An imaging assembly for an intraluminal device is provided. In one embodiment, the imaging assembly includes: an array of ultrasound transducer elements spaced apart by air kerfs; a plurality of buffer elements surrounding the array of ultrasound transducer elements, wherein the plurality of buffer elements are spaced apart by gaps; and a sealing material filling portions of the gaps between the plurality of buffer elements.

A radial type ultrasound transducer is arranged in an ultrasound endoscope including a bending portion on a distal end side of an insertion portion. The ultrasound transducer includes: a plurality of piezoelectric elements arranged at predetermined intervals in a circumferential manner and configured to transmit and receive ultrasound waves; a plurality of electrodes arranged in the respective piezoelectric elements; and a flexible printed circuit electrically connected to each of the electrodes. The flexible printed circuit includes a plurality of wires that extend such that at least parts of the wires cross a direction perpendicular to an arrangement direction of the piezoelectric elements, and the plurality of wires are electrically connected to the respective electrodes of the piezoelectric elements at positions where at least parts of the wires cross the direction perpendicular to the arrangement direction of the piezoelectric elements.

Disclosed herein is an ultrasonic probe including a piezoelectric layer, a matching layer disposed at an upper portion of the piezoelectric layer, a conductive member disposed at a lower portion of the piezoelectric layer, a second connector coupled to at least one side of the conductive member, and a printed circuit board coupled to a side of the second connector and electrically coupled to the second connector. A printed circuit board is disposed outside a laminated structure of the acoustic element so that the printed circuit board can be prevented from affecting acoustic characteristics of the ultrasonic probe, a failure in a process of manufacturing the ultrasonic probe that occurs due to a change in temperature or humidity can be prevented, and the manufacturing process can be relatively simplified.

A system, method, and apparatus for reducing ringing effects associated with a transducer comprises a transducer body, a transducer cap, a piezoelectric element formed in the cap, and a damping material formed around the piezoelectric element wherein the damping material suppresses a ringing effect associated with the transducer, while an O-ring is used together with damping material to support high pressure applications up to 230 bars.

An ultrasonic sensor includes a vibration plate that includes a vibration portion and is formed of a resin; a wall portion that is provided on the vibration plate, surrounds the vibration portion and is formed of a resin; and a piezoelectric element that is provided in the vibration portion of the vibration plate. Accordingly, the wall portion surrounding the vibration portion can suppress a frequency variation of an ultrasonic wave output from the ultrasonic sensor and can deform the ultrasonic sensor into a shape corresponding to a surface of an object having various shapes.

A vibration device includes a light-transmitting body that is located on a subject side of an imaging element, a cylindrical body that includes a first end portion, a second end portion on the opposite side from the first end portion, and an outer surface and an inner surface that connect the first end portion and the second end portion to each other, the cylindrical body being connected to the light-transmitting body and holding the light-transmitting body on the first end portion side thereof, and a piezoelectric element provided along a circumferential direction of the cylindrical body and that torsionally vibrates the cylindrical body.

An ultrasonic device includes: a substrate provided with a first opening and a second opening; a support film that is provided on the substrate and blocks the first opening and the second opening; a transmitting piezoelectric film that is provided at a position of the support film which overlaps the first opening when viewed in a thickness direction of the substrate, and that is interposed between a pair of electrodes in the thickness direction of the substrate; and a receiving piezoelectric film that is provided at a position of the support film which overlaps the second opening when viewed in the thickness direction of the substrate, and that is interposed between a pair of electrodes in the thickness direction of the substrate. In the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is larger than a thickness dimension of the receiving piezoelectric film.

A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

An ultrasonic probe includes: a piezoelectric element that is used for transmitting and receiving ultrasonic waves; a signal electrode that is disposed at a rear surface side of the piezoelectric element; and a backing that is disposed at a rear surface side of the signal electrode, wherein the backing has a thermal resistance of 8 K/W or less, and the backing attenuates an ultrasonic wave with the lowest frequency by 10 dB or more, among frequencies at which transmittance and reception sensitivity of the ultrasonic probe is decreased from the maximum value thereof by 20 dB.

An ultrasound system, probe and method are provided. The ultrasound system includes a transducer with piezoelectric transducer elements polarized in a poling direction. A bipolar transmit circuit is configured to generate a transmit signal having first and second polarity segments. The first and second polarity segments have corresponding first and second peak amplitudes. A bias generator is configured to generate a bias signal in a direction of the poling direction. The bias signal is combined with the transmit signal to form a biased transmit signal that is shifted in the direction of the poling direction and still includes both of positive and negative voltages over a transmit cycle.