Patent classifications
B06B2201/72
Wire bonding apparatus
The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (ΔY/ΔX) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.
Ultrasonic horn
An ultrasonic horn is provided with: a vibration generating unit configured to generate longitudinal vibration having a frequency in the ultrasonic band on the basis of a signal having a frequency in the ultrasonic band input from an oscillator; a vibration amplifying unit configured to amplify the vibration generating unit while transmitting the longitudinal vibration from the vibration generating unit; and a longitudinal-torsional vibration conversion slit unit having slits formed in a groove-like shape on the surfaces of the vibration amplifying unit and configured to convert the longitudinal vibration into torsional vibration. The vibration amplifying unit has a polygonal shape in a plane view, and has a plurality of surfaces provided with slits along with a surface not provided with slits.
Ultrasonic vibration unit with damping
The present invention concerns an ultrasonic vibration unit having a converter (1) for converting an electric ac voltage into a mechanical ultrasonic vibration and a sonotrode which is vibrationally coupled to the converter (1), wherein the sonotrode and the converter (1) are matched to each other in such a way that the ultrasonic vibration unit can vibrate with a natural frequency f, in which a standing longitudinal wave having at least one vibration node and at least two vibration antinodes is formed within the ultrasonic vibration unit. To provide an ultrasonic vibration unit in which the parasitic vibrations which usually occur in operation with a working frequency are slight or do not occur, wherein at the same time the actual working frequency is not attenuated, it is proposed according to the invention that there is provided a damp vibration absorber unit (2) connected to the ultrasonic vibration unit by way of a coupling element (3), wherein the coupling element (3) is connected to the ultrasonic vibration unit at a vibration node, wherein the vibration absorber unit (2) is connected to a damping element (4) which is so adapted that it damps a vibration of the vibration absorber unit (2).
Method And Generator For Characterizing An Oscillatory System
The present invention relates to a method for determining at least one physical characteristic value of an electromechanical oscillatory system, which comprises a piezoelectric element and at least one additional element coupled, with respect to oscillation, to the piezoelectric element, the piezoelectric element having an electrode and a counter electrode. The method comprises the following steps: (a) applying an electrical alternating voltage between the electrode and the counter electrode for the duration of an excitation interval in order to induce mechanical oscillation of the oscillatory system or of a sub-system of the oscillatory system, so that after the excitation interval has expired, the oscillatory system or the sub-system performs a free oscillation without excitation, (b) after the end of the excitation and during the free oscillation of the oscillatory system or of the sub-system without excitation: (i) measuring a time curve of a voltage U between the electrode and the counter electrode, or (ii) short-circuiting the electrode and the counter electrode with a line and measuring a time curve of a current I through the line, and (c) determining the at least one physical characteristic value of the electromechanical oscillatory system from the time curve of the voltage U, which time curve was measured in step b) i), or the time curve of the current I, which time curve was measured in step b) ii).
Ultrasonic bonding apparatus, control device and control method
An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.
Ultrasonic processing system, booster and method
An ultrasonic processing system (1) which comprises an ultrasonic vibrator (10) having an ultrasonic sonotrode (30) and a working surface (31) for ultrasonic processing of a workpiece. The vibrator (10) comprises a longitudinal axis (L), an enclosed cavity (32, 51) extends along the longitudinal axis at least in the sonotrode (30), a medium inlet (52) through which a cooling medium is fed into the cavity (32, 51), at least one vortex generator (53) which arranged between the medium inlet (52) and the cavity (32, 51) such that a swirl motion of the medium is generated inside the cavity (32, 51) around the longitudinal axis. A cooling channel (34) is fluidly connected to the enclosed cavity (32, 51) to guide the medium in the vicinity of the working surface (31) such that the working surface (31) is cooled. A first medium outlet (33) is fluidly connected to the cooling channel (34).
ULTRASONIC WELDING SYSTEM
The present invention concerns an ultrasonic welding installation comprising an ultrasonic vibration unit having a sonotrode and a converter, wherein the sonotrode and the converter are arranged in mutually adjacent relationship along a longitudinal axis and the ultrasonic vibration unit can be caused to resonate with an ultrasonic vibration in the direction of the longitudinal axis with a wavelength λ/2, wherein there is provided a holder for holding the ultrasonic vibration unit. To provide an ultrasonic welding installation which allows simple and quick highly precise adjustment of the sealing surfaces of the sonotrode relative to the anvil it is proposed according to the invention that the holder has an angle positioning device, wherein the angle positioning device and the ultrasonic vibration unit are of such a configuration that they can be connected together in positively locking relationship so that a rotation of the ultrasonic vibration unit about the longitudinal axis is prevented by the positively locking connection and a relative movement between the ultrasonic vibration unit and the holder in the direction of the longitudinal axis is not prevented.
ULTRASONIC BONDING APPARATUS
An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.
ULTRASONIC BONDING APPARATUS, CONTROL DEVICE AND CONTROL METHOD
An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.
PHASED ARRAY EMAT TRANSDUCER FOR GENERATION OF SHEAR HORIZONTAL WAVES
A system for non-destructive inspection that generates Shear Horizontal waves in phased array configuration using an Electro Magnetic Acoustic Transducer (EMAT). The system includes an EMAT transducer with a plurality of elements made of individually wound elements under a single magnetic field, and an instrument to pulse, receive and record the signals from each element separately. Each wired element in the array generates shear waves perpendicularly to the coil windings which radiate around the elements' long axis. By phasing the pulsing and receiving of the individual elements, the beam can be electronically focused at different angles in the component from 0° to +/−90°. The compact distribution of the array permit using relatively high frequencies without generating deleterious grating lobes.