A die bonding apparatus includes: a transfer section for transferring a substrate on which a die is to be mounted in a first direction; a cleaning head including a first nozzle, a second nozzle, and a suction aperture; and a drive section that moves the cleaning head in a second direction. The suction aperture first and second sides extend in the first direction in a planar view, and is disposed between blowout openings of the first nozzle and the second nozzle. The blowout opening of the first nozzle extends along the first side of the suction aperture in a planar view, and perpendicularly to a surface of the substrate. The blowout opening of the second nozzle extends along the second side of the suction aperture in a planar view, and aslant toward the suction aperture rather than perpendicularly to the surface of the substrate.

A board cleaning apparatus is provided which removes foreign substances sticking to the surface of a board for fabricating precast concrete articles using a brush which rotates in a horizontal direction, and in which a suction duct is provided to suck dust particles generated when the foreign substances are removed. The board cleaning apparatus includes a feeder unit that feeds a board, a power generator that generates power, and a power transmission that transmits power generated by the power generator, wherein a brush is disposed at a lower end portion of the power generator in a vertical direction from the board.

An apparatus for removing a photoresist layer from at least one alignment mark of a wafer is provided. The apparatus includes a holder, a solvent dispenser, and a suction unit. The holder is used to support the wafer, wherein the alignment mark is formed in a peripheral region of the wafer. The solvent dispenser is used to spray a solvent onto the photoresist layer on the alignment mark of the wafer to generate a dissolved photoresist layer. The suction unit is used to remove the dissolved photoresist layer and the solvent from the wafer through exhausting.

A cleaning apparatus of a carrier for a secondary battery that cleans the carrier transported by a transfer part according to an embodiment of the present invention includes: a main body that includes an entrance through which the transfer part enters and an exit through which the transfer part exits; and a plurality of nozzles installed at the main body to spray a cleaning material cleaning the carrier at the carrier. The plurality of nozzles include: a plurality of first nozzles disposed with their respective centers staggered with respect to an imaginary straight line along a direction from the entrance to the exit; and at least one second nozzle spraying a different cleaning material from a cleaning material sprayed from the plurality of first nozzles.

A method for cleaning a combustion engine using a cleaning apparatus, wherein a cable is coupled to an on-board diagnostic port on the vehicle, and a service hose with a misting nozzle adapter is coupled to a first port on a vehicle. A controller monitors data from the on-board diagnostic port on a vehicle, where the data preferably includes the engine rpm, the catalytic convertor temperature, the engine coolant temperature, the MAF, and the MAP. The controller monitors information from the cleaning apparatus, and the information is processed to adjust the dispensing of the cleaning solution. The adjustment of the cleaning solution can vary the rate, volume, pressure, pulse interval, flow pattern, and duration of the solution in the engine.

Provided are a foreign substance removal method and foreign substance removal device that have excellent continuous operation stability for sheets and excellent foreign substance removal performance, during removal of foreign substance. Suction boxes (3a, 3b) are arranged at a position between two conveyance support bodies (1a, 1b) having an arrangement interval fulfilling prescribed conditions, said position having vertical symmetry relative to the sheet (2). Air is jetted towards the sheet (2) from air nozzles (4a, 4b) arranged inside the suction boxes (3a, 3b). Foreign substances are detached from upon the sheet (2) and the detached foreign substances are recovered using suction air having an average suction airspeed of 0.8-1.2 m/sec from openings (5a, 5b) in the suction boxes (3a, 3b).

The present invention provides methods for cleaning the surface of CMP polishing pads comprising blowing a stream or curtain of forced air or gas from a source onto the surface of a CMP polishing pad substrate at a pressure of from 170 kPa (24.66 psig) to 600 kPa (87 psig), towards a vacuum source, the forced air or gas blowing at an angle of from 6 to 15? from a vertical plane which lies normal to the surface of the substrate, traverses the entire width of the surface of the substrate, and passes through the source of the forced air or gas, while, at the same time conveying along a horizontal plane the CMP polishing pad so that the entire surface of the CMP polishing pad surface is exposed to the forced air or gas at least one time; and, vacuuming the surface of the CMP polishing pad at a point on the surface which is downstream from a point at which the stream curtain of forced air or gas contacts the surface of the CMP polishing pad.

The present invention provides methods for cleaning the surface of CMP polishing pads comprising blowing a stream or curtain of forced air or gas from a source onto the surface of a CMP polishing pad substrate at a pressure of from 170 kPa (24.66 psig) to 600 kPa (87 psig), towards a vacuum source, the forced air or gas blowing at an angle of from 6 to 15? from a vertical plane which lies normal to the surface of the substrate, traverses the entire width of the surface of the substrate, and passes through the source of the forced air or gas, while, at the same time conveying along a horizontal plane the CMP polishing pad so that the entire surface of the CMP polishing pad surface is exposed to the forced air or gas at least one time; and, vacuuming the surface of the CMP polishing pad at a point on the surface which is downstream from a point at which the stream curtain of forced air or gas contacts the surface of the CMP polishing pad.

A sealant detection and ultrasonic cleaning apparatus (100) is provided. The apparatus (100) comprises: a sealant detection part (1), for detecting whether a sealant on an element to be detected is abnormal; and an ultrasonic cleaning part (2), for carrying out ultrasonic cleaning on the element to be detected, which has been detected by the sealant detection part (1). The sealant detection process and the ultrasonic cleaning process are carried out in one apparatus (100), thereby shortening the process flow and reducing a space occupied by devices.

Disclosed is a system for analyzing foreign particulate matter in a cathode material powder. The system includes: a transfer unit including a rotating plate having an upper surface having an edge on which a cathode material powder containing foreign particulate matter is placed and a rotary motor rotating the rotating plate and transferring the cathode material powder along the circular arc direction as the rotating plate rotates; a supply unit supplying the cathode material powder to the upper surface of the rotating plate; a roller unit including a main roller pressing the cathode material powder supplied from the supply unit; an imaging unit imaging the cathode material powder spread in the form of a flat film and transferred along the circular arc direction; and an analysis unit analyzing the image captured by the imaging unit to identify the foreign particulate matter.