultrasonic transducer. The method includes coupling a driving electrode and a ground electrode of the ultrasonic transducer to a power supply and a ground, respectively, during a first time period based on a received drive signal. The method further includes decoupling the driving electrode and the ground electrode of the ultrasonic transducer from the power supply and the ground, respectively, to float the driving electrode and the ground electrode of the ultrasonic transducer during a second time period based on the received drive signal to store a charge between the driving electrode to the ground electrode.

Capacitive micro-machined transducer and method of manufacturing the same

The present invention relates to a method of manufacturing a capacitive micro- machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectric film (20) on the first electrode layer (10), depositing a sacrificial layer (30) on the first dielectric film (20), the sacrificial layer (30) being removable for forming a cavity (35) of the transducer, depositing a second dielectric film (40) on the sacrificial layer (30), depositing a second electrode layer (50) on the second dielectric film (40), and patterning at least one of the deposited layers and films (10, 20, 30, 40, 50), wherein the depositing steps are performed by Atomic Layer Deposition. The present invention further relates to a capacitive micro-machined transducer (100), in particular a CMUT, manufactured by such method.

UNIVERSAL ULTRASOUND DEVICE AND RELATED APPARATUS AND METHODS

A processing device is coupled to a single ultrasound device having a single array of capacitive micromachined ultrasound transducers (CMUTs). The processing device generates a graphical user interface (GUI) having user selectable GUI menu options corresponding to respective ultrasound operating modes for the single ultrasound device having the single ultrasound transducer array. The user-selectable GUI menu options include GUI menu options labeled as representing an ultrasound operating mode for musculoskeletal imaging, breast imaging, carotid imaging, vascular imaging, and abdominal imaging, respectively. The processing device further receives, via the GUI, user input indicating selection of one of the ultrasound operating modes, and in response to receiving the user input, provides an indication to the single ultrasound device having the single array of CMUTs to operate in the selected ultrasound operating mode.

AN ULTRASOUND TRANSDUCER AND A TILED ARRAY OF ULTRASOUND TRANSDUCERS

An ultrasound transducer has a control circuit with an array of circuit portions which together define a circuit area. cMUT elements are provided over the top of the control circuit. Vias provide a coupling between each cMUT element and a respective one of the circuit portions beneath. The vias are located at spaces between the cMUT elements and connect to the circuit portion beneath at a position relative to the shape of the circuit portion. The pitch of the array is greater than the pitch of the circuit portions in at least one direction of the array such that in said at least one direction, the cMUT elements extend beyond one or both sides of the circuit rea. This makes tiling easier and enables a modular design.

Equalization for matrix based line imagers for ultrasound imaging systems

Disclosed herein are ultrasonic transducer systems comprising: an ultrasonic imager comprising a plurality of pMUT transducer elements; and one or more circuitries connected electronically to the plurality of transducer element, the one or more circuitries configured to enable: pulse transmission and reception of reflected signal for the ultrasonic transducer, where inductors are used to equalize impedance to obtain greater pressure output. Also disclosed are methods of altering a pressure of an ultrasonic wave emitted by an ultrasonic transducer.

ELECTROMECHANICAL TRANSDUCER AND METHOD OF PRODUCING THE SAME
20170333945 · 2017-11-23 ·

A method of producing an electromechanical transducer includes forming an insulating film on a first electrode, forming a sacrificial layer on the insulating film, forming a first membrane on the sacrificial layer, forming a second electrode on the first membrane, forming an etching-hole in the first membrane and removing the sacrificial layer through the etching-hole, and forming a second membrane on the second electrode, and sealing the etching-hole. Forming the second membrane and sealing the etching-hole are performed in one operation.

FLEXIBLE VIBRATION CUSHION AND CONTROL METHOD FOR DRIVING THE SAME

Disclosed are a flexible vibration cushion and a method of controlling the same. The flexible vibration cushion may include a cover member, a first soft filler material filled in the cover member; and a vibration generation device including components made of a soft material and disposed in the soft filler. The vibration generation device is configured to generate vibration as an electrostatic force is repeatedly generated and released. The vibration generation device may be applied in a vehicle part, e.g., headrest, thereby minimizing the foreign body sensation acting on the user’s skin while delivering soft and various senses of vibrations to the user.