A glove box for handling harmful material is formed to be lightweight and modular in design, allowing for use in the field and various remote locations where a full laboratory is not available. The tank portion of the glove box is formed of a rigid, lightweight plastic and includes a number of standard-sized passageways for connecting other components (intake filter, exhaust filter, input/output containers, gasketed gloves, etc), allowing for modularity in its configuration. The top portion of the glove box may include a transparent window for viewing the material within the glove box. Filter components utilize HEPA filter elements and a separate, portable power supply is used to control a vacuum fan included in an exhaust filter. The power supply can also be used to perform diagnostic tests on the glove and may include a battery back-up.

A vehicle operated cleaning bin for cleaning a storage grid of a storage system includes a connector suitable for attaching the cleaning bin to a lifting device of a remotely operating vehicle being configured to vertically convey the cleaning bin into the storage grid by aid of the lifting device. Further, the vehicle operated cleaning bin includes a cleaner provided for removing foreign debris from the storage grid.

Disclosed is a substrate treating method of performing dry processing on a pattern-formed surface of a substrate, the substrate treating method comprising: a supplying step of supplying a process liquid containing a sublimable substance to the pattern-formed surface of the substrate; a temperature adjusting step of adjusting a temperature of the substrate so as to control the process liquid supplied to the pattern-formed surface of the substrate within a temperature range equal to or above a melting point of the sublimable substance and below a boiling point thereof; a solidifying step of solidifying, on the pattern-formed surface, the process liquid whose temperature is adjusted so as to form a solidified body; and a sublimating step of subliming the solidified body so as to remove the solidified body from the pattern-formed surface, wherein the temperature adjusting step is performed so as to overlap at least the supplying step and is completed at least before the solidifying step is started.

A solidified body forming step includes: a first step of landing a processing surface of a cooling member on a liquid film to solidify the liquid to be solidified located in an area sandwiched between an upper surface and the processing surface; and a second step of releasing the processing surface from the solidified area solidified in the first step. The processing surface has a lower temperature than a freezing point of the liquid to be solidified. Adhesion between the solidified area and the processing surface is smaller than that between the solidified area and the upper surface.

A method for cleaning a jet engine includes introducing a cleaning medium having solid materials into the engine by way of at least one discharging device, wherein the cleaning medium exits from the discharging device at an exit speed of 80 m/s or less.

A freeze cleaning apparatus includes a table for supporting a processing target substrate having a first surface and a second surface opposite to the first surface, a liquid supply unit positioned to supply a cleaning liquid onto the second surface of the processing target substrate that is placed such that the first surface faces the table, and a cooling gas discharge unit in the table to supply a cooling gas to the first surface side of the processing target substrate. A gap between the table and the processing target substrate is set such that the cooling gas flows as a laminar flow between the table and the processing target substrate.

A substrate processing apparatus according to an embodiment of the present disclosure includes a stage having a substantially disc-shaped form and including a hole in a center thereof; a roller that contacts a side surface of the stage and rotates the stage; a first liquid nozzle that supplies a first liquid to a first surface of the substrate; a first driver that moves a position of the first liquid nozzle; a second liquid nozzle that supplies a second liquid from the hole of the stage to a second surface of the substrate; a second driver that moves a position of the second liquid nozzle; a cooling nozzle that supplies a cooling gas from the hole of the stage to the second surface; a third driver that moves a position of the cooling nozzle; and a controller that controls the first driver, the second driver, and the third driver.

A solidified body forming step includes: a first step of landing a processing surface of a cooling member on a liquid film to solidify the liquid to be solidified located in an area sandwiched between an upper surface and the processing surface; and a second step of releasing the processing surface from the solidified area solidified in the first step. The processing surface has a lower temperature than a freezing point of the liquid to be solidified. Adhesion between the solidified area and the processing surface is smaller than that between the solidified area and the upper surface.

Cleaning systems and methods for semiconductor fabrication use rotatable and translatable chuck assemblies that incorporate a compact drive system to cause chuck rotation. The system uses an offset drive gear that drives a ring gear. This reduces components whose friction or lubricants might generate undue contamination. The low friction chuck functionality of the present invention is useful in any fabrication tool in which a workpiece is supported on a rotating support during a treatment. The chuck is particularly useful in cryogenic cleaning treatments.