A system has a conveyor for carrying at least two categories of scrap particles positioned at random on a surface of the conveyor, with at least some of the particles comprising metal. The system has a sensor array with a series of analog inductive proximity sensors arranged transversely across the conveyor. An active sensing end face of each sensor lies in a sensing plane, and the sensing plane is generally parallel with the surface of the conveyor. A control system of is configured to sample and quantize analog signals from the series of sensors in the array, and locate and classify a scrap particle on the conveyor passing over the array into one of at least two categories of material based on the quantized signals. A method for sorting the particles is also provided.

A system has a conveyor for carrying at least two categories of scrap particles positioned at random on a surface of the conveyor, with at least some of the particles comprising metal. The system has a sensor array with a series of analog inductive proximity sensors arranged transversely across the conveyor. An active sensing end face of each sensor lies in a sensing plane, and the sensing plane is generally parallel with the surface of the conveyor. A control system of is configured to sample and quantize analog signals from the series of sensors in the array, and locate and classify a scrap particle on the conveyor passing over the array into one of at least two categories of material based on the quantized signals. A method for sorting the particles is also provided.

Provided is a method for processing electronic and electrical device component scrap according to an embodiment of the present invention includes a smelting raw material sorting step of sorting a processing raw material containing valuable metals processable in a smelting step from the electronic and electrical device component scrap, wherein the method comprises removing lump copper wire scrap contained in the electronic and electrical device component scrap using a parallel link robot.

Provided is a method for processing electronic and electrical device component scrap according to an embodiment of the present invention includes a smelting raw material sorting step of sorting a processing raw material containing valuable metals processable in a smelting step from the electronic and electrical device component scrap, wherein the method comprises removing lump copper wire scrap contained in the electronic and electrical device component scrap using a parallel link robot.

In accordance with some aspects of the present disclosure, a system is disclosed. The system provides a non-destructive and non-contact test to quantify the cellulose and/or plastic content in a given composite material board sample by the use of capacitive sensors. The system includes a ground plate and a capacitive sensor probe system with programmed instructions to calibrate to a predetermined dielectric, determine, in a composite board placed in between the capacitive sensor and the ground plate, an equivalent thickness of material emitting the predetermined dielectric, and convert the equivalent thickness into a weight percentage of the material in the board.

An online automatic measurement system for a claw-pole overall magnetic property comprising: a feeding part, a claw-pole overall magnetic property measurement unit, and a discharging part disposed in sequence, and a robotic arm disposed there among. The robotic arm receives an operation instruction output by a control unit to grab claw poles to be measured in sequence and removes measured claw poles on the claw-pole overall magnetic property measurement unit. The claw-pole overall magnetic property measurement unit outputs a control power supply to the claw-pole overall magnetic property measurement unit according to the instruction of the control unit, receives an induction current of the measured claw poles, and output a measurement result to the control unit.

An online automatic measurement system for a claw-pole overall magnetic property comprising: a feeding part, a claw-pole overall magnetic property measurement unit, and a discharging part disposed in sequence, and a robotic arm disposed there among. The robotic arm receives an operation instruction output by a control unit to grab claw poles to be measured in sequence and removes measured claw poles on the claw-pole overall magnetic property measurement unit. The claw-pole overall magnetic property measurement unit outputs a control power supply to the claw-pole overall magnetic property measurement unit according to the instruction of the control unit, receives an induction current of the measured claw poles, and output a measurement result to the control unit.

A method of sorting an electronic device includes receiving first data generated by a test tool that is performing a test operation on the electronic device according to a test program, and a provisional binning assignment for the electronic device determined from the first data. The method also includes defining a permanent binning assignment for the electronic device based at least in part on applying a first algorithm and a second algorithm to the first data, the first algorithm and the second algorithm being different. The method further includes outputting the permanent binning assignment so that after the test operation is completed, the electronic device is removed from the test tool and placed in one of a plurality of bins according to the permanent binning assignment.

A method of sorting an electronic device includes receiving first data generated by a test tool that is performing a test operation on the electronic device according to a test program, and a provisional binning assignment for the electronic device determined from the first data. The method also includes defining a permanent binning assignment for the electronic device based at least in part on applying a first algorithm and a second algorithm to the first data, the first algorithm and the second algorithm being different. The method further includes outputting the permanent binning assignment so that after the test operation is completed, the electronic device is removed from the test tool and placed in one of a plurality of bins according to the permanent binning assignment.

A transfer device, for transferring components at high speed and inspecting the components, includes a first transfer mechanism including a first transfer section including a first transfer surface that moves along a first transfer path connecting a loading position to a delivery position, and a second transfer mechanism including a second transfer section that moves along a second transfer path connecting a receiving position spaced from the delivery position by a first distance to a discharging position. The second transfer section includes a second transfer surface that continuously rotates about a rotation axis along the second transfer path. A moving direction of the first transfer surface at the delivery position intersects a moving direction of the second transfer surface at the receiving position in a plan view of the first transfer surface. The second transfer mechanism includes a generator that generates an attraction force toward the second transfer surface.