A portable ultrasonic imaging probe that is adapted to connect to a host computer via a passive interface cable. The probe includes an array of ultrasound transducers, a high voltage pulser for energizing transducers to emit an ultrasound pulse, analog signal processing circuitry that combines echoes detected by transducers into a single analog echo signal, am analog-to-digital converter that converts the analog echo signal into a digital echo signal; and interface circuitry that transfers the digital echo signal across the passive interface cable to the host computer. The probe includes transmit switches configured to selectively connect sets of ultrasound transducers to the HV pulser and a plurality of receive switches configured to selectively connect sets of ultrasound transducers to the analog signal processing circuitry.

A high output and high reliability capacitive micromachined ultrasonic transducer (CMUT) is provided. The capacitive micromachined ultrasonic transducer has a concave portion on a surface of at least one insulating film. The surface faces an air gap.

A capacitive micro-machined ultrasonic transducer, CMUT, device in which integrated probe circuitry includes both the ultrasound transmission and reception circuitry and a DC-DC converter for generating a bias voltage for the CMUT cell. The high voltage pulses of a pulser circuit and a high voltage DC bias voltage are both generated by a single probe circuit, which is local to the CMUT cell.

Methods and apparatus for ultrasound imaging using ultrasound sensor elements comprising thin film transistors. Specifically, ultrasound elements for use in a two dimensional array of ultrasound elements, two dimensional arrays of ultrasound elements, ultrasound sensor element array assemblies, ultrasound imaging devices and methods of performing an ultrasound scan using a two dimensional array of ultrasound elements. A sensor element comprises: an ultrasound transducer, a transmit circuit configured to provide an electrical signal to the transducer for output of an ultrasound signal; and a receive circuit configured to receive an electrical signal from the transducer, based on a received reflected ultrasound signal, wherein the transmit and receive circuits each comprise one or more thin film transistors.

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.

Disclosed is an ultrasound probe (10) including an array (110) of CMUT (capacitive micromachined ultrasound transducer) cells (100), each cell comprising a substrate (112) carrying a first electrode (122) of an electrode arrangement, the substrate being spatially separated from a flexible membrane (114) including a second electrode (120) of said electrode arrangement by a gap (118); an acoustic window (140) over the array of CMUT cells; and a data storage element (150) accessible to an external control module of the ultrasound probe. The data storage element stores configuration information for configuring an operation of the array of CMUT cells in pre-collapse or collapse mode with the external control module to optimize the effective bandwidth of the array. Also disclosed is a calibration method of the ultrasound probe, an ultrasound system and a method of operating the ultrasound system.

A capacitive micromachined ultrasonic transducer (CMUT) and methods of forming the same are disclosed herein. In one implementation, the CMUT comprises a glass substrate having a cavity; a patterned metal bottom electrode situated within the cavity of the glass substrate; and a vibrating plate comprising at least a conducting layer, wherein the vibrating plate is anodically bonded to the glass substrate to form an air-tight seal between the vibrating plate and the substrate and wherein a pressure inside the cavity is less than atmospheric pressure (i.e., a vacuum). In another implementation, the CMUT comprises a glass substrate with Through-Glass-Via (TGV) interconnects, wherein a metal electrode is electrically connected to a TGV and wherein said metal electrode can be in the bottom of a cavity of the glass substrate or on the vibrating plate.

Aspects of this disclosure relate to driving a capacitive micromachined ultrasonic transducer (CMUT) with a pulse train of unipolar pulses. The CMUT may be electrically excited with a pulse train of unipolar pulses such that the CMUT operates in a continuous wave mode. In some embodiments, the CMUT may have a contoured electrode.

An acoustic element integrated circuit includes cells, being arrayed two-dimensionally on a same curved surface, wherein capacitive acoustic-elements having vibration membranes are allocated by unit number in each of the cells. Each of the cells encompasses an intra-cell circuit, which includes an exciting circuit for driving collectively portions by the unit number, the portions having transmitting functions of the acoustic-elements, and a reception circuit for processing collectively received signals transferred from portions by the unit number, the portions having reception functions in the acoustic-elements. Here, the exciting circuits are sorted into a chip in which high-voltage drivers for exciting the vibration membranes are merged and a chip in which circuits operated at voltages lower than the high-voltage drivers are merged, and the cells are operated two-dimensionally, by individually controlling the intra-cell circuits so that cells can be driven independently.

Ultrasonic transmitting elements in an electroacoustical transceiver transmit acoustic energy to an electroacoustical transponder, which includes ultrasonic receiving elements to convert the acoustic energy into electrical power for the purposes of powering one or more sensors that are electrically coupled to the electroacoustical transponder. The electroacoustical transponder transmits data collected by the sensor(s) back to the electroacoustical transceiver wirelessly, such as through impedance modulation or electromagnetic waves. A feedback control loop can be used to adjust system parameters so that the electroacoustical transponder operates at an impedance minimum. An implementation of the system can be used to collect data in a vehicle, such as the tire air pressure. Another implementation of the system can be used to collect data in remote locations, such as in pipes, enclosures, in wells, or in bodies of water.