A capacitive micromachined ultrasonic transducer includes an element. The element includes a plurality of cells. First electrodes in the plurality of cells are electrically connected together to form a first common electrode, and second electrodes in the plurality of cells are electrically connected together to form a second common electrode. The first common electrode and the second common electrode are opposed to each other only in an area with the gap therebetween. An area of the element with the first common electrode is wider than an area of the element without the first common electrode.

An ultrasonic device is provided. The ultrasonic device includes at least one micromachined ultrasonic transducer (MUT) and processing circuitry electrically coupled to the at least one MUT. The at least one MUT and the processing circuitry are packed in an embedded wafer level ball grid array (eWLB) package. An acoustic coupling medium for acoustic coupling of the at least one MUT to an external application surface is formed on the at least one MUT.

Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.

A signal generator generates an electrical signal that is sent to an amplifier, which increases the power of the signal using power from a power source. The amplified signal is fed to a sender transducer to generate ultrasonic waves that can be focused and sent to a receiver. The receiver transducer converts the ultrasonic waves back into electrical energy and stores it in an energy storage device, such as a battery, or uses the electrical energy to power a device. In this way, a device can be remotely charged or powered without having to be tethered to an electrical outlet.

A signal generator generates an electrical signal that is sent to an amplifier, which increases the power of the signal using power from a power source. The amplified signal is fed to a sender transducer to generate ultrasonic waves that can be focused and sent to a receiver. The receiver transducer converts the ultrasonic waves back into electrical energy and stores it in an energy storage device, such as a battery, or uses the electrical energy to power a device. In this way, a device can be remotely charged or powered without having to be tethered to an electrical outlet.

Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.

Methods and systems are provided for an ultrasound probe including a piezoelectric micromachined ultrasonic transducer including a first top electrode, a second top electrode, and a bottom electrode. The ultrasound probe further includes a transmitter/receiver configured to apply a single drive signal to the bottom electrode and a bias circuit configured to apply a first voltage bias to the first top electrode and to apply a second voltage bias to the second top electrode.

The present disclosure provides an acoustic transducer unit and a manufacturing method thereof, and an acoustic transducer, the acoustic transducer unit includes: a base substrate; a first electrode on the base substrate; a support pattern on a side of the first electrode away from the base substrate, which is enclosed into an accommodation groove, at least one release groove and at least one connection groove, an orthographic projection of the release groove on the base substrate is spaced apart from that of the accommodation groove on the base substrate, the connection groove is between the accommodation groove and the release groove to communicate them; a diaphragm pattern on the side of the first electrode away from the base substrate and capable of vibrating in the accommodation groove; a filling pattern in the release groove; a second electrode on a side of the diaphragm pattern away from the base substrate.

The present disclosure provides a transducer unit and a manufacturing method thereof, and a transducer, the transducer unit includes: a base substrate; a first electrode on the base substrate; a support pattern on a side of the first electrode away from the base substrate, which is enclosed into an first groove, at least one second groove and at least one third groove, an orthographic projection of the second groove on the base substrate is spaced apart from that of the first groove on the base substrate, the third groove is between the first groove and the second groove to communicate them; a diaphragm pattern on the side of the first electrode away from the base substrate and capable of vibrating in the first groove; a filling pattern in the second groove; a second electrode on a side of the diaphragm pattern away from the base substrate.

A miniature rangefinder includes a housing, a micromachined ultrasonic transducer, and signal processing circuitry. The housing includes a substrate and a lid. The housing has one or more apertures and the micromachined ultrasonic transducer is mounted over an aperture. The micromachined ultrasonic transducer may function as both a transmitter and a receiver. An integrated circuit is configured to drive the transducer to transmit an acoustic signal, detect a return signal, and determine a time of flight between emitting the acoustic signal and detecting the return signal.