Contamination of a bottom surface of a substrate caused by a processing liquid used for cleaning a top surface of the substrate can be suppressed. After performing a liquid processing on the top surface of the substrate and a liquid processing on the bottom surface of the substrate in parallel while rotating the substrate by a substrate holding/rotating unit, when stopping the liquid processing on the top surface of the substrate and the liquid processing on the bottom surface of the substrate, a control unit 18 stops a supply of the processing liquid onto the top surface of the substrate by a first processing liquid supply device 73, and then, stops a supply of the processing liquid onto the bottom surface of the substrate by a second processing liquid supply device 71.

The present invention relates to an apparatus for cleaning press rolls for electrodes, comprising two or more cleaning units provided with cleaning members having grains. According to the present invention, the apparatus for cleaning press rolls for electrodes comprises a plurality of, i.e., two or more, cleaning units, wherein the cleaning units respectively comprise cleaning members having grains with different directions, thus allowing a residual cleaning solution and contaminants to be effectively removed. In addition, when press rolls are cleaned using the apparatus for cleaning press rolls according to the present invention, an aqueous cleaning solution and an alcoholic cleaning solution, which have different properties, can be used together, and after cleaning, the cleaning solutions do not remain on the press rolls, and thus subsequently, secondary contamination of electrodes is prevented, and accordingly, when electrodes are manufactured, the occurrence of defects in the electrodes can be reduced.

A method of cleaning wafer-cleaning brushes includes passing a wafer having a first polished main side and an opposing unpolished backside between a pair of substantially cylindrical shaped wafer-cleaning brushes are rotated about an axial direction of the brushes while passing the wafer between the pair of wafer-cleaning brushes. A cleaning solution is applied to the brushes while passing the wafer between the pair of wafer-cleaning brushes. While passing between the pair of brushes, the first polished main side of the wafer faces a first direction, the first direction is an opposite direction to which a polished side of a production wafer faces during a subsequent polished wafer cleaning operation. The substantially cylindrical shaped wafer-cleaning brushes include a plurality of protrusions on an external surface of the brushes, and the brushes contact the wafer at least a portion of time the wafer is passing between the pair of brushes.

A cleaning method that removes contaminants adhering to a stage in a chamber, includes: setting a pressure in a chamber to a predetermined vacuum pressure; supplying a first gas that forms a shock wave toward the stage; and supplying a second gas that does not form the shock wave toward the stage.

A dedusting apparatus removes dust and debris from particulate material flowing over the surface of a wash deck formed with steps and incorporating an air knife engaging the flow of particulate material as the material drops from one wash deck level to another. An ionizing wire is placed at each step on the wash deck so that the air knife blows negative ions from the ionizing wire into the particulate material falling off the step onto the level of wash deck below the ionizing wire. The wash deck is formed with openings to allow air to blow through the wash deck surface and remove dust and debris from the flow of particulate material. The wash deck can be constructed from modules supported on one another in a manner to present an overhang at each step. The wash deck can be formed from a flat pattern as a unitary bent structure.

The present invention discloses a method and an apparatus for spray painting an annular object. The annular object to be spray painted is placed and positioned on a loading tray disposed on a machine station and transported by a transporting mechanism along a spray painting path of the machine station. A self-rotation mechanism is turned on to automatically rotate the loading tray and the annular object to be spray painted. An air gun and a spray gun are turned on to remove dust on a disk surface of the annular object and spray paint the disk surface of the annular object to form a protection layer thereon.

An overhead transport vehicle includes a traveling body that travels on a track on a ceiling of a facility, an upper mast attached to a lower side of the traveling body and including an upper guide, an elevation platform on which an article is placed, and which is guided by the upper guide to ascend or descend along the upper mast, and a lift driver that is provided on the traveling body or on the elevation platform and that drives the elevation platform to ascend or descend. A lower mast is connected to the lower end of the upper mast via a connector in a freely detachable manner and includes a lower guide extending to the upper guide. The elevation platform is able to be lowered along the lower mast from the upper mast by the lift driver.

An automatic machine (2) for processing objects (3) passing in a flow (F) on a conveyor (4) has a selective ejection device (1) with at least one bar (5) with nozzles (6) that is disposed transverse to the direction of said flow (F), after the outlet or tipping end of said conveyor (4), and having an active surface strip (7) that corresponds to the installation region of the outlet openings (6′) of the nozzles (6) of the pneumatic bar (5), this surface strip (7) being situated beneath the conveying plane (4″) of the conveyor (4). This machine has a device (8) for cleaning at least said surface strip (7), this cleaning device (8) having at least one cleaning head (9) that is able to move in translation along the longitudinal axis (AL) of the bar (5) and at least over the entire extent of the installation or overlap region, said or each cleaning head (9) comprising at least one scraping member (10), which moves in contact with at least said surface strip (7), and at least one nozzle for blowing air of which the pressurized jet is directed toward said surface strip (7) and precedes the scraping member (10) during the movement of the mobile cleaning head (9).

A method of removing surface carbon contamination from polycrystalline silicon comprises providing a polycrystalline silicon feed stream having surface carbon contamination, subjecting the polycrystalline silicon to a high velocity fluid selected from gas, gas/liquid mixtures, gas/solid mixtures and gas/solid/liquid mixtures to form a product stream comprising polycrystalline silicon having surface carbon in an amount of less than 200 parts per billion by weight based on weight of the polycrystalline silicon product and/or a reduction in surface carbon contamination of at least 20%. A system for conducting the method comprises an enclosure, a conveyer for moving a polycrystalline silicon feed stream through the enclosure, at least one stream of a high velocity fluid passing through outlets in the enclosure and directed at the feed stream, an ionizing source in the enclosure or integrated with the at least one stream of high velocity fluid, and an exhaust system for the enclosure.

Disclosed is a substrate treating apparatus for treating a substrate with a treating liquid, the apparatus including the following: a rotating member including a plurality of through-holes formed therein; a plurality of support pins attached to the through-holes with a non-sealing structure, and configured to support a substrate in such a manner that the substrate is spaced apart; a supply nozzle configured to supply a treating liquid to the substrate; a cover spaced apart below the rotating member; a rotational drive device configured to drive the rotating member rotationally in a horizontal plane; and a drive device configured to drive the support pins.