Methods, systems, and apparatuses are disclosed for the selective and controlled removal of debris from specific areas of a substrate outer surface without adversely impacting the substrate outer surface, including substrate outer surface coatings, and returning an actual substrate outer surface profile containing affixed debris to a predetermined substrate outer surface profile by comparing a library of predetermined profiles to an actual substrate outer surface profile in real time.

A method for manufacturing boiler tubes includes the steps of removing end caps from a plurality of tubes, the plurality of tubes including at least a first tube and a second tube, cleaning an outer surface of the first tube and the second tube, forming a weld preparation on an upstream end of the first tube, forming a weld preparation on a downstream end of the second tube, welding the upstream end of the first tube to the downstream end of the second tube to form a butt weld, to produce a long tube, and with an automated device, measuring a parameter of at least the first tube and the second tube. The steps of removing the end caps, cleaning the outer surface of the tubes, forming the weld preparations, welding the first tube to the second tube, and measuring the parameter are performed autonomously.

Various embodiments comprise apparatuses and related methods for cleaning a substrate. In one embodiment, an apparatus includes a substrate holder to hold and rotate the substrate at various speeds. An optional inner shield and an optional outer shield, when in a closed position, surround the substrate holder during operation of the apparatus. Each of the inner shield and the outer shield can operate independently in at least one of rotational speed and direction from the other shield. At least one of a front-side laser and a back-side laser are arranged to clean one or both sides of the substrate and edges of the substrate substantially concurrently or independently by impinging a light onto at least one surface of the substrate. A gas flow, combined with a high rotational-speed of the shields and substrate, assists in removing effluents from the substrate. Additional apparatuses and methods of forming the apparatuses are disclosed.

An apparatus for cleaning a surface of an optical window includes a first electrode that is provided inside the optical window and is covered with a dielectric material forming the optical window. A second electrode is provided around the optical window and is exposed on at least one surface of the optical window. A power supply is electrically coupled between the first electrode and the second electrode. The apparatus further includes a controller that controls the power supply so as to generate dielectric barrier discharge along the surface of the optical window by applying a high-frequency or pulsed voltage between the first electrode and the second electrode.

A way of using narrowband irradiation to de-ice or release ice from a surface is provided. The methodology can be applied to a range of different types of de-icing from windshield de-icing to aircraft wing de-icing to releasing ice from the ice tray of an ice making machine. While there are many different specific applications, the concept and methodologies taught remain similar across all of them.

Provided is a mold cleaning system. On the basis of an identification mark assigned to a mold and detected by a mark detector when cleaning the mold, the mold cleaning system obtains shape data for the molding surface of the mold which is stored in a database, and on the basis of the obtained shape data, the mold cleaning system controls the movement of arms using the control device, moves a laser head along the molding surface thereof while irradiating with a laser beam supplied by a laser oscillator, and as a result, removes the dirt adhered to the molding surface.

An ion source comprises an ionising light source arranged to output ionising light for ionising a sample material, an electrode presenting an electrode surface for attracting the ionised sample material and upon which contaminant material is able to accumulate, and an ablating light source arranged to output an ablating light beam or pulse(s) for ablating material of the electrode from the electrode surface. The ablating light beam or pulse(s) does not include said ionising light. A reflector for reflecting the ablating light onto the electrode surface, therewith by a process of ablation a part of the electrode surface is removable from the electrode together with contaminant material when accumulated upon that part.

An extreme ultraviolet (EUV) mask is received. The EUV mask has an EUV pellicle disposed thereover. The EUV pellicle is coupled to the EUV mask at least in part via glue that is disposed on the EUV mask. The EUV pellicle is removed, thereby exposing the glue. A localized glue-removal process is performed by targeting a region of the EUV mask on which the glue is disposed. The localized glue-removal process is performed without affecting other regions of the EUV mask that do not have the glue disposed thereon. The localized glue-removal process may include injecting a cleaning chemical onto the glue and removing a waste chemical produced by the cleaning chemical and the glue. The localized glue-removal process may also include a plasma process that applies plasma to the glue. The localized glue-removal process may further include a laser process that shoots a focused laser beam at the glue.

Various embodiments comprise apparatuses and related methods for cleaning a substrate. In one embodiment, an apparatus includes a substrate holder to hold and rotate the substrate at various speeds. An optional inner shield and an optional outer shield, when in a closed position, surround the substrate holder during operation of the apparatus. Each of the inner shield and the outer shield can operate independently in at least one of rotational speed and direction from the other shield. At least one of a front-side laser and a back-side laser are arranged to clean one or both sides of the substrate and edges of the substrate substantially concurrently or independently by impinging a light onto at least one surface of the substrate. A gas flow, combined with a high rotational-speed of the shields and substrate, assists in removing effluents from the substrate. Additional apparatuses and methods of forming the apparatuses are disclosed.

A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.