A sucker rod cleaning system includes an inductive heating device, a feed mechanism, a first support and a second support. An electromagnet of the inductive heating device includes a wire coil head that is configured to inductively heat a sucker rod positioned within a heating zone. The feed mechanism is configured to feed a sucker rod through the heating zone in a feed direction. The first support is positioned on an upstream side of the wire coil head, and is configured to support a portion of a sucker rod as it is fed through the heating zone by the feed mechanism. The second support is positioned on a downstream side of the wire coil head, and is configured to support a portion of a sucker rod as it is fed through the heating zone by the feed mechanism.

A cleaning method that removes contaminants adhering to a stage in a chamber, includes: setting a pressure in a chamber to a predetermined vacuum pressure; supplying a first gas that forms a shock wave toward the stage; and supplying a second gas that does not form the shock wave toward the stage.

A device for removing dust from closures which are capable of circulating in a chute extending along a longitudinal axis (y-y′), includes a suction system arranged around the chute and are capable of sucking up the dissociated dust from the closures, and including at least one ionization bar extending longitudinally alongside the chute.

A front end conveyor has an upstream end and a downstream end, a lower deck including a plurality of primary sheet supports and an upper deck including a plurality of sheet guides. Upper portions of the primary sheet supports lie in a first plane and the sheet supports and sheet guides define a sheet transport path for moving sheets in a sheet transport direction. A pivotable sheet support extends from an upstream end of the lower deck and has at least one surface lying in a second plane. The pivotable sheet support is pivotable from a first position in which the second plane forms a first angle with the first plane and a second position in which the second plane forms a second angle with the first plane, the second angle being different than the first angle.

A compact cleaning apparatus including a robot with a narrow range of motion is provided. The cleaning apparatus includes: a cleaning chamber; a cleaning station; a drying station; a separation wall; a single axis robot including a column arranged adjacent to a side surface, a linear guide extending vertically, and a vertical moving saddle movable vertically; an arm portion including a first rotation saddle rotatable about a second axis extending vertically, a first arm swingable about a third axis extending horizontally and extending orthogonal to the third axis, a second arm rotatable about a fourth axis orthogonal to the third axis, a second rotation saddle rotatable about a fifth axis orthogonal to the fourth axis, a third rotation saddle rotatable about a sixth axis orthogonal to the fifth axis; and a hand for gripping a workpiece.

A sucker rod cleaning system includes an inductive heating device, a feed mechanism, a first support and a second support. An electromagnet of inductive heating device includes a wire coil head that is configured to inductively heat a sucker rod positioned within a heating zone. The feed mechanism is configured to feed a sucker rod through the heating zone in a feed direction. The first support is positioned on an upstream side of the wire coil head, and is configured to support a portion of a sucker rod as it is fed through the heating zone by the teed mechanism, The second support is positioned on a downstream side of the wire coil head, and is configured to support a portion of a sucker rod as it is fed through the heating zone by the feed mechanism.

The present application provides a dispensing apparatus for processing an electronic component, comprising: a first track component and a second track component, a first flow-guiding component and a second flow-guiding component, the first flow-guiding component being arranged at the top of the first track component, the second flow-guiding component being arranged at the top of the second track component, the first flow-guiding component having at least one first gas inlet and at least one first gas outlet in communication with each other, the at least one first gas inlet being configured to be in communication with a clean gas source, the second flow-guiding component having at least one second gas inlet and at least one second gas outlet in communication with each other, the at least one second gas inlet being arranged facing the first gas outlet, and the at least one second gas outlet being configured to be in communication with a gas discharge motive power apparatus, so that clean gas can flow toward the at least one second gas inlet from the at least one first gas outlet, thereby forming a clean gas region above the electronic component to be processed, to avoid contamination with impurities during processing.

Provided is a substrate treatment apparatus with improved workability. The substrate treatment apparatus includes: a first bath storing a cleaning solution and having a first opening formed in an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and providing ultrasonic waves toward a surface of the cleaning solution exposed by the first opening to form a water film protruding from the surface of the cleaning solution, wherein a substrate is not immersed in the first bath, and a surface of the substrate is placed adjacent to the first opening and cleaned by the water film.

The present invention is a chain cleaning device with a track that guides a chain through a cleaning chamber. The cleaning chamber forms air flow pathways along the sides of the chain. Discharge ports in the chamber ceiling direct a high velocity working air flow spanning the width of the chamber at the upper surfaces of the chain to generate high velocity swirling air flows that progress through the interior openings of the chain and through the pathways along the outer sides of the chain. The compact nature of the cleaning chamber and the close proximity of its walls to the chain maintain the high velocity working and swirling air flows against the various differently oriented surfaces of the chain to remove dirt, grease, grit and grime from the multi-surface chain, including the nooks and crannies where chain plates, pins and rollers come together.

A substrate cleaning method includes: arranging a substrate within a processing container; spraying gas from a spray port of a gas nozzle arranged within the processing container; causing vertical shock waves, generated by spraying the gas from the gas nozzle, to collide with a main surface of the substrate; and removing particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.