According to an embodiment, a substrate processing apparatus includes a mounting unit that includes a mounting table capable of mounting a substrate thereon, and rotates the substrate mounted on the mounting table, a cooling unit that supplies a cooling gas into a space between the mounting table and the substrate through a cooling gas nozzle, and a liquid supply unit that supplies a liquid to a surface of the substrate opposite to a surface of the mounting table. The cooling gas nozzle has at least one first nozzle hole that is inclined in a direction away from a rotational center axis of the substrate as approaching the substrate.

A substrate processing apparatus includes a substrate holder to hold a substrate, a treatment liquid supplier to supply a treatment liquid onto a surface of the substrate to be cleaned, a cooler to supply a cooling medium for cooling the substrate, an impactor to apply an impact to a treatment liquid layer, and a controller. The controller controls the cooler to cool the treatment liquid layer to a temperature lower than a freezing point, and controls the impactor to apply an impact to a starting point of forced freezing located away from a starting point of spontaneous freezing in the treatment liquid layer formed on the surface of the substrate to be cleaned, when a temperature of the treatment liquid layer formed reaches a set temperature that is lower than a freezing point and higher than a temperature at which spontaneous freezing occurs.

A nozzle of a surface cleaning system includes one or more gas channels configured to direct a gas toward a target surface at a low angle relative to the target surface in order to dislodge particles from the target surface; and a vacuum channel configured to apply a vacuum to the target surface for vacuuming the particles away from the target surface.