A method for cleaning a substrate includes the following: exposing the substrate to a cleaning agent to remove impurities on a surface of the substrate; exposing the substrate to a dewetting chemical agent in a liquid phase to remove the cleaning agent on the surface of the substrate; solidifying the dewetting chemical agent in the liquid phase remaining on the surface of the substrate to obtain the dewetting chemical agent in a solid phase; and sublimating and removing the dewetting chemical agent in the solid phase.

A liquid tank for a base station includes a first liquid storage structure and a second liquid storage structure. The second liquid storage structure is positioned in the first liquid storage structure. The second liquid storage structure is flexible and variable in volume. A space is defined between a structural wall of the first liquid storage structure and a structural wall of the second liquid storage structure and is configured to store liquid. The first liquid storage structure includes an anti-sticking structure. The anti-sticking structure is positioned on a bottom surface of the first liquid storage structure facing the second liquid storage structure.

The present disclosure relates to an integrated chip (IC) processing tool having a die exchanger configured to automatically transfer a plurality of IC die between a die tray and a die boat, and an associated method. The integrated chip processing tool has a die exchanger configured to receive a die tray comprising a plurality of IC die. The die exchanger is configured to automatically transfer the plurality of IC die between the die tray and a die boat. An IC die processing tool is configured to receive the die boat from the die exchanger and to perform a processing step on the plurality of IC die within the die boat. By operating the die exchanger to automatically transfer IC die between the die tray and the die boat, the transfer time can be reduced and contamination and/or damage risks related to a manual transfer of IC die can be mitigated.

Disclosed is a method of adjusting a concentration of a chemical liquid in a treatment liquid, the method including: treating a substrate by supplying a treatment liquid stored in a main tank from a nozzle in a heated state to the substrate, and recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank, and then reusing the recovered treatment liquid, a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and the concentration adjustment operation is performed by discharging the treatment liquid in a heated state from the nozzle to evaporate a part of the diluting solution, and recovering the discharged treatment liquid to the main tank.

According to the present disclosure, both first and second cup bodies are brought into a state of being close to each other by lifting one of the first and second cup bodies. A first gap between a gap forming portion formed on the lower surface of a first protruding portion and the upper surface of a second protruding portion is narrower than a second gap between a portion of the first protruding portion where the gap forming portion is absent, and the upper surface of the second protruding portion. In this state, a cleaning liquid is supplied to the second gap. Since movement of the cleaning liquid that tends to flow radially outward is restricted by the first narrow gap, the entire area between the first and second protruding portions may be filled with the cleaning liquid so that the surface to be cleaned may be evenly cleaned.

An endoscope cleansing accessory is described for use with an automatic endoscope reprocessing (AER) apparatus which utilizes the motive force provided by a flowing cleansing fluid already within the AER to actuate an actuator wheel of the endoscope during the cleansing process. The movement or actuation of the actuator wheel during cleansing in turn imparts a back and forth motion to an elevator platform or forceps raiser within the endoscope to loosen tissue and other particles that are then flushed out by the flowing cleansing fluid.

A system for and method of removing residues, deposits, and debris from a substrate that has been marked by a chemical etching process is disclosed. The system includes one or more upper sprayers that deposit a cleaning solution to a top surface of the product as it passes beneath the one or more upper sprayers. The system further includes at least one upper brush that operates to scrub the top surface of the product after the cleaning solution has been applied thereto. The system optionally includes one or more lower sprayers and lower brushes to clean a bottom surface of the product as it is conveyed through the system. The system further includes an air knife system that assists with drying the product prior to exiting the system. The system further includes a controller that is operable to adjust various system parameters.

A cleaning system for processing a substrate after polishing includes a sulfuric peroxide mix (SPM) module, at least two cleaning elements, and a plurality of robots. The SPM module includes a sulfuric peroxide mix (SPM) cleaner having a first container to hold a sulfuric peroxide mix liquid and five to twenty first supports to hold five to twenty substrates in the liquid in the first container, and a rinsing station having a second container to hold a rinsing liquid and five to twenty second supports to hold five to twenty substrates in the liquid in the second container. Each of the at least two cleaning elements are configured to process a single substrate at a time. Examples of a cleaning element include a megasonic cleaner, a rotating brush cleaner, a buff pad cleaner, a jet spray cleaner, a chemical spin cleaner, a spin drier, and a marangoni drier.

Provided is a method of treating a substrate, the method comprising: heating a treatment liquid with a heater unit installed in a circulation line while circulating the treatment liquid in a housing of a tank through the circulation line coupled to the housing to adjust a temperature of the treatment liquid; evaporating water in the treatment liquid in the housing by heating the treatment liquid to a temperature higher than a temperature of water contained in the treatment liquid by the heater unit to adjust a concentration of a chemical liquid contained in the treatment liquid; and supplying the treatment liquid of which the temperature and the concentration are controlled to a substrate to treat the substrate, in which the evaporation of water from the treatment liquid stored in the housing is accelerated by supplying gas to the treatment liquid flowing through the circulation line.

Provided herein is a reductive solution for preventing rouge formation on stainless steel, said solution comprising complexing anions, Fe.sup.2+, and, optionally, one or more pH modifiers. Further provided are methods for manufacturing said solution, methods for prevention of rouge formation on stainless steel surfaces, and related uses of the aforementioned reductive solution.