A pool chemical injector includes a chamber to hold a volume of a chemical therein, the chamber having a body with a tapered end; an opening to allow for insertion of the chemical into the chamber; an elongated tube to attach to the tapered end of the body; a valve engaged with the tube and to open and close chemical flow through the elongated tube; and an attachment to secure to an end of the elongated tube through which the chemical flows; the elongated tube and attachment deliver the chemical to a floor of the pool.

A strainer basket system may include a reservoir in which a strainer basket is positioned and a chemical dispensing docking station. The chemical dispensing docking station may have a cavity that receives a container of chemical to be dispensed and a retention mechanism that is configured to mechanically engage and retain the container of chemical, when inserted into the cavity. The docking station may also include a piercing member positioned to pierce the container of chemical as the container of chemical is inserted into the cavity, thereby releasing chemical into the reservoir and/or strainer basket.

A strainer basket system may include a reservoir in which a strainer basket is positioned and a chemical dispensing docking station. The chemical dispensing docking station may have a cavity that receives a container of chemical to be dispensed and a retention mechanism that is configured to mechanically engage and retain the container of chemical, when inserted into the cavity. The docking station may also include a piercing member positioned to pierce the container of chemical as the container of chemical is inserted into the cavity, thereby releasing chemical into the reservoir and/or strainer basket.

Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.

Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.

A link chain cleaning and lubricating device, and lubricants for use therein.

A link chain cleaning and lubricating device, and lubricants for use therein.

The disclosed technology includes a cleaning device for cleaning personal care tools, such as toothbrushes and shaving razors. The cleaning device can include a heating element configured to heat cleaning fluid received by the cleaning device and a high pressure nozzle configured to output heated cleaning fluid into the cleaning chamber.

The disclosed technology includes a cleaning device for cleaning personal care tools, such as toothbrushes and shaving razors. The cleaning device can include a heating element configured to heat cleaning fluid received by the cleaning device and a high pressure nozzle configured to output heated cleaning fluid into the cleaning chamber.

Exemplary integrated cluster tools may include a factory interface including a first transfer robot. The tools may include a wet clean system coupled with the factory interface at a first side of the wet clean system. The tools may include a load lock chamber coupled with the wet clean system at a second side of the wet clean system opposite the first side of the wet clean system. The tools may include a first transfer chamber coupled with the load lock chamber. The first transfer chamber may include a second transfer robot. The tools may include a dry etch chamber coupled with the first transfer chamber. The tools may include a second transfer chamber coupled with the first transfer chamber. The second transfer chamber may include a third transfer robot. The tools may include a process chamber coupled with the second transfer chamber.