A substrate processing device according to the present embodiment includes a processing tank configured to be capable of accumulating a liquid. A conveyer can array a plurality of semiconductor substrates in such a manner that front surfaces of the semiconductor substrates face a substantially horizontal direction, and transport the semiconductor substrates into the processing tank. A plurality of liquid suppliers can supply the liquid toward an inside of the processing tank from a lower portion of the processing tank. A plurality of current plates are arranged on at least either one end side or the other end side of an array of the semiconductor substrates. The current plates are provided in a first gap region above the semiconductor substrates in gaps between the conveyer and a sidewall of the processing tank on both sides of the conveyer as viewed from an array direction of the semiconductor substrates.

A substrate processing device according to the present embodiment includes a processing tank configured to be capable of accumulating a liquid. A conveyer can array a plurality of semiconductor substrates in such a manner that front surfaces of the semiconductor substrates face a substantially horizontal direction, and transport the semiconductor substrates into the processing tank. A plurality of liquid suppliers can supply the liquid toward an inside of the processing tank from a lower portion of the processing tank. A plurality of current plates are arranged on at least either one end side or the other end side of an array of the semiconductor substrates. The current plates are provided in a first gap region above the semiconductor substrates in gaps between the conveyer and a sidewall of the processing tank on both sides of the conveyer as viewed from an array direction of the semiconductor substrates.

A method of using an ultrasonic system includes positioning at least one component to a ultrasonic system, the ultrasonic system including: an ultrasonic device, comprising a plurality of ultrasonic transducers coupled to a flexible body; a power supply coupled to the ultrasonic device; a fluid vessel configured to supply fluid to the at least one component; and a waste vessel configured to collect the fluid supplied to the ultrasonic device from the fluid vessel. The method includes applying, via the power supply, a current to a plurality of ultrasonic transducers to dislodge a plurality of contaminants from the at least one component. The method includes flushing, via fluid from the fluid vessel, the plurality of contaminants dislodged from the at least one component.

Provided is a bubble sterilizing cleaner capable of automatically sterilizing and objects to be cleaned to be cleaned, such as fruits and vegetables. The bubble sterilizing cleaner includes a bubble supply unit for spraying microbubbles into a cleaning tank and an aeration unit for discharging water or air to the cleaning tank to improve sterilizing and cleaning efficiency and reduce cleaning time, and includes a fluid supply means connected with a water inlet of the cleaning tank and the aeration unit to supply a fluid so that the water supply rate is adjustable in accordance with a condition of an installation location thereof.

An inversion maintenance device has a case, an inverting mechanism, and a control system. The case forms an inversion space. The inverting mechanism has an inverting base and multiple adapting modules. The inverting base is pivotally mounted in the inversion space. The adapting modules are mounted on the inverting base. Each of the adapting modules has an adapting port. The inverting base is capable of inverting to make the adapting port face downward and cover the inversion space. Dental handpieces can be mounted on the adapting modules. The control system has a control module and an operation input terminal. The operation input terminal is electrically connected to the control module and is capable of controlling the control module to inject a working fluid with pressure into the dental handpiece via the adapting module.

An inversion maintenance device has a case, an inverting mechanism, and a control system. The case forms an inversion space. The inverting mechanism has an inverting base and multiple adapting modules. The inverting base is pivotally mounted in the inversion space. The adapting modules are mounted on the inverting base. Each of the adapting modules has an adapting port. The inverting base is capable of inverting to make the adapting port face downward and cover the inversion space. Dental handpieces can be mounted on the adapting modules. The control system has a control module and an operation input terminal. The operation input terminal is electrically connected to the control module and is capable of controlling the control module to inject a working fluid with pressure into the dental handpiece via the adapting module.

A system for treating wash waste liquid is described, configured for coupling to a wash module of a continuous Tunnel washing machine for the field of Preclinical Pharmaceutical Research, said wash module (12) comprising a wash chamber (25), characterized in that it comprises: a wash tub (22) with a side wall (31) substantially cylindrical in shape, with a tangential liquid suction outlet (33) and a substantially conical bottom, with a wash waste drain point (35) at the vertex of the cone, said tangential suction being adapted to generate a rotational motion of the liquid in said tub, said tub being positioned under said wash chamber (25), so as to receive said wash liquid by gravity; a centrifugal wash pump (21) with an open impeller, adapted to take in liquid from said tangential liquid suction outlet (33); an in-line filter (26) with an internal filter cartridge of the “wedge-wire” type, adapted to filter the liquid coming from said centrifugal pump (21) and deliver it back, filtered, into said wash chamber (25), and comprising a flush valve (27) for discharging the filtering waste.

The present disclosure relates to a kit for cleaning biological fluids from a surface. The kit comprises at least one protective article of clothing, absorbent powder, a trash bag, surface sanitizer, an absorbent towel, a scraper, a handle, and a dustpan. The dustpan is configured to be securely coupled to the handle. The dustpan has a lid and a base and can alternate between an open position and a self-sealing closed position. In the closed position the base and lid define an interior volume having a height along a y-axis, a width along an x-axis, and a depth along a z-axis. An adhesive strip is coupled to a lip of the dustpan and is configured to interact with a surface and temporarily engage the dustpan with the surface. The absorbent powder is a mixture of a super absorbent polymer and perlite.

The present disclosure relates to a kit for cleaning biological fluids from a surface. The kit comprises at least one protective article of clothing, absorbent powder, a trash bag, surface sanitizer, an absorbent towel, a scraper, a handle, and a dustpan. The dustpan is configured to be securely coupled to the handle. The dustpan has a lid and a base and can alternate between an open position and a self-sealing closed position. In the closed position the base and lid define an interior volume having a height along a y-axis, a width along an x-axis, and a depth along a z-axis. An adhesive strip is coupled to a lip of the dustpan and is configured to interact with a surface and temporarily engage the dustpan with the surface. The absorbent powder is a mixture of a super absorbent polymer and perlite.

A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.