Patent classifications
B06B2201/76
Vibration transmitting member, ultrasonic treatment instrument and vibrating body unit
A vibration transmitting member transmits ultrasonic vibration generated by an ultrasonic transducer from a proximal side toward a distal side. The vibration transmitting member includes a connection connected to the ultrasonic transducer. When a reference vibration node, which is located most proximally among vibration nodes occurring on the distal side relative to the connection, is defined, while the vibration transmitting member vibrates at a resonance frequency in a predetermined frequency range, a cross-sectional area decreasing part is provided between the connection and the reference vibration node. In the cross-sectional area decreasing part, a cross-sectional area perpendicular to a longitudinal direction gradually decreases from the distal side toward the proximal side.
Systems, methods, and structures for surface acoustic wave-based separation
Aspects of the present disclosure describe systems, methods, and structures for acoustic wave-based separation of particulates in a fluidic flow. Illustrative systems, methods, and structures according to aspects of the present disclosure may advantageously provide for the continuous, label-free, non-invasive separation of the particulates that include—among other types—difficult-to-separate biological particulates and in particular those in blood including circulating tumor cells and micro-blood-borne particles and other subgroups of extracellular vesicles including nanoscale exosomes.
Ultrasonic Device And Ultrasonic Diagnostic Apparatus
An ultrasonic device includes a first substrate including a first surface on which a first electrode coupled to a piezoelectric element is placed, a second substrate including a second surface on which a second electrode is placed, an intermediate substrate placed between the first substrate and the second substrate and including a third surface joined to the first surface and a fourth surface facing the second surface, and a bonding portion, wherein the intermediate substrate has a through hole penetrating from the third surface to the fourth surface and a third electrode provided in the through hole and coupled to the first electrode, the second electrode is coupled to the third electrode and electrically coupled to the first electrode via the third electrode, a plurality of the bonding portions are provided in island shapes apart from one another between the second substrate and the intermediate substrate, and at least one of the bonding portions is provided to surround the third electrode.
ULTRASONIC TRANSDUCER, ULTRASONIC PROBE, ULTRASONIC DIAGNOSTIC APPARATUS, AND METHOD FOR MANUFACTURING ULTRASONIC TRANSDUCER
An ultrasonic transducer includes: a laminate in which a plurality of acoustic members is laminated; and an adhesive layer that includes a silane coupling agent and an adhesive, the adhesive layer joining any two of the plurality of acoustic members to each other, wherein the silane coupling agent has a structure represented by general formula (1):
##STR00001##
wherein R.sub.1s each independently represent a methoxy group or an ethoxy group, R.sub.2 represents a methoxy group, an ethoxy group, or a hydrogen atom, X represents a linear or branched organic chain having 4 or more continuous carbon atoms, and A represents a reactive functional group.
PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP DEVICES
A method of manufacturing an ultrasound imaging device involves forming an interposer structure, including forming a first metal material within openings through a substate and on top and bottom surfaces of the substrate, patterning the first metal material, forming a dielectric layer over the patterned first metal material, forming openings within the dielectric layer to expose portions of the patterned first metal material, filling the openings with a second metal material, forming a third metal material on the top and bottom surfaces of the substrate, and patterning the third metal material. The method further involves forming a packaging structure for an ultrasound-on-chip device, including attaching a multi-layer flex substrate to a carrier wafer, bonding a first side of an ultrasound-on-chip device to the multi-layer flex substrate, bonding a second side of the ultrasound-on-chip device to a first side of the interposer structure, and removing the carrier wafer.
SYSTEMS AND METHODS FOR CONTROLLING DIRECTIONAL PROPERTIES OF ULTRASOUND TRANSDUCERS VIA BIPHASIC ACTUATION
Systems and methods are provided whereby a directional property of an ultrasound transducer element, such as a steering direction, is controlled according to a first driving waveform that is delivered to opposing propagation electrodes and a second driving waveform that is delivered to opposing lateral electrodes. The directional property may be controlled according a phase difference and/or relative amplitude between the first and second driving waveforms, and/or the selective actuation of one or more lateral electrodes when the lateral electrodes are defined in an array. The ultrasound transducer element may be a ring-shaped transducer element and a directional property associated with a focal region may be controlled. In some example embodiments, array elements of an ultrasound transducer array may each include propagation and lateral electrodes, with each array element being driven by respective first and second driving waveforms to focus the ultrasound energy emitted by the ultrasound transducer array.
Electrotherapeutic treatment
Systems and methods for locating, assessing, diagnosing, treating and monitoring of musculoskeletal disorders, soft tissue injuries, pain and other areas of dysfunctional tissue in patients, are provided. In the systems and methods, such assessments and treatments are performed using a combination of electrical stimulation and imaging tools.
Methods and systems for wafer scale transducer array fabrication
Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array may be fabricated via a wafer scale approach, where a first comb structure, with a first type of element, is formed by dicing a first acoustic stack and a second comb structure, with a second type of element, is formed by dicing a second acoustic stack. Combining the first and second comb structures may form a multi-frequency transducer array.
Ultrasound signal processing device that uses synthetic aperture method and delay and sum method
A reception beamformer 140 includes a delay-and-sum unit 142 that performs delay-and-sum processing with respect to reception signal sequences from multiple channels based on reflected ultrasound to calculate acoustic line signal line data. The delay-and-sum unit 142, in first reception beamforming processing, synthesizes the acoustic line signal line data calculated in the delay-and-sum processing by summing acoustic line signals associated with the observation points having the same positions, and, in the second reception beamforming processing, outputs the acoustic line signal data calculated in the delay-and-sum processing as is. Time taken by the delay-and-sum unit 142 to generate the acoustic line signal line data per set of acoustic line signal line data is equal or approximately equal in the first reception beamforming processing and the second reception beamforming processing.
AUSCULTATORY SOUND-OR-VIBRATION SENSOR
A metallic diaphragm disk incorporating a piezoelectric material bonded thereto and operatively coupled to a base rim of a housing provides for closing an open-ended cavity at the first end of the housing. At least one inertial mass is either incorporated in or attached to the housing. A plastic film adhesively bonded to at least one of an outer rim of the housing or an outer-facing surface of the disk provides for receiving an adhesive acoustic interface material to provide for coupling the housing to the skin of a test subject.